Cold forging is one of the most used manufacturing techniques for pin fin heat sinks. Cold forging is a manufacturing process in which the aluminum or copper heat sink is formed by using localized compressed forces. Fin arrays are designed by forcing raw material into a molding die by a punch. The process confirms that no air bubbles, porosity, or any other impurities are stuck inside the material and thus, produces extremely high-quality products. A cold forged heatsink is a good alternative to casting to form complex shapes with excellent thermal conductivity. Some of the striking benefits of forging include high strength, superior surface finish, structural rigidity, close tolerance capabilities, continuity of shape, and high uniformity of material..
The factors that drive the growth of the global pin fin heat sink for IGBT market include increase in need for effective cooling of the consumer electronics by proper heat dissipation method, followed by increase in demand for huge power supply due to growing population and digitization. Furthermore, rise in demand for pin fin heat sinks owing to multiple advantages such as higher volumetric efficiency and low cost over other types of heat sinks are also expected to fuel the market growth.. In addition, increase in use of IGBT modules in the automotive field for HEVs and hybrid pin fin heat sink are expected to provide lucrative opportunities for the pin fin heat sink for IGBT market during the forecast period. However, low capacity utilization of pin fin heat sink manufacturers is affecting the growth of this market.
The global pin fin heat sink for IGBT market is segmented based on material type and region. Based on material type, it is bifurcated into copper and aluminum. By region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
The global pin fin heat sink for IGBT market is dominated by players such as Apex Microtechnology, Aavid Thermalloy LLC, Honeywell International Inc., Comair Rotron, CUI Inc., Advanced Thermal Solutions, Kunshan Googe Metal Products Co. Ltd., Allbrass Industrial, The Brass Forging Company, and others.
KEY BENEFITS FOR STAKEHOLDERS
- This study comprises analytical depiction of the global pin fin heat sink for IGBT market along with the current trends and future estimations to depict the imminent investment pockets.
- The overall market potential is determined to understand the profitable trends to gain a stronger coverage in the market.
- The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
- The current market is quantitatively analyzed from 2018 to 2025 to highlight the financial competency of the global pin fin heat sink for IGBT market.
- Porter’s five forces analysis illustrates the potency of the buyers and suppliers.
By MATERIAL TYPE
- North America
o Rest of Europe
o Rest of Asia-Pacific
o Middle East
KEY MARKET PLAYERS PROFILED
- Advanced Micro Devices (AMD)
- Apex Microtechnology
- Aavid Thermalloy, LLC
- Advanced Thermal Solutions, Inc.
- Allbrass Industrial The Brass
- CUI Inc
- Comair Rotron
- Honeywell International Inc
- Kunshan Googe Metal Products Co., Ltd.
