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Semiconductor and IC Packaging Materials - Global Strategic Business Report

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    Report

  • 452 Pages
  • April 2024
  • Region: Global
  • Global Industry Analysts, Inc
  • ID: 4806016

Global Semiconductor and IC Packaging Materials Market to Reach $72.8 Billion by 2030

The global market for Semiconductor and IC Packaging Materials estimated at US$33.4 Billion in the year 2023, is projected to reach a revised size of US$72.8 Billion by 2030, growing at a CAGR of 10.2% over the analysis period 2023-2030.

Organic Substrates, one of the segments analyzed in the report, is projected to record 11.1% CAGR and reach US$22 Billion by the end of the analysis period. Growth in the Bonding Wires segment is estimated at 12% CAGR for the next 8-year period.

The U.S. Market is Estimated at $2.1 Billion, While China is Forecast to Grow at 11.9% CAGR

The Semiconductor and IC Packaging Materials market in the U.S. is estimated at US$2.1 Billion in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$17.6 Billion by the year 2030 trailing a CAGR of 11.9% over the analysis period 2023 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 8.9% and 5.7% respectively over the 2023-2030 period. Within Europe, Germany is forecast to grow at approximately 7.7% CAGR.

Exciting New Report Features

  • Full access to influencer engagement stats
  • Free access to digital archives & research platform. The proprietary platform is fully enabled to unlock creativity and market knowledge of domain experts worldwide in a cohesive and collaborative manner. The state-of-art tools bring world class market perspectives while protecting participants` privacy and identity. Numbers, statistics and market narrative in the report are based on fully curated insights shared by domain experts and influencers in this space.
  • Opportunity to engage with interactive questionnaires that come with real-time data simulator tools & bespoke report generation capabilities
  • Full client access to peer collaborative and interactive platform for cross-enterprise smart exchange of ideas
  • Complimentary report updates for one year
  • Competitor coverage with global market shares of major players
  • Player market presence analysis (Strong/Active/Niche/Trivial) across multiple geographies
  • Access to curated YouTube video transcripts of domain experts/influencer interviews, podcasts, press statements and event keynotes

What to Expect from the Global Economy in 2024

Edgy geopolitics, and economic instability caused by monetary policy tightening and ensuing higher interest rates will create a tumultuous landscape for 2024. Several factors will continue to exert pressure on the path to recovery including hostilities in the Middle East and increasingly common climate disasters. Among the risks, several positives are also taking shape such as growing signs of disinflation and easing of anxiety over stubborn inflation, supply chain normalization and price moderation despite volatility in energy costs. Elections across several G21 jurisdictions, notably in India and the United States, will have potential ramifications for capital flows and investment strategies. While India emerges as a compelling destination in the global investment landscape, U.S, based tech firms will continue to dominate, fueled by a dynamic ecosystem of talent and capital. Tech opportunities in Silicon Valley and beyond remain attractive for investors seeking high-growth prospects supported largely by a resilient albeit slowing domestic economy and conducive regulatory environment. Europe will continue to battle tight monetary policy and recession risks with U.K. having the most challenging outlook and running the greatest risk of recession in 2024. China remains a wild card with hope for growth in the country underpinned by government spending and improvements in consumer spending. The volatile environment will offer both opportunities and challenges for investors and businesses alike. Embracing volatility as a catalyst for growth together with agility and strategic foresight in navigating investment decisions will remain important for survival.

Select Competitors (Total 106 Featured)

  • BASF SE
  • 3M Company
  • Analog Devices, Inc.
  • Amkor Technology, Inc.
  • ams AG
  • Atotech Deutschland GmbH
  • Canatu Oy
  • Adtech Ceramics
  • Carsem (M) Sdn. Bhd.
  • Ceramtec GmbH
  • Chaozhou Three-Circle (Group) Co., Ltd.
  • AMETEK Electronic Components & Packaging
  • Chipbond Technology Corporation
  • California Fine Wire Co.
  • Amtech Microelectronics, Inc.

