Wafer backgrinding tapes fully protect the wafer surface during backgrinding and also prevent wafer surface contamination from infiltration of grinding fluid. Usage of wafer backgrinding tapes in wafer fabrication ensures precision in wafer thickness after backgrinding. Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting. Once the wafer has been processed, exposing the tape to ultraviolet light (UV) reduces its adhesive strength, making tape peeling or die pick up simple.
The factors such as increase in demand for ultra-thin wafers, rise in need for wafer fabrication, increase in focus toward wafer surface protection during grinding process, and growth in the semiconductor industry boost the growth of the wafer backgrinding tape market globally. However, increase in shift from non-UV to UV curable backgrinding tapes that increase the overall cost of wafer manufacturing is expected to hamper the market growth. Furthermore, increase in investment in wafer fabrication equipment and materials, especially in Korea and China, is expected to offer lucrative opportunities for the market expansion.
The global wafer backgrinding tape market is segmented on the basis of type, wafer size, and region. Based on type, the market is bifurcated into UV curable and non-UV tape types. Based on wafer size, the market is divided into 6-inch, 8-inch, 12-inch, and others. Based on region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.
The key players profiled in the report include Furukawa Electric Co. Ltd., Mitsui Chemicals, Inc., Nitto Denko Corporation, Minitron Elektron GMBH, Denka Company Limited, Lintec of America Inc., AI Technology, Inc., Force-One Applied Materials Inc., AMC Co, Ltd, and Pantech Tape Co., Ltd.
These key players have adopted strategies such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations to enhance their market penetration.
KEY BENEFITS FOR STAKEHOLDERS
- This study includes the analytical depiction of the global wafer back grinding market along with the current trends and future estimations to determine the imminent investment pockets.
- The report presents information regarding the key drivers, restraints, and opportunities.
- The current market is quantitatively analyzed from 2018 to 2026 to highlight the financial competency of the industry.
- Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the industry.
- UV Curable
- North America
o Rest of Europe
o South Korea
o Rest of Asia-Pacific
o Middle East & Africa
1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies
3.3. Porter’s five forces analysis
3.4. Market share analysis (2018)
3.5. Market dynamics
188.8.131.52. Increase in demand for ultra-thin wafers
184.108.40.206. Rise in need for wafer fabrication
220.127.116.11. Increase in focus toward wafer surface protection during grinding process
18.104.22.168. Growth in the semiconductor industry
22.214.171.124. Increase in cost of wafer manufacturing
126.96.36.199. Increase in investment in wafer fabrication equipment and materials
3.6. Wafer manufacturing overview
3.7. Wafer fabrication
3.7.1. Types of wafer fabrication process
188.8.131.52. Front-end process
184.108.40.206. Back-end process
3.7.2. Processes involved during wafer fabrication
220.127.116.11. Chemical Mechanical Planarization
18.104.22.168. Ion implementation
22.214.171.124. Assembly and testing
3.7.3. Wafer grinding process (wafer thinning)
3.7.4. Type of wafer thinning
126.96.36.199. Conventional grinding
3.7.5. Machines and components required during wafer backgrinding
3.8. Backgrinding tapes customer applications and usage
3.8.1. Customer applications of backgrinding tape
3.8.2. Usage of backgrinding tape
3.9. Technology trends
3.9.1. Materials used in tapes
3.9.2. Technologies used to reduce the cycle time of backgrinding process
3.9.3. Upgrades in tape manufacturing machines
CHAPTER 4: WAFER BACKGRINDING TAPE MARKET, BY TYPE
4.2. UV Curable
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country
CHAPTER 5: WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country
5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis, by country
CHAPTER 6: WAFER BACKGRINDING TAPE MARKET, BY REGION
