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3D IC and 2.5D IC Packaging Market: Global Industry Analysis, Trends, Market Size, and Forecasts up to 2024

  • ID: 4719922
  • Report
  • Region: Global
  • 100 pages
  • Infinium Global Research
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FEATURED COMPANIES

  • Amkor Technology
  • ASE Group.
  • Broadcom Ltd
  • Intel Corporation.
  • Pure Storage, Inc.
  • STMicroelectronics NV
  • MORE
The report on the global 3D IC and 2.5D IC packaging market provides qualitative and quantitative analysis for the period from 2016 to 2024. The report predicts the global 3D IC and 2.5D IC packaging market to grow with a CAGR of 36% over the forecast period from 2018-2024. The study on 3D IC and 2.5D IC packaging market covers the analysis of the leading geographies such as North America, Europe, Asia-Pacific, and RoW for the period of 2016 to 2024.

The report on 3D IC and 2.5D IC packaging market is a comprehensive study and presentation of drivers, restraints, opportunities, demand factors, market size, forecasts, and trends in the global 3d IC and 2.5D IC packaging market over the period of 2016 to 2024. Moreover, the report is a collective presentation of primary and secondary research findings.

Porter's five forces model in the report provides insights into the competitive rivalry, supplier and buyer positions in the market and opportunities for the new entrants in the global 3D IC and 2.5D IC packaging market over the period of 2016 to 2024. Further, the Growth Matrix gave in the report brings an insight into the investment areas that existing or new market players can consider.

Report Findings

1. Drivers
  • Growing Demand for Smartphones, Tablets, and Gaming Devices
  • Rising Demand for High-end Computing, Servers, and Data Centers
  • Miniaturization of Electronics Devices
  • Higher Availability of Logic Based Packaging
2. Restraints
  • High Cost of 3D IC & 2.5D IC Packages
  • Thermal Issues Related To Higher Level of Integration
3. Opportunities
  • Recent Advanced Technological Developments in 3D IC & 2.5D IC Packaging
Research Methodology

Primary Research

Primary research involves extensive interviews and analysis of the opinions provided by the primary respondents. The primary research starts with identifying and approaching the primary respondents, the primary respondents are approached include:

1. Key Opinion Leaders associated
2. Internal and External subject matter experts
3. Professionals and participants from the industry

Primary research respondents typically include:

1. Executives working with leading companies in the market under review
2. Product/brand/marketing managers
3. CXO level executives
4. Regional/zonal/country managers
5. Vice President level executives.

Secondary Research

Secondary research involves extensive exploring through the secondary sources of information available in both the public domain and paid sources. Each research study is based on over 500 hours of secondary research accompanied by primary research. The information obtained through the secondary sources is validated through the crosscheck on various data sources.

Secondary sources of the data typically include:

1. Company reports and publications
2. Government/institutional publications
3. Trade and associations journals
4. Databases such as WTO, OECD, World Bank, and among others.
5. Websites and publications by research agencies

Segments Covered

The global 3D IC and 2.5D IC packaging market is segmented on the basis of technology, end-user, and application.

The Global 3D IC and 2.5D IC Packaging Market by Technology
  • 3D Wafer-Level Chip-Scale Packaging (WLCSP)
  • 3D TSV
  • 2.5 D
  • Others
The Global 3D IC and 2.5D IC Packaging Market by End-User
  • Consumer Electronics
  • Automotive
  • Military & Aerospace
  • Medical Devices
  • Telecommunication
  • Smart Technologies
  • Industrial Sector
  • Others
The Global 3D IC and 2.5D IC Packaging Market by Application
  • MEMS/Sensors
  • Power, Analog and Mixed Signal, RF, and Photonics
  • Imaging & Optoelectronics
  • Logic
  • Memory
  • LED
  • Photonics
  • RF
  • Others
Company Profiles

The companies covered in the report include:
  • TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION,
  • Amkor Technology
  • ASE Group.
  • Broadcom Ltd
  • United Microelectronics Corporation
  • Intel Corporation.
  • Samsung Electronics Co. Ltd
  • Pure Storage, Inc.
  • Taiwan Semiconductor Manufacturing Company Limited
  • STMicroelectronics NV
  • Jiangsu Changjiang Electronics Technology Co. Ltd
What does this report deliver?

1. Comprehensive analysis of the global as well as regional markets of the 3D IC and 2.5D IC packaging market.

2. Complete coverage of all the segments in the 3D IC and 2.5D IC packaging market to analyze the trends, developments in the global market and forecast of market size up to 2024.

3. Comprehensive analysis of the companies operating in the global 3D IC and 2.5D IC packaging market. The company profile includes analysis of product portfolio, revenue, SWOT analysis and latest developments of the company.

