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E-Beam Wafer Inspection Systems - Global Market Trajectory & Analytics

  • ID: 4804752
  • Report
  • April 2021
  • Region: Global
  • 147 pages
  • Global Industry Analysts, Inc
The global market for E-Beam Wafer Inspection System is projected to reach US$1.2 billion by 2025, driven by the growing demands placed on semiconductor companies to optimize yield management. The focus on metrology and high performance quality control is therefore increasing. Rapid digitalization and evolution of Internet of Things (IoT), Artificial Intelligence (AI), and machine learning technologies are driving the need for faster, smaller, low power devices, bringing in new challenges for semiconductor manufacturers. While wafer size is increasing from 200 mm to 300nm, critical dimensions of semiconductor circuits (patterns) is rapidly shrinking to 0.13 um and 0.10 um. As critical dimensions shrink, identifying defects becomes more difficult and time-consuming. However, in order to ensure profitability and production efficiency, yield limiting defects need to be identified early on in the manufacturing flow. Wafer defect inspection is therefore emerging into an important step in the semiconductor manufacturing process. Intrinsic defects on bare wafers if left undetected can lead to killer defects on final processed wafer/chips. Early detection of physical defects and pattern defects on wafers can help save companies millions of dollars in production losses. E-Beam Wafer Inspection System, in this regard, is witnessing strong growth and adoption supported by benefits such as minimized total time for detecting and fixing defects on processed wafers; higher return-on-investment for semiconductor fabricators; high resolution; effective for inspecting nodes at 10 nm and below; ability to identify defects residing deep within the wafer structures; and effectively identifies electrical defects that impact yield. Technology developments aimed at enhancing throughput speeds are of vital importance, given that slow throughput is the Achilles Heel of the technology.

Other major noteworthy trends in the market include innovations in multi-beam e-beam inspection brings the promise of reduced cost of inspection for each node; growing replacement of optical inspection with e-beam inspection as new architectures like finFETs & 3D NAND emerge. Asia-Pacific excluding China represents the largest market worldwide with a 30.3% share. U.S., Japan and China represent the other major markets with a combined share of 43.6%. China ranks as the fastest growing market with a 22.3% CAGR over the analysis period supported by the Chinese governments efforts to build a self-sufficient, homegrown semiconductor industry against the backdrop of intensifying U.S.-China trade war. Funding support, favorable policies and R&D push have already resulted in the establishment of several start-ups focusing on AI and machine learning hardware. As the country initiates its long-term plan of reducing dependence on US chip technology, semiconductor infrastructure in the country will receive a boost spurring opportunities for production technologies like e-beam inspection. Asia-Pacific excluding China follows next with a 21.4% CAGR led by established semiconductor manufacturing giants such as Taiwan and South Korea.

Select Competitors (Total 9 Featured):
  • Applied Materials, Inc.
  • JEOL Ltd.
  • ASML B.V.
  • Lam Research Corporation
  • Hitachi High-Tech Corporation
  • Nanotronics
  • NGR Inc.
  • Photo Electron Soul Inc.