6.2. North America
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by type
6.2.3. Market size and forecast, by wafer size
6.2.4. Market analysis, by country
188.8.131.52.1. Market size and forecast, by type
184.108.40.206.2. Market size and forecast, by wafer size
220.127.116.11.1. Market size and forecast, by type
18.104.22.168.2. Market size and forecast, by wafer size
22.214.171.124.1. Market size and forecast, by type
126.96.36.199.2. Market size and forecast, by wafer size
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by type
6.3.3. Market size and forecast, by wafer size
6.3.4. Market analysis, by country
188.8.131.52.1. Market size and forecast, by type
184.108.40.206.2. Market size and forecast, by wafer size
220.127.116.11.1. Market size and forecast, by type
18.104.22.168.2. Market size and forecast, by wafer size
22.214.171.124.1. Market size and forecast, by type
126.96.36.199.2. Market size and forecast, by wafer size
188.8.131.52.1. Market size and forecast, by type
184.108.40.206.2. Market size and forecast, by wafer size
220.127.116.11. Rest of Europe
18.104.22.168.1. Market size and forecast, by type
22.214.171.124.2. Market size and forecast, by wafer size
6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by type
6.4.3. Market size and forecast, by wafer size
6.4.4. Market analysis, by country
126.96.36.199.1. Market size and forecast, by type
188.8.131.52.2. Market size and forecast, by wafer size
184.108.40.206.1. Market size and forecast, by type
220.127.116.11.2. Market size and forecast, by wafer size
18.104.22.168.1. Market size and forecast, by type
22.214.171.124.2. Market size and forecast, by wafer size
126.96.36.199. South Korea
188.8.131.52.1. Market size and forecast, by type
184.108.40.206.2. Market size and forecast, by wafer size
220.127.116.11. Rest of Asia-Pacific
18.104.22.168.1. Market size and forecast, by type
22.214.171.124.2. Market size and forecast, by wafer size
6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by type
6.5.3. Market size and forecast, by wafer size
6.5.4. Market analysis, by country
126.96.36.199. Latin America
188.8.131.52.1. Market size and forecast, by type
184.108.40.206.2. Market size and forecast, by wafer size
220.127.116.11. Middle East & Africa
18.104.22.168.1. Market size and forecast, by type
22.214.171.124.2. Market size and forecast, by wafer size
CHAPTER 7: COMPANY PROFILES
7.1. AI TECHNOLOGY, INC.
7.1.1. Company overview
7.1.2. Company snapshot
7.1.3. Product portfolio
7.2. AMC CO., LTD
7.2.1. Company overview
7.2.2. Company snapshot
7.2.3. Product portfolio
7.3. DENKA COMPANY LIMITED
7.3.1. Company overview
7.3.2. Company snapshot
7.3.3. Operating business segments
7.3.4. Product portfolio
7.3.5. Business performance
7.4. FURUKAWA ELECTRIC CO., LTD.
7.4.1. Company overview
7.4.2. Company snapshot
7.4.3. Operating business segments
7.4.4. Product portfolio
7.4.5. Business performance
7.4.6. Key strategic moves and developments
7.5. FORCE-ONE APPLIED MATERIALS
7.5.1. Company overview
7.5.2. Company snapshot
7.5.3. Product portfolio
7.6. LINTEC OF AMERICA, INC (LINTEC CORPORATION)
7.6.1. Company overview
7.6.2. Company snapshot
7.6.3. Operating business segments
7.6.4. Product portfolio
7.6.5. Business performance
7.6.6. Key strategic moves and developments
7.7. MITSUI CHEMICALS, INC.
7.7.1. Company overview
7.7.2. Company snapshot
7.7.3. Operating business segments
7.7.4. Product portfolio
7.7.5. Business performance
7.8. NITTO DENKO CORPORATION
7.8.1. Company overview
7.8.2. Company snapshot
7.8.3. Operating business segments
7.8.4. Product portfolio
7.8.5. Business performance
7.9. PANTECH TAPE CO., LTD.
7.9.1. Company overview
7.9.2. Company snapshot
7.9.3. Product portfolio
7.10. MINITRON ELEKTRONIK GMBH
7.10.1. Company overview
7.10.2. Company snapshot
7.10.3. Product portfolio
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits. It is the process of grinding the backside of the wafer to the correct wafer thickness prior to assembly. It is also referred to as wafer thinning. Most package types in the semiconductor industry today would require a wafer thickness ranging from 8 mils to 20 mils.