1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. RESEARCH METHODOLOGY
1.3.1. Secondary research
1.3.2. Primary research
1.3.3. Analyst tools & models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO PERSPECTIVE
CHAPTER 3: MARKET OVERVIEW
3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS
3.2.1. Top investment pockets
3.2.2. Top winning strategies of customers of pin-fin heat sink
3.3. PORTER'S FIVE FORCES ANALYSIS
3.4. KEY PLAYER POSITIONING
3.5. MARKET DYNAMICS
220.127.116.11. Rise in need for effective cooling of the consumer electronics by proper heat dissipation method
18.104.22.168. Greater demand for pin fin heat sinks owing to its multiple advantages over other types of heat sinks
22.214.171.124. Rise in demand for power supply devices and usage of IGBTs
126.96.36.199. Low capacity utilization of pin fin heat sink manufacturers
188.8.131.52. Emerging trend of increasing usage of IGBT modules in the automotive sector for HEVs
184.108.40.206. Use of hybrid pin fin heat sink
3.6. TECHNOLOGY LANDSCAPE
3.6.1. Pin Fin Technology
3.6.2. Various Pin Fin Manufacturing Techniques
220.127.116.11. Hot and Cold Forging
18.104.22.168. Metal Injection Molding
22.214.171.124. Additive Manufacturing
3.7. COMPETITIVE LANDSCAPE
CHAPTER 4: PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE
4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country
4.3.1. Key market trends, growth factors and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country
CHAPTER 5: PIN FIN HEAT SINK FOR IGBT MARKET, BY REGION
5.2. NORTH AMERICA
5.2.1. Key market trends and opportunities
5.2.2. Market size and forecast, by material type
5.2.3. Market size and forecast, by country
126.96.36.199. Market size and forecast, by material type
188.8.131.52. Market size and forecast, by material type
184.108.40.206. Market size and forecast, by material type
5.3.1. Key market trends and opportunities
5.3.2. Market size and forecast, by material type
5.3.3. Market size and forecast, by country
220.127.116.11. Market size and forecast, by material type
18.104.22.168. Market size and forecast, by material type
22.214.171.124. Market size and forecast, by material type
126.96.36.199. Market size and forecast, by material type
5.3.8. Rest of Europe
188.8.131.52. Market size and forecast, by material type
5.4.1. Key market trends and opportunities
5.4.2. Market size and forecast, by material type
5.4.3. Market size and forecast, by country
184.108.40.206. Market size and forecast, by material type
220.127.116.11. Market size and forecast, by material type
18.104.22.168. Market size and forecast, by material type
5.4.7. Rest of Asia-Pacific
22.214.171.124. Market size and forecast, by material type
5.5.1. Key market trends and opportunities
5.5.2. Market size and forecast, by material type
5.5.3. Market size and forecast, by country
5.5.4. Latin America
126.96.36.199. Market size and forecast, by material type
5.5.5. Middle East
188.8.131.52. Market size and forecast, by material type
184.108.40.206. Market size and forecast, by material type
CHAPTER 6: SUPPLIER/MANUFACTURER: COMPANY PROFILES
6.1. APEX MICROTECHNOLOGY (HEICO CORPORATION)
6.1.1. Company overview
6.1.2. Company snapshot
6.1.3. Operating business segments
6.1.4. Product portfolio
6.1.5. Business performance
6.2. AAVID THERMALLOY, LLC (BOYD CORPORATION)
6.2.1. Company overview
6.2.2. Company snapshot
6.2.3. Product portfolio
6.2.4. Key strategic moves and developments
6.3. ADVANCED THERMAL SOLUTIONS, INC.
6.3.1. Company overview
6.3.2. Company snapshot
6.3.3. Product portfolio
6.4. ALLBRASS INDUSTRIAL
6.4.1. Company overview
6.4.2. Company snapshot
6.4.3. Product portfolio
6.5. CUI INC.
6.5.1. Company overview
6.5.2. Company snapshot
6.5.3. Operating business segments
6.5.4. Product portfolio
6.5.5. Key strategic moves and developments
6.6. COMAIR ROTRON
6.6.1. Company overview
6.6.2. Company snapshot
6.6.3. Product portfolio
6.7. HONEYWELL INTERNATIONAL INC.
6.7.1. Company overview
6.7.2. Company snapshot
6.7.3. Operating business segments
6.7.4. Product portfolio
6.7.5. Business performance
6.8. KUNSHAN GOOGE METAL PRODUCTS CO., LTD.
6.8.1. Company overview
6.8.2. Company snapshot
6.8.3. Product portfolio
CHAPTER 7: CUSTOMERS - COMPANY PROFILES
7.1. ABB LTD.
7.1.1. Company overview
7.1.2. Key Executives
7.1.3. Company snapshot
7.1.4. Operating business segments
7.1.5. R&D Expenditure
7.1.6. Business performance
7.1.7. Key strategic moves and developments
7.2. FUJI ELECTRIC CO., LTD.
7.2.1. Company overview
7.2.2. Key Executives
7.2.3. Company snapshot
7.2.4. Operating business segments
7.2.5. R&D Expenditure
7.2.6. Business performance
7.2.7. Key strategic moves and developments
7.3. HITACHI, LTD.
7.3.1. Company overview
7.3.2. Key Executives
7.3.3. Company snapshot
7.3.4. Operating business segments
7.3.5. Business performance
7.3.6. Key strategic moves and developments
7.4. INFINEON TECHNOLOGIES AG
7.4.1. Company overview
7.4.2. Key Executives
7.4.3. Company snapshot
7.4.4. Operating business segments
7.4.5. R&D Expenditure
7.4.6. Business performance
7.4.7. Key strategic moves and developments
7.5. MITSUBISHI ELECTRIC CORPORATION
7.5.1. Company overview
7.5.2. Key Executives
7.5.3. Company snapshot
7.5.4. Operating business segments
7.5.5. R&D Expenditure
7.5.6. Business performance
7.5.7. Key strategic moves and developments
7.6. ROBERT BOSCH GMBH
7.6.1. Company overview