Note: Product cover images may vary from those shown
I. METHODOLOGY

II. EXECUTIVE SUMMARY
  • Influencer Market Insights
  • World Market Trajectories
  • Semiconductor Industry: An Overview
  • Global Semiconductor Industry CAPEX (in US$ Billion) for Years 2016, 2018 & 2022F
  • Global Personal Electronics Market by Product Category in Million Units for the Years 2016, 2018 and 2020
  • Dynamics of E-Beam Wafer Inspection Systems Tied to Semiconductor Manufacturing
  • Growing Sophistication of Semiconductor Wafer Designs Stimulates Demand
  • Wafer Defect Inspection System: An Introduction
  • Types of Wafer Defect Inspection Systems
  • E-Beam Wafer Inspection System: A Prelude
  • Resolving Power Less Than 1 nm
  • Resolving Power 1 to 10 nm
  • Resolving Power More Than 10 nm
  • E-Beam Wafer Inspection System: Industry Overview
  • More Than 10 nm Inspection Resolution Dominates the Product Category
  • Defect Imaging: The Largest End-Use Application Market
  • Asia Maintains Large Lead in the E-Beam Wafer Inspection System Market
  • Global Competitor Analysis
  • Focus Shifts to R&D
  • Impact of Covid-19 and a Looming Global Recession
  • Applied Materials, Inc. (USA)
  • ASML Holding NV (The Netherlands)
  • Hitachi High-Technologies Corporation (Japan)
  • KLA Corporation (USA)
  • Lam Research Corporation (USA)
  • Photo electron Soul Inc. (Japan)
  • Analysis of the E-Beam Wafer Inspection System Market
  • Key Growth Drivers in the E-beam Wafer Inspection System Market
  • Multi-Beam Technology Holds Immense Potential
  • Enhanced Defect Detection
  • E-Beam Inspection Systems Find Use for R&D Purposes
  • Robust Demand for Semiconductor Wafers Key to Growth of E-Beam Inspection System
  • Global Integrated Circuits Semiconductor Market in US$ Billion for the Years 2014, 2016, 2018 and 2020
  • Global Semiconductor Integrated Circuit (IC) Wafer Capacity in Millions of 200mm-Equivalent Wafers for the Years 2014, 2016, 2018 and 2020
  • R&D Spending in Semiconductor Industry Continues to Rise: An Opportunity for E-Beam Wafer Inspection Market
  • Global Semiconductor R&D Spending: Compounded Annual Growth Rate (%) of R&D Expenditure for the Periods 2003-2008, 2008-2013, 2013-2018 and 2018-2023F
  • US Semiconductor Industry: Capital and R&D Investment in US$ Billion for the Years 2010, 2012, 2014, 2016 and 2018
  • Increasing Demand for Semiconductor Wafers and Growing Complexity of Wafer Design and Manufacturing Process Augurs Well for E-Beam Wafer Inspection Systems Market
  • Global Semiconductor Silicon Wafer Market: Revenues in US$ Billion for the Years 2019E, 2021F, 2023F and 2025F
  • Global New Semiconductor Manufacturing Equipment Sales in US$ Billion by Geographic Region for the Years 2016, 2018 and 2020F
  • Optical Vs E-Beam Wafer Inspection System
  • Select Innovative Technologies Impacting Growth and Future Prospects
  • Technical Perspective of Smart E-Beam for Defect Identification & Analysis in the Nanoscale Technology Nodes
  • SiC Wafer Defect Inspection: An Innovative Technology
  • E-beam Inspection Technology Identifies Hard-to Find Defects, but Speed Remains an Issue
  • Use of E-beam Inspection in Yield Learning Process and for Conventional Voltage Contrast Mode
  • Challenges Lead to Development of Multi-Beam Inspection Technology
  • High Implementation Cost and Slow Throughput: Major Restraints
  • Table 1: World Current & Future Analysis for E-Beam Wafer Inspection Systems by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 2: World 7-Year Perspective for E-Beam Wafer Inspection Systems by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2020 & 2027
  • Table 3: World Current & Future Analysis for Less Than 1 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 4: World 7-Year Perspective for Less Than 1 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 5: World Current & Future Analysis for 1 to 10 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 6: World 7-Year Perspective for 1 to 10 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 7: World Current & Future Analysis for More Than 10 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 8: World 7-Year Perspective for More Than 10 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 9: World Current & Future Analysis for Defect Imaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 10: World 7-Year Perspective for Defect Imaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 11: World Current & Future Analysis for Lithographic Qualification by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 12: World 7-Year Perspective for Lithographic Qualification by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 13: World Current & Future Analysis for Bare Wafer OQC/IQC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 14: World 7-Year Perspective for Bare Wafer OQC/IQC by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 15: World Current & Future Analysis for Wafer Dispositioning by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 16: World 7-Year Perspective for Wafer Dispositioning by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 17: World Current & Future Analysis for Reticle Quality Inspection by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 18: World 7-Year Perspective for Reticle Quality Inspection by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 19: World Current & Future Analysis for Inspector Recipe Optimization by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 20: World 7-Year Perspective for Inspector Recipe Optimization by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