Many wafer manufacturing companies focus toward improvement in conventional methods followed during wafer fabrication. In backgrinding process, many manufacturers are offering equipment for wafer handling and thinning to increase productivity. In such machines, the quality of thinned wafer depends on the spindle wheel selected for process.
North America is one of the key contributors to the wafer backgrinding tape market, owing to technological advancements, innovations, and investments in the respective industry. Wide acceptance and usage of semiconductor chips and ICs across North America is due to increase in need for smart technologies and devices. The growth in analysis of large internet-enabled data sets, advancements in sensory technologies, and increase in applications of autonomous devices is expected to boost the wafer backgrinding tape market in the region. Growth in the semiconductor industry, paired with rise in trends in data processing and power transmission propels the market growth of the U.S. wafer backgrinding tape market. The U.S. is the fastest adopter of wafer backgrinding technology, owing to which the growth of consumer electronics device, upcoming automobile technology such as electric & hybrid vehicles, healthcare monitoring systems, and others is high. Furthermore, increase in disposable income of the people in the U.S. drives the sales of the equipped wafers, chips, and ICs, which further propels the growth of the wafer backgrinding tape market in the region. U.S. has the presence of companies such as Sensera, Microchip, Intel, Maxim, and others, which makes it a lucrative market.
Based on wafer backgrinding analysis, UV curable segment has generated the highest revenue in 2018 followed by non-UV segment, mentioned in the report.
Asia-Pacific has a considerable share in the wafer backgrinding tape market and is expected to be the fastest growing regional segment in the near future, with the highest CAGR. With an increase in demand for high voltage operating devices, organizations across verticals are realizing the importance of driver IC to ensure power management. High demand for automated switching devices and power modules is expected to be the key trend that is anticipated to influence the market growth. In addition, emerging countries such as India, Philippines, and others are expected to offer lucrative opportunities for the growth of the wafer backgrinding tape industry. India has a very fast-growing electronics system design manufacturing (ESDM) industry. India also has a strong design base with more than 120 units. According to the Department of Electronics and Information Technology (DEITY), nearly 2,000 chips are being designed every year in India and more than 20,000 engineers are working on various aspects of chip design and verification.
Key Findings of the Wafer Backgrinding Tape Market:
Based on type, the UV curable segment generated the highest revenue global wafer backgrinding tape market in 2018.
Based on wafer size, the 12-inch segment generated the highest revenue in the market in 2018.
Based on region, the Asia Pacific region generated the highest revenue in the market in 2018.
The key wafer backgrinding tape market leaders profiled in the report include Furukawa Electric Co. Ltd., Mitsui Chemicals, Inc., Nitto Denko Corporation, Minitron Elektron GMBH, Denka Company Limited, Lintec of America Inc., AI Technology, Inc., Force-One Applied Materials Inc., AMC Co, Ltd, and Pantech Tape Co., Ltd.
These key players adopt several strategies such as new product launch and development, acquisition, partnership and collaboration, and business expansion to increase the wafer backgrinding tape market share during the forecast period. In March 2017, Furukawa Electric developed plasma masked back grind tape, a new type of semiconductor tape, which will help to improve the quality of the semiconductor. This product protects the surface of the wafer during semiconductor wafer back grinding. In addition, in April 2017, LINTEC launched Back Grinding Tape Laminator RAD-3520F/12 that protects circuit surface of the wafer during the back grinding and thinning process of the semiconductor wafer after circuit formation. This product laminates tapes for protecting the circuit sides of wafer during back grinding or thinning process of wafers.
The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.
They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.
They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:
- Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
- Scientific and technical writings for product information and related preemptions
- Regional government and statistical databases for macro analysis
- Authentic news articles and other related releases for market evaluation
- Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast
Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.