7.6.2. Key Executives
7.6.3. Company snapshot
7.6.4. Operating business segments
7.6.5. R&D Expenditure
7.6.6. Business performance
7.6.7. Key strategic moves and developments
7.7. SEMIKRON INTERNATIONAL GMBH
7.7.1. Company overview
7.7.2. Key Executives
7.7.3. Company snapshot
7.7.4. Key strategic moves and developments
7.8. SIEMENS AG
7.8.1. Company overview
7.8.2. Key Executives
7.8.3. Company snapshot
7.8.4. Operating business segments
7.8.5. R&D Expenditure
7.8.6. Business performance
7.8.7. Key strategic moves and developments
7.9. STARPOWER EUROPE AG
7.9.1. Company overview
7.9.2. Company snapshot
7.10. UNITED AUTOMOTIVE ELECTRONICS CO., LTD. (UAES)
7.10.1. Company overview
7.10.2. Company snapshot
7.10.3. Key strategic moves and developments
*Full List of Tables and Figures Available on Enquiry.
At present, Asia-Pacific dominates the pin fin heat sink for IGBT industry owing to the need for thermal management of IGBTs. Asia-Pacific is the largest market for electronics. Furthermore, growth in awareness about environmental hazards and increase in devices to utilize the natural sources of energy are the factors further contributing to the growth of this market. China is remarkable in the global heat sinks industry owing to its market share and technology status of heat sinks. Other developing countries/regions such as India and Southeast Asia grow at a good pace owing to large population and high economic growth rate, and these economies will play important role in the future, followed by Europe. Europe is the leading region for manufacturing of automobiles, which is driving the demand for pin fin heat sinks in this region due to its application in IGBT modules in electric and hybrid electric vehicles. In addition, IGBT is a key component of high-efficiency electric energy conversion systems used in variable-speed drives, trains, power grids, and renewable energy plants, wherein efficient thermal management is critical, which is further driving the demand for pin fin heat sinks for IGBT market. Furthermore, increase in demand for largest range of heatsinks suitable for stud, modules, and capsule semiconductors as well as high power LED applications is driving the market in Europe. Based on pin fin heat sink for IGBT market analysis, the aluminum materials segment is expected to be the most lucrative segment during forecast period.
The global pin fin heat sink for IGBT market is primarily expected to grow due to the increase in utilization of IGBTs in LEDs lighting, IGBT module integrated in the electric and hybrid vehicles, continuous rise in usage of power electronic devices, adoption of motor drives, and others. Thermal management is a critical requirement of any electronics component manufacturing companies and vendors are prominently focusing on the new technologies that can improve the functionality of devices with compact sizes of the electronics without affecting the performance due to heating. Thus, there is an increase in the demand for effective heat sinks for IGBTs in the market. New developments such as hybrid pin fin heat sinks and use of Graphene for making advanced heat sinks are expected to offer significant opportunities for the market growth in the future.
Key Findings of the Pin Fin Heat Sink for IGBT Market:
Based on material type, the aluminum segment led the pin fin heat sink for IGBT market in 2018. and is anticipated to overtake the copper type in the near future, in terms of revenue.
The Asia-Pacific region dominated the global Pin Fin Heat Sink for IGBT market trends in 2018.
The key players profiled in the report include Apex Microtechnology, Aavid Thermalloy LLC, Honeywell International Inc., Comair Rotron, CUI Inc., Advanced Thermal Solutions, Kunshan Googe Metal Products Co. Ltd., Allbrass Industrial, The Brass Forging Company, and others. These market players adopted several strategies such as acquisition and business expansion to increase their pin fin heat sink for IGBT market share during the forecast period. Many key players are acquiring small manufacturers & supplier to strengthen their business capabilities in market. For instance, in January 2016, Aavid Thermalloy acquired Niagara Thermal Products LLC, which is an industry-leading provider of highly engineered thermal management solutions. This acquisition will boost its global footprint and will help benefit from a wider range of end market and customer opportunities. Moreover, many companies are expanding their product offering to deal with growing competition in market. For instance, CUI Inc. expanded its Peltier devices and dc fans, with the addition of a heat sink product line, which is available in extruded and stamped versions. This new heat sink is designed to improve the heat dissipation of low and high-power board level application.
The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.
They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.
They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:
- Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
- Scientific and technical writings for product information and related preemptions
- Regional government and statistical databases for macro analysis
- Authentic news articles and other related releases for market evaluation
- Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast
Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.