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Advanced Packaging Technologies - Global Market Outlook (2017-2026)

  • ID: 4774570
  • Report
  • Region: Global
  • 168 pages
  • Stratistics Market Research Consulting Pvt Ltd
10% Free customization

This report comes with 10% free customization, enabling you to add data that meets your specific business needs.

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FEATURED COMPANIES

  • 3M Company
  • Bemis Company, Inc.
  • Crown Holdings, Inc.
  • Landec Corporation
  • PakSense Inc.
  • SYSCO Corporation
  • MORE
According to this research, the Advanced Packaging Technology Market is growing at a CAGR of 8.6% from 2017 to 2026. The growth factors include increasing demand for fresh and quality packaged food, manufacturer concern for the longer shelf life of the food products, imminent requirement for size reduction in electronic devices, less power consumption. However, the heating problem in devices restrains the market growth.

Advanced packaging technology is intended to the commercial reality for most integrated-circuit (IC) manufacturers is that node migrations and changes in wafer sizes are slowing down even as capital expenditures are increasing. One way for manufacturers to preserve their edge on their circuits’ small sizes, low costs, and high performance is to incorporate newer chip-packaging options such as 2.5-D integrated circuits (2.5DICs) and 3-D integrated circuits (3.0DICs) into their production processes.

Based on Technology, the active packaging technologies systems anticipated with foods, pharmaceuticals, and several other types of products. They help extend shelf life, monitor freshness, display information on quality, improve safety, and improve convenience. Active packaging involves in having active functions beyond the inert passive containment and protection of the product. Intelligent and smart packaging usually involves the ability to sense or measure an attribute of the product, the inner atmosphere of the package, or the shipping environment.

By Geography, Asia-Pacific is expected to grow at a healthy rate, being a major revenue provoking region during the forecast period, primarily owing to the growing population and the customer-side demand.

Some of the key players include in this market 3M Company, Crown Holdings, Inc., Amcor Limited, PakSense Inc., Thin Film Electronics ASA, CCL Industries Inc., Sealed Air Corporation, Vitsab International AB, Landec Corporation, Timestrip U.K. Ltd., LCR Hallcrest LLC, Bemis Company, Inc., Temptime Corporation, Cryolog S.A., SYSCO Corporation.

Types Covered:
  • Flip Chip
  • 2.5D Integrated Circuit
  • Fan Out Silicon in Package
  • 2D Integrated Circuit
  • 3D Integrated Circuit
  • Flip Chip
  • Wafer Level Chip Scale Package
  • Other Type
Technologies Covered:
  • Smart and Intelligent Packaging
  • Active Packaging
End-Users Covered:
  • Aerospace & Defense
  • Consumer Electronics
  • IT & Telecommunication
  • Industrial
  • Aerospace & Defense
  • Healthcare
  • Automotive & Transport
  • Other End Users
Regions Covered:
  • North America
  • US
  • Canada
  • Mexico
  • Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
  • Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
  • South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
  • Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa
What the report offers:
  • Market share assessments for the regional and country level segments
  • Strategic recommendations for the new entrants
  • Market forecasts for a minimum of 9 years of all the mentioned segments, sub segments and the regional markets
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic analysis: Drivers and Constraints, Product/Technology Analysis, Porter’s five forces analysis, SWOT analysis etc.
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements
Free Customization Offerings:
  • All the customers of this report will be entitled to receive one of the following free customization options:
  • Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the clients interest (Note: Depends of feasibility check)
  • Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances.
Note: Product cover images may vary from those shown
2 of 3

FEATURED COMPANIES

  • 3M Company
  • Bemis Company, Inc.
  • Crown Holdings, Inc.
  • Landec Corporation
  • PakSense Inc.
  • SYSCO Corporation
  • MORE

1 Executive Summary

2 Preface
2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
2.5.3 Assumptions

3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Technology Analysis
3.7 End User Analysis
3.8 Emerging Markets
3.9 Futuristic Market Scenario

4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry

5 Global Advanced Packaging Technologies Market, By Type
5.1 Introduction
5.2 Flip Chip
5.3 2.5D Integrated Circuit
5.4 Fan Out Silicon in Package
5.5 2D Integrated Circuit
5.6 3D Integrated Circuit
5.7 Wafer Level Chip Scale Package
5.8 Other Types

6 Global Advanced Packaging Technologies Market, By Technology
6.1 Introduction
6.2 Smart and Intelligent Packaging
6.2.1 Radio Frequency Identification (RFID)
6.2.2 Freshness Indicators
6.2.3 TTI Tags & Labels
6.2.4 Oxygen and CO2 Indicators
6.2.5 Other Technologies
6.3 Active Packaging
6.3.1 Temperature Control Packaging
6.3.2 Modified Atmosphere Packaging
6.3.3 Active Packaging Systems
6.3.3.1 Ethylene Absorbers
6.3.3.2 Moisture Scavengers/Absorbers
6.3.3.3 Oxygen Scavengers
6.3.4 Active Releasing Systems
6.3.4.1 Carbon Dioxide Emitters
6.3.4.2 Antioxidant Releasers

7 Global Advanced Packaging Technologies Market, By End User
7.1 Introduction
7.2 Aerospace & Defense
7.3 Consumer Electronics
7.4 IT & Telecommunication
7.5 Industrial
7.6 Healthcare
7.7 Automotive & Transport
7.8 Other End Users