4. Growth Matrix presents an analysis of the product segments and geographies that market players should focus to invest, consolidate, expand and/or diversify.
Note: Product cover images may vary from those shown
2 of 3

FEATURED COMPANIES

  • Amkor Technology
  • ASE Group.
  • Broadcom Ltd
  • Intel Corporation.
  • Pure Storage, Inc.
  • STMicroelectronics NV
  • MORE
1. Preface
1.1. Report Description
1.2. Research Methods
1.3. Research Approaches

2. Executive Summary
2.1. 3D IC and 2.5D IC Packaging Market Highlights
2.2. 3D IC and 2.5D IC Packaging Market Projection
2.3. 3D IC and 2.5D IC Packaging Market Regional Highlights

3. Global 3D IC and 2.5D IC Packaging Market Overview
3.1. Introduction
3.2. Market Dynamics
3.2.1. Drivers
3.2.2. Restraints
3.2.3. Opportunities
3.3. Porter's Five Forces Analysis
3.4. Growth Matrix Analysis
3.4.1. Growth Matrix Analysis by Technology
3.4.2. Growth Matrix Analysis by End-User
3.4.3. Growth Matrix Analysis by Application
3.4.4. Growth Matrix Analysis by Region
3.5. Value Chain Analysis of 3D IC and 2.5D IC Packaging Market

4. 3D IC and 2.5D IC Packaging Market Macro Indicator Analysis

5. Global 3D IC and 2.5D IC Packaging Market by Technology
5.1. 3D Wafer-Level Chip-Scale Packaging (WLCSP)
5.2. 3D TSV
5.3. 2.5 D
5.4. Others

6. Global 3D IC and 2.5D IC Packaging Market by End-User
6.1. Consumer Electronics
6.2. Automotive
6.3. Military & Aerospace
6.4. Medical Devices
6.5. Telecommunication
6.6. Smart Technologies
6.7. Industrial Sector
6.8. Others

7. Global 3D IC and 2.5D IC Packaging Market by Application
7.1. MEMS/Sensors
7.2. Power, Analog and Mixed Signal, RF, and Photonics
7.3. Imaging & Optoelectronics
7.4. Logic
7.5. Memory
7.6. LED
7.7. Photonics
7.8. RF
7.9. Others

8. Global 3D IC and 2.5D IC Packaging Market by Region 2018-2024
8.1. North America
8.1.1. North America 3D IC and 2.5D IC Packaging Market by Technology
8.1.2. North America 3D IC and 2.5D IC Packaging Market by End-User
8.1.3. North America 3D IC and 2.5D IC Packaging Market by Application
8.1.4. North America 3D IC and 2.5D IC Packaging Market by Country
8.2. Europe
8.2.1. Europe 3D IC and 2.5D IC Packaging Market by Technology
8.2.2. Europe 3D IC and 2.5D IC Packaging Market by End-User
8.2.3. Europe 3D IC and 2.5D IC Packaging Market by Application
8.2.4. Europe 3D IC and 2.5D IC Packaging Market by Country
8.3. Asia-Pacific
8.3.1. Asia-Pacific 3D IC and 2.5D IC Packaging Market by Technology
8.3.2. Asia-Pacific 3D IC and 2.5D IC Packaging Market by End-User
8.3.3. Asia-Pacific 3D IC and 2.5D IC Packaging Market by Application
8.3.4. Asia-Pacific 3D IC and 2.5D IC Packaging Market by Country
8.4. RoW
8.4.1. RoW 3D IC and 2.5D IC Packaging Market by Technology
8.4.2. RoW 3D IC and 2.5D IC Packaging Market by End-User
8.4.3. RoW 3D IC and 2.5D IC Packaging Market by Application
8.4.4. RoW 3D IC and 2.5D IC Packaging Market by Sub-region

9. Company Profiles and Competitive Landscape
9.1. Competitive Landscape in the Global 3d IC and 2.5d IC Packaging Market
9.2. Companies Profiles
9.2.1. TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION,
9.2.2. Amkor Technology
9.2.3. ASE Group.
9.2.4. Broadcom Ltd
9.2.5. United Microelectronics Corporation
9.2.6. Intel Corporation.
9.2.7. Samsung Electronics Co. Ltd
9.2.8. Pure Storage, Inc.
9.2.9. Taiwan Semiconductor Manufacturing Company Limited
9.2.10. STMicroelectronics NV
9.2.11. Jiangsu Changjiang Electronics Technology Co. Ltd

10. Appendix
10.1. Primary Research Findings and Questionnaire
Note: Product cover images may vary from those shown
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  • TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION,
  • Amkor Technology
  • ASE Group.
  • Broadcom Ltd
  • United Microelectronics Corporation
  • Intel Corporation.
  • Samsung Electronics Co. Ltd
  • Pure Storage, Inc.
  • Taiwan Semiconductor Manufacturing Company Limited
  • STMicroelectronics NV
  • Jiangsu Changjiang Electronics Technology Co. Ltd
Note: Product cover images may vary from those shown
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