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Chip Mounter Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2019-2024

  • ID: 4775611
  • Report
  • Region: Global
  • 108 pages
  • IMARC Group
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FEATURED COMPANIES

  • ASM Pacific Technology
  • Canon
  • Essemtec
  • Hitachi
  • Juki
  • Nordson
  • MORE
The global chip mounter market reached a value of US$ 4.1 Billion in 2018. The chip mounting technology has experienced significant development over the last few decades and has emerged as a practical solution for achieving higher densities in packaging systems. It was initially introduced as the conventional Through Hole Technology (THT), which later resurfaced as Surface Mount Technology (SMT) and then the Fine Pitch Technology (FPT). Nowadays, the majority of manufacturers utilize both SMT and THT for mounting chips on substrates. These technologies are used in a number of industries which include automotive, telecommunication, medical and electronics. Looking forward, the publisher expects the market to exceed US$ 5.6 Billion by 2024, growing at a CAGR of around 5% during 2019-2024.

Market Drivers:

On account of factors such as the rising demand for laptops and smartphones, growing internet penetration, and automation in household electronic goods, the consumer electronics industry has experienced robust growth over the past few years. As chip mounters are used to assemble semiconductor components on PCBs in consumer electronics, the escalating demand for these gadgets and appliances is strengthening the growth of the market. Moreover, electronic chipsets play a vital role in the production of miniature electronic devices where they assist in reducing the dimensions of integrated circuits. With the increasing demand for compact gadgets and wearables, manufacturers are increasingly using these chipsets to reduce the overall size of the devices without affecting their performance. Apart from this, to keep pace with the rising level of integration, hardware developers are investing in the development of new techniques to manage more circuitry at similar costs.

Report Coverage:

Historical, Current and Future Market Trends

Market Breakup by Technology:
Hole Technology
Surface Mount Technology
Fine Pitch Technology

Market Breakup by Application:
Consumer Electronics
Medical
Automotive
Telecommunication
Others

Market Breakup by Region:
Asia Pacific
Europe
North America
Middle East and Africa
Latin America

Competitive Landscape:

The report has also analysed the competitive landscape of the market with some of the key players being Hitachi, Samsung, Panasonic, Juki, ASM Pacific Technology, Canon, Essemtec, Ohashi Engineering, Nordson, Sony, Sun Electronic Industries Corporation, TOA, etc.

Key Questions Answered in This Report:

How has the global chip mounter market performed so far and how will it perform in the coming years?
What are the key regional markets in the global chip mounter industry?
What is the breakup of the market based on the technology?
What is the breakup of the market based on the application?
What are the various stages in the value chain of the global chip mounter industry?
What are the key driving factors and challenges in the global chip mounter industry?
What is the structure of the global chip mounter industry and who are the key players?
What is the degree of competition in the global chip mounter industry?
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • ASM Pacific Technology
  • Canon
  • Essemtec
  • Hitachi
  • Juki
  • Nordson
  • MORE
1 Preface

2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology

3 Executive Summary

4 Introduction
4.1 Overview
4.2 Key Industry Trends

5 Global Chip Mounter Market
5.1 Market Overview
5.2 Market Performance
5.3 Market Breakup by Technology
5.4 Market Breakup by Application
5.5 Market Breakup by Region
5.6 Market Forecast

6 Market Breakup by Technology
6.1 Hole Technology
6.1.1 Market Trends
6.1.2 Market Forecast
6.2 Surface Mount Technology
6.2.1 Market Trends
6.2.2 Market Forecast
6.3 Fine Pitch Technology
6.3.1 Market Trends
6.3.2 Market Forecast

7 Market Breakup by Application
7.1 Consumer Electronics
7.1.1 Market Trends
7.1.2 Market Forecast
7.2 Medical
7.2.1 Market Trends
7.2.2 Market Forecast
7.3 Automotive
7.3.1 Market Trends
7.3.2 Market Forecast
7.4 Telecommunication
7.4.1 Market Trends
7.4.2 Market Forecast
7.5 Others
7.5.1 Market Trends
7.5.2 Market Forecast

8 Market Breakup by Region
8.1 Asia Pacific
8.1.1 Market Trends
8.1.2 Market Forecast
8.2 Europe
8.2.1 Market Trends
8.2.2 Market Forecast
8.3 North America
8.3.1 Market Trends
8.3.2 Market Forecast
8.4 Middle East and Africa
8.4.1 Market Trends
8.4.2 Market Forecast
8.5 Latin America
8.5.1 Market Trends
8.5.2 Market Forecast

9 SWOT Analysis
9.1 Overview
9.2 Strengths
9.3 Weaknesses
9.4 Opportunities
9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis
11.1 Overview
11.2 Bargaining Power of Buyers
11.3 Bargaining Power of Suppliers
11.4 Degree of Competition
11.5 Threat of New Entrants
11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape
13.1 Market Structure
13.2 Key Players
13.3 Profiles of Key Players
13.3.1 Hitachi
13.3.2 Samsung
13.3.3 Panasonic
13.3.4 Juki
13.3.5 ASM Pacific Technology
13.3.6 Canon
13.3.7 Essemtec
13.3.8 Ohashi Engineering
13.3.9 Nordson
13.3.10 Sony
13.3.11 Sun Electronic Industries Corporation
13.3.12 TOA
Note: Product cover images may vary from those shown
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  • Hitachi
  • Samsung
  • Panasonic
  • Juki
  • ASM Pacific Technology
  • Canon
  • Essemtec
  • Ohashi Engineering
  • Nordson
  • Sony
  • Sun Electronic Industries Corporation
  • TOA
Note: Product cover images may vary from those shown
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