III. MARKET ANALYSIS
  • Table 21: USA Current & Future Analysis for E-Beam Wafer Inspection Systems by Segment - Less Than 1 nm, 1 to 10 nm and More Than 10 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 22: USA 7-Year Perspective for E-Beam Wafer Inspection Systems by Segment - Percentage Breakdown of Value Sales for Less Than 1 nm, 1 to 10 nm and More Than 10 nm for the Years 2020 & 2027
  • Table 23: USA Current & Future Analysis for E-Beam Wafer Inspection Systems by End-Use - Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 24: USA 7-Year Perspective for E-Beam Wafer Inspection Systems by End-Use - Percentage Breakdown of Value Sales for Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization for the Years 2020 & 2027
  • Table 25: Canada Current & Future Analysis for E-Beam Wafer Inspection Systems by Segment - Less Than 1 nm, 1 to 10 nm and More Than 10 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 26: Canada 7-Year Perspective for E-Beam Wafer Inspection Systems by Segment - Percentage Breakdown of Value Sales for Less Than 1 nm, 1 to 10 nm and More Than 10 nm for the Years 2020 & 2027
  • Table 27: Canada Current & Future Analysis for E-Beam Wafer Inspection Systems by End-Use - Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 28: Canada 7-Year Perspective for E-Beam Wafer Inspection Systems by End-Use - Percentage Breakdown of Value Sales for Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization for the Years 2020 & 2027
  • Table 29: Japan Current & Future Analysis for E-Beam Wafer Inspection Systems by Segment - Less Than 1 nm, 1 to 10 nm and More Than 10 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 30: Japan 7-Year Perspective for E-Beam Wafer Inspection Systems by Segment - Percentage Breakdown of Value Sales for Less Than 1 nm, 1 to 10 nm and More Than 10 nm for the Years 2020 & 2027
  • Table 31: Japan Current & Future Analysis for E-Beam Wafer Inspection Systems by End-Use - Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 32: Japan 7-Year Perspective for E-Beam Wafer Inspection Systems by End-Use - Percentage Breakdown of Value Sales for Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization for the Years 2020 & 2027
  • Market Overview
  • Table 33: China Current & Future Analysis for E-Beam Wafer Inspection Systems by Segment - Less Than 1 nm, 1 to 10 nm and More Than 10 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 34: China 7-Year Perspective for E-Beam Wafer Inspection Systems by Segment - Percentage Breakdown of Value Sales for Less Than 1 nm, 1 to 10 nm and More Than 10 nm for the Years 2020 & 2027
  • Table 35: China Current & Future Analysis for E-Beam Wafer Inspection Systems by End-Use - Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 36: China 7-Year Perspective for E-Beam Wafer Inspection Systems by End-Use - Percentage Breakdown of Value Sales for Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization for the Years 2020 & 2027
  • Table 37: Europe Current & Future Analysis for E-Beam Wafer Inspection Systems by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 38: Europe 7-Year Perspective for E-Beam Wafer Inspection Systems by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2020 & 2027
  • Table 39: Europe Current & Future Analysis for E-Beam Wafer Inspection Systems by Segment - Less Than 1 nm, 1 to 10 nm and More Than 10 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 40: Europe 7-Year Perspective for E-Beam Wafer Inspection Systems by Segment - Percentage Breakdown of Value Sales for Less Than 1 nm, 1 to 10 nm and More Than 10 nm for the Years 2020 & 2027
  • Table 41: Europe Current & Future Analysis for E-Beam Wafer Inspection Systems by End-Use - Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 42: Europe 7-Year Perspective for E-Beam Wafer Inspection Systems by End-Use - Percentage Breakdown of Value Sales for Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization for the Years 2020 & 2027
  • Table 43: France Current & Future Analysis for E-Beam Wafer Inspection Systems by Segment - Less Than 1 nm, 1 to 10 nm and More Than 10 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 44: France 7-Year Perspective for E-Beam Wafer Inspection Systems by Segment - Percentage Breakdown of Value Sales for Less Than 1 nm, 1 to 10 nm and More Than 10 nm for the Years 2020 & 2027