8 Global Advanced Packaging Technologies Market, By Geography
8.1 Introduction
8.2 North America
8.2.1 US
8.2.2 Canada
8.2.3 Mexico
8.3 Europe
8.3.1 Germany
8.3.2 UK
8.3.3 Italy
8.3.4 France
8.3.5 Spain
8.3.6 Rest of Europe
8.4 Asia Pacific
8.4.1 Japan
8.4.2 China
8.4.3 India
8.4.4 Australia
8.4.5 New Zealand
8.4.6 South Korea
8.4.7 Rest of Asia Pacific
8.5 South America
8.5.1 Argentina
8.5.2 Brazil
8.5.3 Chile
8.5.4 Rest of South America
8.6 Middle East & Africa
8.6.1 Saudi Arabia
8.6.2 UAE
8.6.3 Qatar
8.6.4 South Africa
8.6.5 Rest of Middle East & Africa

9 Key Developments
9.1 Agreements, Partnerships, Collaborations and Joint Ventures
9.2 Acquisitions & Mergers
9.3 New Product Launch
9.4 Expansions
9.5 Other Key Strategies

10 Company Profiling
10.1 3M Company
10.2 Crown Holdings, Inc.
10.3 Amcor Limited
10.4 PakSense Inc.
10.5 Thin Film Electronics ASA
10.6 CCL Industries Inc.
10.7 Sealed Air Corporation
10.8 Vitsab International AB
10.9 Landec Corporation
10.10 Timestrip U.K. Ltd.
10.11 LCR Hallcrest LLC
10.12 Bemis Company, Inc.
10.13 Temptime Corporation
10.14 Cryolog S.A.
10.15 SYSCO Corporation

List of Tables
Table 1 Global Advanced Packaging Technologies Market Outlook, By Region (2016-2026) ($MN)
Table 2 Global Advanced Packaging Technologies Market Outlook, By Type (2016-2026) ($MN)
Table 3 Global Advanced Packaging Technologies Market Outlook, By Flip Chip (2016-2026) ($MN)
Table 4 Global Advanced Packaging Technologies Market Outlook, By 2.5D Integrated Circuit (2016-2026) ($MN)
Table 5 Global Advanced Packaging Technologies Market Outlook, By Fan Out Silicon in Package (2016-2026) ($MN)
Table 6 Global Advanced Packaging Technologies Market Outlook, By 2D Integrated Circuit (2016-2026) ($MN)
Table 7 Global Advanced Packaging Technologies Market Outlook, By 3D Integrated Circuit (2016-2026) ($MN)
Table 8 Global Advanced Packaging Technologies Market Outlook, By Flip Chip (2016-2026) ($MN)
Table 9 Global Advanced Packaging Technologies Market Outlook, By Wafer Level Chip Scale Package (2016-2026) ($MN)
Table 10 Global Advanced Packaging Technologies Market Outlook, By Other Types (2016-2026) ($MN)
Table 11 Global Advanced Packaging Technologies Market Outlook, By Technology (2016-2026) ($MN)
Table 12 Global Advanced Packaging Technologies Market Outlook, By Smart and Intelligent Packaging (2016-2026) ($MN)
Table 13 Global Advanced Packaging Technologies Market Outlook, By Radio Frequency Identification (RFID) (2016-2026) ($MN)
Table 14 Global Advanced Packaging Technologies Market Outlook, By Freshness Indicators (2016-2026) ($MN)
Table 15 Global Advanced Packaging Technologies Market Outlook, By TTI Tags & Labels (2016-2026) ($MN)
Table 16 Global Advanced Packaging Technologies Market Outlook, By Oxygen and CO2 Indicators (2016-2026) ($MN)
Table 17 Global Advanced Packaging Technologies Market Outlook, By Other Technologies (2016-2026) ($MN)
Table 18 Global Advanced Packaging Technologies Market Outlook, By Active Packaging (2016-2026) ($MN)
Table 19 Global Advanced Packaging Technologies Market Outlook, By Temperature Control Packaging (2016-2026) ($MN)
Table 20 Global Advanced Packaging Technologies Market Outlook, By Modified Atmosphere Packaging (2016-2026) ($MN)
Table 21 Global Advanced Packaging Technologies Market Outlook, By Active Packaging Systems (2016-2026) ($MN)
Table 22 Global Advanced Packaging Technologies Market Outlook, By Active Releasing Systems (2016-2026) ($MN)
Table 23 Global Advanced Packaging Technologies Market Outlook, By End User (2016-2026) ($MN)
Table 24 Global Advanced Packaging Technologies Market Outlook, By Aerospace & Defense (2016-2026) ($MN)
Table 25 Global Advanced Packaging Technologies Market Outlook, By Consumer Electronics (2016-2026) ($MN)
Table 26 Global Advanced Packaging Technologies Market Outlook, By IT & Telecommunication (2016-2026) ($MN)
Table 27 Global Advanced Packaging Technologies Market Outlook, By Industrial (2016-2026) ($MN)
Table 28 Global Advanced Packaging Technologies Market Outlook, By Healthcare (2016-2026) ($MN)
Table 29 Global Advanced Packaging Technologies Market Outlook, By Automotive & Transport (2016-2026) ($MN)
Table 30 Global Advanced Packaging Technologies Market Outlook, By Other End Users (2016-2026) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.

Note: Product cover images may vary from those shown
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  • 3M Company
  • Crown Holdings, Inc.
  • Amcor Limited
  • PakSense Inc.
  • Thin Film Electronics ASA
  • CCL Industries Inc.
  • Sealed Air Corporation
  • Vitsab International AB
  • Landec Corporation
  • Timestrip U.K. Ltd.
  • LCR Hallcrest LLC
  • Bemis Company, Inc.
  • Temptime Corporation
  • Cryolog S.A.
  • SYSCO Corporation
Note: Product cover images may vary from those shown
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