The first GaN-on-Si HEMT transistor from the world leader in power electronic components is today in mass production.
With the first applications in volume production, the GaN transistor market is becoming mature. Infineon, the world leader in power electronics, has therefore stepped in. Infineon is a new entrant in the market for power GaN-on-Silicon transistors, with these components having been developed for industrial, telecom, datacenter switch-mode power supplies (SMPS). This CoolGaN 600V technology from Infineon based on Panasonic’s patent is being unveiled. The latest device’s family is driving 600V and it is optimized for high frequency, high-efficiency power conversion, which also reduces electromagnetic interference.
The IGOT60R070D1A from Infineon uses 600V GaN on Silicon E-mode High Electron Mobility Transistors (HEMTs) in a small outline (SO) package. The CoolGaN technology allows high switching frequency, which reduces energy loss. Moreover, the high frequency helps reduce the size and weight of the passive components.
CoolGaN technology allows the integration of an electrostatic discharge protection diode, produced using the same process as the HEMT transistor. The GaN and AlGaN layers are deposited by epitaxy on a silicon substrate. The enhancement-mode power GaN transistor has a p-HEMT structure. An ingenious field plate structure is processed in the metal layer.
This complete teardown analysis includes optical and SEM pictures of metal layers, delayering of the GaN, cross-section of the HEMT part and the diode part of the die. The report also provides an estimation of the production cost of the epitaxy, HEMT and the package.
Finally, the report compares the device with other CoolGaN family’s devices and with 600V GaN on Si HEMTs from Panasonic.
- Executive Summary
- Reverse Costing Methodology
2. Company Profile
3. Physical Analysis
- Summary of the Physical Analysis
- Package analysis
- Package opening
- Package cross-section
- HEMT Die
- HEMT die view & dimensions
- HEMT die process
- HEMT die cross-section
- HEMT die process characteristic
4. Manufacturing Process
- HEMT Die Front-End Process
- HEMT Die Fabrication Unit
- Final Test and Packaging Fabrication unit
5. Cost Analysis
- Summary of the Cost Analysis
- Yields Explanation and Hypotheses
- HEMT Die
- HEMT front-end cost
- HEMT die probe test, thinning & dicing
- HEMT wafer cost
- HEMT die cost
- Complete Device
- Packaging cost
- Final test cost
6. Price Analysis
- Estimation of Selling Price
- IGOT60R070D1A Component Price
- Comparison with Others Infineon’s Components
- Comparison Between Infineon and Panasonic