  • Table 45: France Current & Future Analysis for E-Beam Wafer Inspection Systems by End-Use - Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 46: France 7-Year Perspective for E-Beam Wafer Inspection Systems by End-Use - Percentage Breakdown of Value Sales for Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization for the Years 2020 & 2027
  • Table 47: Germany Current & Future Analysis for E-Beam Wafer Inspection Systems by Segment - Less Than 1 nm, 1 to 10 nm and More Than 10 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 48: Germany 7-Year Perspective for E-Beam Wafer Inspection Systems by Segment - Percentage Breakdown of Value Sales for Less Than 1 nm, 1 to 10 nm and More Than 10 nm for the Years 2020 & 2027
  • Table 49: Germany Current & Future Analysis for E-Beam Wafer Inspection Systems by End-Use - Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 50: Germany 7-Year Perspective for E-Beam Wafer Inspection Systems by End-Use - Percentage Breakdown of Value Sales for Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization for the Years 2020 & 2027
  • Table 51: Italy Current & Future Analysis for E-Beam Wafer Inspection Systems by Segment - Less Than 1 nm, 1 to 10 nm and More Than 10 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 52: Italy 7-Year Perspective for E-Beam Wafer Inspection Systems by Segment - Percentage Breakdown of Value Sales for Less Than 1 nm, 1 to 10 nm and More Than 10 nm for the Years 2020 & 2027
  • Table 53: Italy Current & Future Analysis for E-Beam Wafer Inspection Systems by End-Use - Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 54: Italy 7-Year Perspective for E-Beam Wafer Inspection Systems by End-Use - Percentage Breakdown of Value Sales for Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization for the Years 2020 & 2027
  • Table 55: UK Current & Future Analysis for E-Beam Wafer Inspection Systems by Segment - Less Than 1 nm, 1 to 10 nm and More Than 10 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 56: UK 7-Year Perspective for E-Beam Wafer Inspection Systems by Segment - Percentage Breakdown of Value Sales for Less Than 1 nm, 1 to 10 nm and More Than 10 nm for the Years 2020 & 2027
  • Table 57: UK Current & Future Analysis for E-Beam Wafer Inspection Systems by End-Use - Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 58: UK 7-Year Perspective for E-Beam Wafer Inspection Systems by End-Use - Percentage Breakdown of Value Sales for Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization for the Years 2020 & 2027
  • Table 59: Rest of Europe Current & Future Analysis for E-Beam Wafer Inspection Systems by Segment - Less Than 1 nm, 1 to 10 nm and More Than 10 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 60: Rest of Europe 7-Year Perspective for E-Beam Wafer Inspection Systems by Segment - Percentage Breakdown of Value Sales for Less Than 1 nm, 1 to 10 nm and More Than 10 nm for the Years 2020 & 2027
  • Table 61: Rest of Europe Current & Future Analysis for E-Beam Wafer Inspection Systems by End-Use - Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 62: Rest of Europe 7-Year Perspective for E-Beam Wafer Inspection Systems by End-Use - Percentage Breakdown of Value Sales for Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization for the Years 2020 & 2027
  • Taiwan: Major Supplier of Electronics
  • Table 63: Asia-Pacific Current & Future Analysis for E-Beam Wafer Inspection Systems by Segment - Less Than 1 nm, 1 to 10 nm and More Than 10 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 64: Asia-Pacific 7-Year Perspective for E-Beam Wafer Inspection Systems by Segment - Percentage Breakdown of Value Sales for Less Than 1 nm, 1 to 10 nm and More Than 10 nm for the Years 2020 & 2027
  • Table 65: Asia-Pacific Current & Future Analysis for E-Beam Wafer Inspection Systems by End-Use - Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 66: Asia-Pacific 7-Year Perspective for E-Beam Wafer Inspection Systems by End-Use - Percentage Breakdown of Value Sales for Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization for the Years 2020 & 2027
  • Table 67: Rest of World Current & Future Analysis for E-Beam Wafer Inspection Systems by Segment - Less Than 1 nm, 1 to 10 nm and More Than 10 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 68: Rest of World 7-Year Perspective for E-Beam Wafer Inspection Systems by Segment - Percentage Breakdown of Value Sales for Less Than 1 nm, 1 to 10 nm and More Than 10 nm for the Years 2020 & 2027
  • Table 69: Rest of World Current & Future Analysis for E-Beam Wafer Inspection Systems by End-Use - Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 70: Rest of World 7-Year Perspective for E-Beam Wafer Inspection Systems by End-Use - Percentage Breakdown of Value Sales for Defect Imaging, Lithographic Qualification, Bare Wafer OQC/IQC, Wafer Dispositioning, Reticle Quality Inspection and Inspector Recipe Optimization for the Years 2020 & 2027
IV. COMPETITION
  • Total Companies Profiled: 9
Note: Product cover images may vary from those shown
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