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3D Semiconductor Packaging Market - Forecasts from 2019 to 2024

  • ID: 4801766
  • Report
  • 116 pages
  • Knowledge Sourcing Intelligence LLP
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FEATURED COMPANIES

  • Amkor Technology Inc
  • ASE Group
  • Intel Corporation
  • Microchip
  • SK Hynix
  • STATS ChipPAC Ltd
  • MORE
The three-dimensional integrated circuits (ICs) are integrated circuits manufactured using a new packaging technology of stacking silicon wafers and interconnecting them vertically using Through Silicon Vias (TSVs) or Cu-Cu connections, so that they behave as a single device, achieving improved performance at reduced power and smaller footprint than two-dimensional processes. The 3D semiconductor packaging market is expected to grow at a significant CAGR of 14.46% to reach a market size of US$6.044 billion in 2024 from US$2.688 billion in 2018. As the demand for higher capacity electronic devices with more efficient power consumption increases, it drives the need to implement 3D ICs in various such devices.

Drivers

Increasing global demand for high-end electronic devices using miniaturized circuits with low power consumption and reduced size.

Heavy investments on the R&D by many key industry players.

Restraints

Competition from already established tech giants who are heavily investing in this area.

Lack of clarity regarding standardization and ownership concerns

Recent Developments

In 2015, Jiangsu Chanjiang Electronics Technology Co. Ltd acquired Statschippac to augment its R&D capabilities.

ASE Group is considering a merger with SPIL.

Segmentation

The 3D Semiconductor packaging market has been analyzed through the following segments:

By Technology

Through Silicon Vias (TSV)
Fan Out Wafer Level Packaging
Wire Bonding
Others

By Industry Vertical

Electronics
Communication and Technology
Manufacturing
Automotive
Defense and Aerospace
Healthcare
Others

By Material

Bonding Wire
Lead frame
Organic Substrate
Encapsulation Resin
Ceramic Package
Die Attach Material
Others

By Geography

North America
USA
Canada
Others

South America
Brazil
Argentina
Others

Europe
United Kingdom
Germany
France
Others

Middle East and Africa
Israel
UAE
Saudi Arabia
Others

Asia Pacific
China
Japan
South Korea
India
Others
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Amkor Technology Inc
  • ASE Group
  • Intel Corporation
  • Microchip
  • SK Hynix
  • STATS ChipPAC Ltd
  • MORE
1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Currency
1.5. Assumptions
1.6. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Secondary Sources

3. KEY FINDINGS

4. MARKET DYNAMICS
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter's Five Forces Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness

5. 3 D SEMICONDUCTOR PACKAGING MARKET BY TECHNOLOGY
5.1. Through Silicon Vias (TSV)
5.2. Fan Out Wafer Level Packaging
5.3. Wire Bonding
5.4. Others

6. 3 D SEMICONDUCTOR PACKAGING MARKET BY INDUSTRY VERTICAL
6.1. Electronics
6.2. Communication and Technology
6.3. Manufacturing
6.4. Automotive
6.5. Defense and Aerospace
6.6. Healthcare
6.7. Others

7. 3 D SEMICONDUCTOR PACKAGING MARKET BY MATERIAL
7.1. Bonding Wire
7.2. Lead frame
7.3. Organic Substrate
7.4. Encapsulation Resin
7.5. Organic Substrate
7.6. Ceramic Package
7.7. Die Attach Material
7.8. Others

8. 3 D SEMICONDUCTOR PACKAGING MARKET BY GEOGRAPHY
8.1. North America
8.1.1. USA
8.1.2. Canada
8.1.3. Others
8.2. South America
8.2.1. Brazil
8.2.2. Argentina
8.2.3. Others
8.3. Europe
8.3.1. United Kingdom
8.3.2. Germany
8.3.3. France
8.3.4. Others
8.4. Middle East and Africa
8.4.1. Israel
8.4.2. UAE
8.4.3. Saudi Arabia
8.4.4. Others
8.5. Asia Pacific
8.5.1. China
8.5.2. Japan
8.5.3. South Korea
8.5.4. India
8.5.5. Others

9. COMPETITIVE INTELLIGENCE
9.1. Competitive Benchmarking and Analysis
9.2. Recent Investments and Deals
9.3. Strategies of Key Players

10. COMPANY PROFILES
10.1. Samsung Electronics
10.2. Intel Corporation
10.3. Xilinx
10.4. Sony
10.5. Taiwan Semiconductor Manufacturing Company
10.6. Amkor Technology Inc
10.7. ASE Group
10.8. Microchip
10.9. Siliconware PrecisionIndustries Co.
10.10. GlobalFOundries Inc
10.11. Applied Materials
10.12. International Busines Machines Corp.
10.13. Tezzaron Semiconductors
10.14. STATS ChipPac Ltd
10.15. Micralyne, Inc
10.16. Toshiba
10.17. SK Hynix
Note: Product cover images may vary from those shown
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  • Samsung Electronics
  • Intel Corporation
  • Xilinx
  • Sony
  • Taiwan Semiconductor Manufacturing Company Ltd
  • Amkor Technology Inc
  • ASE Group
  • Microchip
  • Siliconware Precision Industries Co
  • GlobalFoundries Inc.
  • Applied Materials
  • International Business Machines Corp.
  • Tezzaron Semiconductors
  • STATS ChipPAC Ltd
  • Micralyne, Inc
  • Toshiba Corp.
  • SK Hynix
Note: Product cover images may vary from those shown
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The research study is based on the publisher's proprietary research model. The process involves sourcing of information from various industry experts, key professionals, decision-makers and various other stakeholders along with the validation of the responses received from the vast in-house database and premium paid databases. Publicly available sources were also taken into consideration for the final market estimates and forecast for the segments and sub-segments.

The first phase of the research process is the identification of key industry leaders, experts, decision-makers and C-level executives and then conducting interviews and surveys to gain vital insights about the market. Simultaneously, extensive secondary research is done, and key secondary data is collected as part of this process. This secondary data is collected from various databases, industry journals, whitepapers, company annual reports, research publications, and other paid data sources and relevant literature. Company profiles which include strategies, new product developments, recent investments, major products and services, financials and business plans are sourced from the annual reports, SEC filings, industry associations to preserve the quality of the information being displayed. The findings from both the primary and the secondary research process combined go under further processing for market breakdown and forecasting.

The last phase is providing intelligence in the form of presentation, charts, graphics and other different formats helping the clients in a faster and efficient understanding of the market. Under this phase complete market engineering is involved which includes analyzing the collected data from different sources and existing proprietary datasets while using various data triangulation methods for market breakdown and forecasting. The publisher has developed their market forecasting methodology that, in addition to the main market values, also takes into account other macroeconomic factors (global or local) that might have some bearing on the market under study. Taking all the necessary data, a robust forecast is developed using an algorithm that involves both static (multivariate) as well as dynamic (time-series) regression analysis. Special care is taken to make sure their algorithm passes the necessary statistical tests, and the mean prediction for future years obtained is reliable with a very high confidence level. Following data validation, the analysts begin to write the report presenting insights with the help of charts, graphs, and tables.

 

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