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Global IC Packaging Applications and Outsourced Semiconductor and Test (OSAT) Markets - 2019 Edition

  • ID: 4850514
  • Report
  • September 2019
  • Region: Global
  • 300 Pages +
  • New Venture Research
A New Comprehensive Report Covering Critical Market Segments of the Global IC Packaging Industry

FEATURED COMPANIES

  • 3D Plus
  • ASE
  • ChipMOS
  • Hana Microelectronics
  • OSE
  • SPEL Semiconductor
  • MORE

Global Electronics Market Overview

  • Economic Overview
  • Semiconductor Industry Analysis

Electronics Summary Forecasts, 2018-2023

  • By Total Assembly Value
  • By Applications Market

Semiconductor Application Market Forecasts, 2018-2023

  • Unit Shipments and Revenue
  • By Semiconductor Device
  • By IC Packaging Type
  • By Application Segment

OSAT IC Packaging Market Forecasts, 2018-2023

  • IC Packaging Type by Unit Shipments, Revenues and ASP
  • Competitive Rankings
  • 39 Company Profiles

In the manufacturing of integrated circuits, the role played by the back-end assembly process has changed considerably over the decades. Once important only as a protective housing for the delicate IC devices, IC packages have come to be regarded as integral to the functioning of the ICs, and instrumental in determining the types of electronics we all will purchase in the future.

For more than twenty years, the publisher has provided high quality, in-depth analysis of the IC packaging market. Continuing in that long tradition, the publisher announces a new report for 2019: Global IC Packaging Applications and Outsourced Semiconductor and Test (OSAT) Markets. This report delves deeply into two critical market segments. The first focus is on the broad domain of applications for which ICs are developed, as well as the end-user electronics products that use ICs. The second focus of the report is on the category of companies known as outsourced semiconductor assembly and test companies, usually referred to by the acronym OSATs, and presents the publisher's continuing coverage of this expanding sector of the semiconductor market.

The purpose of the report is to provide an analysis of the major application trends affecting the electronics industry, and detailed forecasts of the major application segments - Consumer, Computer, Communications, Automotive, and Industrial & Other. It also surveys numerous specific electronics product markets, such as smartphones, tablets, PCs, TVs and other consumer products, and automotive components. In addition, the report analyzes the strategies and IC packaging products shipped by OSATs, with forecasts of unit shipments, revenues and ASP. Every table in the report presents historical data for 2018 and forecasts the market for the five-year period, 2019 - 2023.

The 300-page report consists of seven chapters. Chapter 1, "Introduction," and Chapter 2, "Executive Summary.” Chapter 3, "Global Electronics Market Trends and Forecasts" presents a critical industry analysis at the global economy today and the broad economic and market trends driving the semiconductor industry. It also details the key electronics products markets for IC devices.

Forecast tables provide not only unit shipments of nearly 30 electronics market segments, but for many the unit shipments of ICs and IC revenues, as well.

Chapter 4, "Overview of the Worldwide IC Packaging Market" describes in detail the many IC packaging market segments and provides forecasts of the worldwide market in terms of packaging types, I/O count and IC devices. This sets the stage for Chapter 5, "IC Applications Analysis," which examines semiconductor device applications and IC packaging applications in terms of unit shipments and revenues.

In Chapter 6, "OSAT Market and Strategy Analysis," the report examines the history of outsourcing in the semiconductor market and the emergence of the OSAT contractors, as a major factor in the IC packaging market. The chapter presents the market shares for the leading OSATs and analyzes their product marketing strategies. Tables present forecasts of the OSAT market in terms of unit shipments, revenues and package pricing. Finally, Chapter 7, "OSAT Company Profiles" presents concise profiles of nearly 40 OSAT companies, providing a cross-section of both large and small competitors, as well as companies specializing in both conventional IC packaging and leading-edge advanced IC packaging products.

Global IC Packaging Applications and Outsourced Semiconductor and Test (OSAT) Markets - 2019 Edition is an effective and economical tool for any company interested in competing in the semiconductor industry as an aid in assessing the present and future of this dynamic industry.

Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • 3D Plus
  • ASE
  • ChipMOS
  • Hana Microelectronics
  • OSE
  • SPEL Semiconductor
  • MORE

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Global Electronics Market Trends and Forecasts

  • Recent Global Electronics Economic Trends
  • Global Economy/Government Policy Impacts
  • Technology Impacts
  • Global Electronics Market
  • Electronic Industry Summary Forecasts
  • Computers
    • Personal Computers, Tablets/E-readers, Servers, Workstations, Enterprise Storage Systems, Flash/Hard Drives, Monitors, Printers, Other Computer Applications
  • Communications
    • Cellular Handsets, Communications Infrastructure, Carrier Class Switches, Other Phones, DSL/Cable Modems, Other Communications Applications
  • Consumer
    • Digital Televisions, Set-top Boxes, Camcorders, DVD/DVR Players, Digital Cameras, Console Video Games, MP3/MP4 Players, Audio/Video and Smart Home Products, Consumer IoT Products, Other
  • Consumer Applications
    • Automotive, Industrial, Medical, Commercial Aviation/Defense and Other Transportation, Home/Commercial/Government Internet of Things, and Industrial and Other IC Devices

