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Global Semiconductor Silicon Wafer Market

  • ID: 4852346
  • Report
  • Region: Global
  • 163 pages
  • BCC Research
1 of 5

FEATURED COMPANIES

  • 3M
  • Disco Corp.
  • Lintec Corp.
  • Samsung
  • Sumco Corp.
  • Tsmc
  • MORE
Report Scope:

This report forecasts the market for compound semiconductor wafers for 2018-2023. The report presents the market forecast in terms of dollar value ($ million) and shipment volume (msi).

Dollar value and shipment volume are broken down along the following end uses:
  • Telecommunications.
  • Instrumentation and scientific research.
  • Healthcare.
  • Energy, defense and surveillance.
  • Computing and entertainment.
  • Industrial and automotive.
  • Retail and others.
Each of the end applications is further broken down by crystal growth methods:
  • Bridgman and allied methods (Bridgman).
  • Float-zone (FZ).
  • Czochralski (CZ) and allied methods (Czochralski).
Each end application is broken down by the following wafer-bonding methods:
  • Direct bonding.
  • Surface-activated bonding.
  • Anodic bonding.
  • Plasma bonding.
Each end application is further broken down by node size:
  • 10 nm and lower.
  • 12 to 22 nm.
  • 28 nm and above.
Each end-application is further broken down by regional market:
  • Americas.
  • Europe, Middle East and Africa (EMEA).
  • Asia Pacific (APAC).
Report Includes:
  • 72 data tables and 10 additional tables
  • An overview of the global markets for semiconductor silicon wafers
  • Analyses of global market trends, with data from 2017, 2018, and projections of compound annual growth rates (CAGRs) through 2023
  • Identification of potential applications of semiconductor silicon wafers in consumer electronics, telecommunications, automotive, defence, and healthcare industry
  • Overview of various bonding technologies in the semiconductor silicon wafers industry, including direct bonding, surface activated bonding, plasma activated bonding and anodic bonding
  • Coverage of major innovation initiatives in silicon wafer fabrication technology
  • Detailed analysis of major vendors and suppliers of the industry, including 3M, Global Wafers Co., Ltd., Mechatronik Systemtechnik GmbH, Nissan Chemical Corporation, Samsung, Shanghai Simgui Technology, Toshiba and Wafer World Inc
Note: Product cover images may vary from those shown
2 of 5

FEATURED COMPANIES

  • 3M
  • Disco Corp.
  • Lintec Corp.
  • Samsung
  • Sumco Corp.
  • Tsmc
  • MORE
Chapter 1 Introduction
  • Study Goals and Objectives
  • Reasons for Doing the Study
  • Scope of the Report
  • Intended Audience
  • Methodology and Information Sources
  • Geographic Breakdown
  • Analyst's Credentials
  • Custom Research
  • Related Reports
Chapter 2 Executive Summary

