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Wired Interface Market - Forecasts From 2018 to 2023

  • ID: 4718394
  • Report
  • 105 pages
  • Knowledge Sourcing Intelligence LLP
UP TO OFF
until Aug 31st 2019
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FEATURED COMPANIES

  • Amphenol Corporation
  • Microchip Technology Inc.
  • Molex, LLC.
  • NXP Semiconductors N.V.
  • ON S
  • STMicroelectronics N.V.
  • MORE
The Wired Interface Market is projected to grow at a CAGR of 12.50% to reach US$33.268 billion by 2023, from US$16.406 billion in 2017. The wired interface technology deals with the transfer of data, power, audio and video with the use of cables. Different types of cables are manufactured based on purpose and security. The wired interface technology market will grow on account of increasing worldwide dependence on electronics such as smartphones, computers, projectors and more. The demand for wired interface technology will also rise because of rising security concerns and higher data transferability advantages that it provides. However, the trend towards the adoption of wireless technology will be a restraining factor for the growth of the wired interface market. The North American region is at a mature stage due to the early adoption of technology. The Asia Pacific region will grow significantly with the improvement in the standard of living resulting in increased demand for smartphones, PCs and other consumer electronics.

This research study examines the current market trends related to the demand, supply, and sales, in addition to the recent developments. Major drivers, restraints, and opportunities have been covered to provide an exhaustive picture of the market. The analysis presents in-depth information regarding the development, trends, and industry policies and regulations implemented in each of the geographical regions. Further, the overall regulatory framework of the market has been exhaustively covered to offer stakeholders a better understanding of the key factors affecting the overall market environment.

Identification of key industry players in the industry and their revenue contribution to the overall business or relevant segment aligned to the study have been covered as a part of competitive intelligence done through extensive secondary research. Various studies and data published by industry associations, analyst reports, investor presentations, press releases and journals among others have been taken into consideration while conducting the secondary research. Both bottom-up and top down approaches have been utilized to determine the market size of the overall market and key segments. The values obtained are correlated with the primary inputs of the key stakeholders in the wired interface value chain. The last step involves complete market engineering which includes analyzing the data from different sources and existing proprietary datasets while using various data triangulation methods for market breakdown and forecasting.

Market intelligence is presented in the form of analysis, charts, and graphics to help the clients in gaining faster and efficient understanding of the Wired Interface market.

Major industry players profiled as part of the report Molex, LLC., Amphenol Corporation, Japan Aviation Electronics Industry, Ltd., TE Connectivity, STMicroelectronics N.V., among others.

Segmentation

The Wired Interface market has been analyzed through following segments:

By Component

Data Transfer Interface

Power Transfer Interface

Audio and Display Interface

Others

By Device

Smartphones and Tablets

Personal Computers and Laptops

Entertainment Devices

Audio and Video Output Devices

External Data Storage Devices

Others

By Geography

North America

USA

Canada

Mexico

Others

South America

Brazil

Argentina

Others

Europe

Germany

France

United Kingdom

Spain

Others

Middle East and Africa

Saudi Arabia

Israel

Others

Asia Pacific

China

Japan

South Korea

India

Others
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Amphenol Corporation
  • Microchip Technology Inc.
  • Molex, LLC.
  • NXP Semiconductors N.V.
  • ON S
  • STMicroelectronics N.V.
  • MORE
1. Introduction
1.1. Market Overview
1.2. Market Definition
1.3. Scope Of The Study
1.4. Currency
1.5. Assumptions
1.6. Base, And Forecast Years Timeline

2. Research Methodology
2.1. Research Design
2.2. Secondary Sources

3. Executive Summary

4. Market Dynamics
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’S Five Force Analysis
4.5.1. Bargaining Power Of Suppliers
4.5.2. Bargaining Power Of Buyers
4.5.3. Threat Of New Entrants
4.5.4. Threat Of Substitutes
4.5.5. Competitive Rivalry In The Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness

5. Wired Interface Market By Component
5.1. Data Transfer Interface
5.2. Power Transfer Interface
5.3. Audio And Display Interface
5.4. Others

6. Wired Interface Market By Device
6.1. Smartphones And Tablets
6.2. Personal Computers And Laptops
6.3. Entertainment Devices
6.4. Audio And Video Output Devices
6.5. External Data Storage Devices
6.6. Others

7. Wired Interface Market By Geography
7.1. North America
7.1.1. USA
7.1.2. Canada
7.1.3. Mexico
7.1.4. Others
7.2. South America
7.2.1. Brazil
7.2.2. Argentina
7.2.3. Others
7.3. Europe
7.3.1. Germany
7.3.2. France
7.3.3. United Kingdom
7.3.4. Spain
7.3.5. Others
7.4. Middle East And Africa
7.4.1. Saudi Arabia
7.4.2. Israel
7.4.3. Others
7.5. Asia Pacific
7.5.1. China
7.5.2. Japan
7.5.3. South Korea
7.5.4. India
7.5.5. Others

8. Competitive Intelligence
8.1. Market Share Analysis
8.2. Recent Investment And Deals
8.3. Strategies Of Key Players

9. Company Profiles
9.1. Molex, Llc.
9.1.1. Company Overview
9.1.2. Financials
9.1.3. Products And Services
9.1.4. Recent Developments
9.2. Amphenol Corporation
9.2.1. Company Overview
9.2.2. Financials
9.2.3. Products And Services
9.2.4. Recent Developments
9.3. Japan Aviation Electronics Industry, Ltd.
9.3.1. Company Overview
9.3.2. Financials
9.3.3. Products And Services
9.3.4. Recent Developments
9.4. TE Connectivity
9.4.1. Company Overview
9.4.2. Financials
9.4.3. Products And Services
9.4.4. Recent Developments
9.5. Stmicroelectronics N.V.
9.5.1. Company Overview
9.5.2. Financials
9.5.3. Products And Services
9.5.4. Recent Developments
9.6. NXP Semiconductors N.V.
9.6.1. Company Overview
9.6.2. Financials
9.6.3. Products And Services
9.6.4. Recent Developments
9.7. Microchip Technology Inc.
9.7.1. Company Overview
9.7.2. Financials
9.7.3. Products And Services
9.7.4. Recent Developments
9.8. Texas Instruments Inc.
9.8.1. Company Overview
9.8.2. Financials
9.8.3. Products And Services
9.8.4. Recent Developments
9.9. Cypress Semiconductor Corporation
9.9.1. Company Overview
9.9.2. Financials
9.9.3. Products And Services
9.9.4. Recent Developments
9.10. On Semiconductor Corporation
9.10.1. Company Overview
9.10.2. Financials
9.10.3. Products And Services
9.10.4. Recent Developments
Note: Product cover images may vary from those shown
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  • Molex, LLC.
  • Amphenol Corporation
  • Japan Aviation Electronics Industry, Ltd.
  • TE Connectivity
  • STMicroelectronics N.V.
  • NXP Semiconductors N.V.
  • Microchip Technology Inc.
  • Texas Instruments Inc.
  • Cypress Semiconductor Corporation
  • ON S
Note: Product cover images may vary from those shown
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