Table of Contents

I. METHODOLOGYII. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
  • Semiconductor ICs & Packaging Materials, Definition, Scope, Importance & Types
  • As “Digitalization of Everything” Creeps Through Every Facet of Modern Life, Semiconductors the Lifeblood of the Whole Concept Becomes the Most Chased After Commodity
  • The Semiconductor Decade is on its Way Guided by the Digitalization Wave: Digital Transformation (DX) Spending of Business Practices, Products & Organization (In US$ Billion) for Years 2021 Through 2025
  • Digital Transformation Across Networking & Communications, Data Processing, Industrial, Consumer Electronics, Automotive, Aerospace, Healthcare, Retail, Media & Entertainment Shapes a Robust Semiconductor Industry Vital to the Continued Evolution of Human Civilization: Global Semiconductor Industry (In US$ Billion) for Years 2022, 2024, 2026, 2028, and 2030
  • What’s Ahead for Businesses & Markets?
  • Competition
  • Semiconductor and IC Packaging Materials - Global Key Competitors Percentage Market Share in 2023 (E)
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2023 (E)
  • Semiconductor ICs & Packaging Materials: Introduction, Types, Market Structure
  • World Brands
  • Recent Market Activity
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
  • As Global Chip Shortage Continues, It is Time to Review the Implications for Semiconductor Materials & Consumables
  • Rising Semiconductor Demand, Favorable Regulations & Robust Demand for Advanced Packaging Drives Growth of Packaging Materials
  • Roust Outlook for Semiconductor Advanced Packaging Technologies to Brighten Opportunities in the Upstream Packaging Materials Market: Global Semiconductor Advanced Packaging Market by Technology (In US$ Million) for Years 2022, 2024, and 2026
  • Emergence of Quantum Computing Drives the Importance of Semiconductors From Design to Materials
  • As Quantum Hardware Emerges Into an Active Area of Research, New Opportunities to Open for All in the Semiconductor Value Chain: Global Market for Quantum Computing (In US$ Million) for Years 2022, 2024, 2026 & 2028
  • Growing Demand for New Generation Smart ICs for Emerging Technologies like AI Bodes Well for Market Growth
  • Growing Focus on AI Chip Development & Production Opens a Parallel Growth Avenue for Chip Packaging Materials: Global Market for AI Chips (In US$ Billion) for Years 2022, 2024, 2026, 2028 and 2030
  • Vehicle Electronification & Autonomous Driving to Bring the Automotive Industry Into the Spotlight as One of the Fastest Growing End-Uses Sector
  • The Exciting Journey Towards Autonomous Driving is Littered with Opportunities for Automotive Semiconductors: Global Autonomous Vehicle Sales (In Units) for Years 2022, 2024 & 2026
  • 3D Packaging Emerges As a Key Driver of Growth & Innovation in the Market
  • Development New Packaging Technologies Bodes Well for Market Growth
  • IoT Ecosystem to Rev Up Opportunities for Semiconductor Advanced Packaging Technologies & Materials
  • Growing Ecosystem of IoT Devices Bodes Well for IoT Hardware Including ICs/Chips & Modules: Global Number of IoT Connected Devices (In Billion) for Years 2015, 2017, 2019, 2021, 2023, and 2025
  • Connected Aircraft to Drive the Aerospace End-Use Industry’s Appetite for Semiconductor Chips & Packaging Materials
  • Robust Outlook for the Future of Connected Aviation to Open Up Opportunities to New Generation Semiconductor Solutions: Global Number of Connected Aircraft (In Units) for the Years 2021, 2025 & 2029
  • A Quick Review of Key Market Challenges
4. GLOBAL MARKET PERSPECTIVE
  • Table 1: World Semiconductor and IC Packaging Materials Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
  • Table 2: World Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 3: World Historic Review for Semiconductor and IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 4: World 16-Year Perspective for Semiconductor and IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2024 & 2030
  • Table 5: World Recent Past, Current & Future Analysis for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 6: World Historic Review for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 7: World 16-Year Perspective for Organic Substrates by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
  • Table 8: World Recent Past, Current & Future Analysis for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 9: World Historic Review for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 10: World 16-Year Perspective for Bonding Wires by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
  • Table 11: World Recent Past, Current & Future Analysis for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 12: World Historic Review for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 13: World 16-Year Perspective for Lead frames by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
  • Table 14: World Recent Past, Current & Future Analysis for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 15: World Historic Review for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 16: World 16-Year Perspective for Ceramic Packages by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
  • Table 17: World Recent Past, Current & Future Analysis for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 18: World Historic Review for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 19: World 16-Year Perspective for Encapsulation Resins by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
  • Table 20: World Recent Past, Current & Future Analysis for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 21: World Historic Review for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 22: World 16-Year Perspective for Other Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
  • Table 23: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 24: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 25: World 16-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
  • Table 26: World Recent Past, Current & Future Analysis for Communications & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 27: World Historic Review for Communications & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 28: World 16-Year Perspective for Communications & Telecom by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
  • Table 29: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 30: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 31: World 16-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
  • Table 32: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 33: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 34: World 16-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
  • Table 35: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 36: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 37: World 16-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
III. MARKET ANALYSIS
UNITED STATES
  • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
CANADAJAPANCHINA
EUROPE
  • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
FRANCEGERMANYITALYUNITED KINGDOMREST OF EUROPE
ASIA-PACIFIC
  • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
SOUTH KOREATAIWANREST OF ASIA-PACIFICREST OF WORLDIV. COMPETITION

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • BASF SE
  • 3M Company
  • Analog Devices, Inc.
  • Amkor Technology, Inc.
  • ams AG
  • Atotech Deutschland GmbH
  • Canatu Oy
  • Adtech Ceramics
  • Carsem (M) Sdn. Bhd.
  • Ceramtec GmbH
  • Chaozhou Three-Circle (Group) Co., Ltd.
  • AMETEK Electronic Components & Packaging
  • Chipbond Technology Corporation
  • California Fine Wire Co.
  • Amtech Microelectronics, Inc.