Increasing global demand for high-end electronic devices using miniaturized circuits with low power consumption and reduced size.
Heavy investments on the R&D by many key industry players.
Competition from already established tech giants who are heavily investing in this area.
Lack of clarity regarding standardization and ownership concerns
In 2015, Jiangsu Chanjiang Electronics Technology Co. Ltd acquired Statschippac to augment its R&D capabilities.
ASE Group is considering a merger with SPIL.
The 3D Semiconductor packaging market has been analyzed through the following segments:
Through Silicon Vias (TSV)
Fan Out Wafer Level Packaging
By Industry Vertical
Communication and Technology
Defense and Aerospace
Die Attach Material
Middle East and Africa
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.6. Base, and Forecast Years Timeline
2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Secondary Sources
3. KEY FINDINGS
4. MARKET DYNAMICS
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter's Five Forces Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness
5. 3 D SEMICONDUCTOR PACKAGING MARKET BY TECHNOLOGY
5.1. Through Silicon Vias (TSV)
5.2. Fan Out Wafer Level Packaging
5.3. Wire Bonding
6. 3 D SEMICONDUCTOR PACKAGING MARKET BY INDUSTRY VERTICAL
6.2. Communication and Technology
6.5. Defense and Aerospace
7. 3 D SEMICONDUCTOR PACKAGING MARKET BY MATERIAL
7.1. Bonding Wire
7.2. Lead frame
7.3. Organic Substrate
7.4. Encapsulation Resin
7.5. Organic Substrate
7.6. Ceramic Package
7.7. Die Attach Material
8. 3 D SEMICONDUCTOR PACKAGING MARKET BY GEOGRAPHY
8.1. North America
8.2. South America
8.3.1. United Kingdom
8.4. Middle East and Africa
8.4.3. Saudi Arabia
8.5. Asia Pacific
8.5.3. South Korea
9. COMPETITIVE INTELLIGENCE
9.1. Competitive Benchmarking and Analysis
9.2. Recent Investments and Deals
9.3. Strategies of Key Players
10. COMPANY PROFILES
10.1. Samsung Electronics
10.2. Intel Corporation
10.5. Taiwan Semiconductor Manufacturing Company
10.6. Amkor Technology Inc
10.7. ASE Group
10.9. Siliconware PrecisionIndustries Co.
10.10. GlobalFOundries Inc
10.11. Applied Materials
10.12. International Busines Machines Corp.
10.13. Tezzaron Semiconductors
10.14. STATS ChipPac Ltd
10.15. Micralyne, Inc
10.17. SK Hynix
- Samsung Electronics
- Intel Corporation
- Taiwan Semiconductor Manufacturing Company Ltd
- Amkor Technology Inc
- ASE Group
- Siliconware Precision Industries Co
- GlobalFoundries Inc.
- Applied Materials
- International Business Machines Corp.
- Tezzaron Semiconductors
- STATS ChipPAC Ltd
- Micralyne, Inc
- Toshiba Corp.
- SK Hynix
The research study is based on the publisher's proprietary research model. The process involves sourcing of information from various industry experts, key professionals, decision-makers and various other stakeholders along with the validation of the responses received from the vast in-house database and premium paid databases. Publicly available sources were also taken into consideration for the final market estimates and forecast for the segments and sub-segments.
The first phase of the research process is the identification of key industry leaders, experts, decision-makers and C-level executives and then conducting interviews and surveys to gain vital insights about the market. Simultaneously, extensive secondary research is done, and key secondary data is collected as part of this process. This secondary data is collected from various databases, industry journals, whitepapers, company annual reports, research publications, and other paid data sources and relevant literature. Company profiles which include strategies, new product developments, recent investments, major products and services, financials and business plans are sourced from the annual reports, SEC filings, industry associations to preserve the quality of the information being displayed. The findings from both the primary and the secondary research process combined go under further processing for market breakdown and forecasting.
The last phase is providing intelligence in the form of presentation, charts, graphics and other different formats helping the clients in a faster and efficient understanding of the market. Under this phase complete market engineering is involved which includes analyzing the collected data from different sources and existing proprietary datasets while using various data triangulation methods for market breakdown and forecasting. The publisher has developed their market forecasting methodology that, in addition to the main market values, also takes into account other macroeconomic factors (global or local) that might have some bearing on the market under study. Taking all the necessary data, a robust forecast is developed using an algorithm that involves both static (multivariate) as well as dynamic (time-series) regression analysis. Special care is taken to make sure their algorithm passes the necessary statistical tests, and the mean prediction for future years obtained is reliable with a very high confidence level. Following data validation, the analysts begin to write the report presenting insights with the help of charts, graphs, and tables.