Chapter 4: Overview of the IC Devices and Packaging Market

  • Semiconductor Sector Industry Trends
  • Worldwide IC Devices Market
  • Processors, Logic, Memory, Analog
  • Worldwide IC Packaging Market
    • Dual In-Line Packages
    • Transistor Outline and Small Outline Transistor
    • Packages
    • Small Outline Packaging Families
    • Chip Carriers
    • Flat Pack Packages
    • Pin Grid Array Packages
    • Ball Grid Array Packages
    • Wafer-Level Packages
    • Direct Chip Attach

Chapter 5: IC Applications Analysis

  • Semiconductor Device Applications Trends
    • Overview, Total Application Market Forecast, Consumer, Automotive, Computer, Communications, Industrial and Other Forecasts
  • IC Device Applications Market Analysis
    • Total Devices Market Segments, and Processor, Other Logic, Memory, Analog Devices Applications
  • IC Packaging Applications Market Analysis
    • Dual In-Line Packages, Transistor Outline and Small Outline Transistor Packages, Small Outline Packaging Families, Chip Carriers, Flat Pack Packages, Pin Grid Array Packages, Ball Grid Array Packages, Wafer-Level Packages, Direct Chip Attach
  • Flip Chip Interconnection Application Trends

Chapter 6: OSAT Market and Strategy Analysis

  • Outsourcing in the Semiconductor Market
    • Emergence of Fabless Manufacturing
    • Outsourcing IC Packaging
  • Semiconductor Industry Consolidation
  • OSAT Market Forecasts
    • OSAT Unit Shipments
    • OSAT Revenues
    • OSAT Average Packaging Prices
  • Success Strategies for OSATs
  • Market Leaders Strategies

Chapter 7 OSAT Company Profiles

  • 3D Plus
  • Deca Technologies
  • Advotech
  • AIC Semiconductor
  • Amkor Technology
  • ANST China
  • Shinko Electric
  • Signetics
  • Sigurd Microelectronics
  • SPiL
  • SPEL Semiconductor
  • Tera Probe
  • FlipChip Int’l
  • Greatek Electronics
  • Hana Microelectronics
  • HANA Micron
  • ASE
  • Integra Technologies
  • Azimuth
  • Carsem
  • Chant World Technology
  • China Wafer Level CSP
  • ChipMOS
  • Cirtek
  • Tianshui Huatian Tech
  • TongFu Microelectronics
  • TSMC
  • Unisem
  • UTAC
  • Walton Advanced Engineering
  • Xintec
  • Interconnect Systems
  • Jiangsu Changjiang Electronics
  • Lingsen Precision Industries
  • Nepes Corp.
  • OSE
  • Palomar Technologies
Note: Product cover images may vary from those shown
  • 3D Plus
  • Advotech
  • AIC Semiconductor
  • Amkor Technology
  • ANST China
  • ASE
  • Azimuth
  • Carsem
  • Chant World Technology
  • China Wafer Level CSP
  • ChipMOS
  • Cirtek
  • Deca Technologies
  • FlipChip Int’l
  • Greatek Electronics
  • Hana Microelectronics
  • HANA Micron
  • Integra Technologies
  • Interconnect Systems
  • Jiangsu Changjiang Electronics
  • Lingsen Precision Industries
  • Nepes Corp.
  • OSE
  • Palomar Technologies
  • Shinko Electric
  • Signetics
  • Sigurd Microelectronics
  • SPEL Semiconductor
  • SPiL
  • Tera Probe
  • Tianshui Huatian Tech
  • TongFu Microelectronics
  • TSMC
  • Unisem
  • UTAC
  • Walton Advanced Engineering
  • Xintec
Note: Product cover images may vary from those shown

The publisher's forecasts are developed using a four-step approach. First, expectations of world economic growth are set based upon historical data and forecasts obtained from published International Monetary Fund (IMF) reports.

Next, a top-down forecast of electronics industry growth is built. This analysis is based primarily on historical data obtained from the Semiconductor Industry Association (SIA) and World Semiconductor Trade Statistics (WSTS). Because semiconductor content is at the core of electronics products, semiconductor data is a good triangulation point for total assembly value. This data is augmented with information on passive content and estimates of labor and overhead.

Then, a bottom-up forecast is developed for each of the products in each segment. This is accomplished by first creating a unit forecast for each product based on historical data and various industry-leader opinions regarding future growth prospects for each product. A model of the assembly value of each product is then built using teardown analyses and price-based models. The unit volume times the assembly value per unit equals the total assembly value for each product - often referred to as the cost of goods sold (COGS).

Finally, the first three steps are reiterated to achieve a coherent forecast. The forecasts developed by this process are presented in all their industry reports.

 

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