Chapter 3 Semiconductor Device Manufacturing and Material Properties
  • Steps in Semiconductor Device Manufacturing
  • Wafering
  • Fabrication
  • Packaging
  • Silicon (Si)
  • Silicon and the Periodic Table
  • The Carbon Family
  • Silicon
  • Compound Semiconductors
  • Gallium Arsenide (GaAs)
  • Indium Phosphide (InP)
  • Gallium Nitride (GaN)
  • Group II-VI: Oxides, Sulfides, Selenides and Tellurides
  • Group IV: Silicon-Based Compounds and Alloys
  • Gate Definition Methodology
  • Transistor-Transistor Logic (TTL)
  • Complementary Metal Oxide Semiconductor (CMOS)
  • Field Effect Transistor (FET)
  • Metal Oxide/Insulator Semiconductor Field Effect Transistor (MISFET/MOSFET)
  • Bipolar CMOS (BiCMOS)
  • Metal Semiconductor Field Effect Transistor (MESFET)
  • High Electron Mobility Transistor (HEMT)
  • Hetero-Junction Bipolar Transistor (HBT)
  • Wafer Sizing
  • The 450 mm Wafer Challenge
Chapter 4 Crystal Growth Methods
  • Introduction
  • Czochralski (CZ) and Related Methods
  • Methodology
  • Key Vendors and Innovations
  • Bridgman-Stockbarger and Related Methods
  • Methodology
  • Key Vendors and Innovations
  • Float Zone (FZ) and Allied Methods
  • Methodology
  • Key Vendors and Innovations
  • Market Overview
  • Post-Crystal Growth Wafer Processing
  • Ingot Formation, Grinding and Trimming
  • Wafer Slicing and Rounding
  • Lapping
Chapter 5 Wafer-Bonding Process
  • Direct Bonding
  • Methodology
  • Advantages
  • Surface-Activated Bonding (SAB)
  • Methodology
  • Advantages
  • Plasma-Activated Bonding (PAB)
  • Methodology
  • Advantages
  • Anodic Bonding
  • Methodology
  • Advantages
  • Market Overview
Chapter 6 Node Sizes
  • Introduction
  • Overview of the Etching Process
  • Equipment Involved
  • Process Challenges
  • Moore's Law
  • 10 nm and Less
  • Architecture
  • Key Developments
  • 12 nm to 22 nm
  • Architecture
  • Key Developments
  • 28 nm and More
  • Architecture
  • Key Developments
  • Market Overview
Chapter 7 Regional Markets
  • Americas
  • User Profile
  • Macroeconomic Overview
  • Key Companies
  • EMEA
  • User Profile
  • Macroeconomic Overview
  • Key Companies
  • APAC
  • User Profile
  • Macroeconomic Overview
  • Key Companies
  • Market Overview
Chapter 8 Global Markets
  • Telecommunications
  • Market Overview
  • Breakdown by Crystal Growth Method
  • Breakdown by Wafer-Bonding Method
  • Breakdown by Node Size
  • Breakdown by Regional Market
  • Instrumentation and Scientific Research
  • Market Overview
  • Breakdown by Crystal Growth Method
  • Breakdown by Wafer-Bonding Method
  • Breakdown by Node Size
  • Breakdown by Regional Market
  • Healthcare
  • Market Overview
  • Breakdown by Crystal Growth Method
  • Breakdown by Wafer-Bonding Method
  • Breakdown by Node Size
  • Breakdown by Regional Market
  • Energy, Defense and Surveillance
  • Market Overview
  • Breakdown by Crystal Growth Method
  • Breakdown by Wafer-Bonding Method
  • Breakdown by Node Size
  • Breakdown by Regional Market
  • Computing and Entertainment
  • Market Overview
  • Breakdown by Crystal Growth Method
  • Breakdown by Wafer-Bonding Method
  • Breakdown by Node Size
  • Breakdown by Regional Market
  • Industrial and Automotive
  • Market Overview
  • Breakdown by Crystal Growth Method
  • Breakdown by Wafer-Bonding Method
  • Breakdown by Node Size
  • Breakdown by Regional Market
  • Retail and Others
  • Market Overview
  • Breakdown by Crystal Growth Method
  • Breakdown by Wafer-Bonding Method
  • Breakdown by Node Size
  • Breakdown by Regional Market
Chapter 9 Patent Analysis
  • Introduction
  • Breakdown by Category
  • Breakdown by Year
  • Breakdown by Country
  • Profile of Assignees
Chapter 10 Company Profiles
  • Wafer Manufacturing and Processing Equipment Vendors
  • Pricing Dynamics
  • Key Companies
  • Semiconductor Material Suppliers
  • Pricing Dynamics
  • Key Companies
  • Additive Materials Suppliers
  • Pricing Dynamics
  • Key Companies
  • Wafer Manufacturers
  • Pricing Dynamics
  • Key Companies
  • Foundries and Semiconductor Device Designers
  • Pricing Dynamics
  • Key Companies
  • Companies
  • 3M
  • II-VI Epiworks
  • Aixtron
  • Applied Materials
  • Alineason
  • Brewer Science Inc.
  • CMK SRO
  • Disco Corp.
  • Electronics And Materials Corp. Ltd (E&M)
  • Elkem
  • EV Group
  • Globalwafers Japan Co. Ltd.
  • Hemlock Semiconductor Corp.
  • Kokusai Electric
  • Intel
  • Lintec Corp.
  • Mechatronik Systemtechnik Gmbh
  • Micron
  • Nichia Corp.
  • Nissan Chemical Corp.
  • Okmetic
  • Powerchip
  • Samsung
  • Shanghai Simgui Technology
  • Shin-Etsu Chemical Co. Ltd.
  • Siltronix Silicon Technologies
  • Silicon Materials Inc.
  • Silicon Valley Microelectronics
  • Siltronic Ag
  • SK Hynix
  • SK Siltron
  • Soitec
  • Sumco Corp.
  • Suss Micro Tec Ag
  • Synova
  • Thermcraft
  • Tokuyama Corp.
  • Toshiba
  • TSMC
  • Ulvac Inc.
  • UMC
  • Virginia Semiconductor
  • Wacker Chemie Ag
  • Wafer Works Corp.
  • Wafer World Inc
List of Tables
Summary Table: Global Market for Semiconductor Wafers, Through 2023
Table 1: Physical Properties of the Main Compound Semiconductor Materials Compared to Silicon
Table 2: Group III-V Compound Semiconductors, by Chemical Composition
Table 3: Group II-VI Compound Semiconductors, by Chemical Composition
Table 4: Group IV Compound Semiconductors
Table 5: Other Compounds: Semiconductors, by Chemical Composition
Table 6: Global Market for Semiconductor Wafers, by Crystal Growth Method, Through 2023
Table 7: Global Market Volume for Semiconductor Wafers, by Crystal Growth Method, Through 2023
Table 8: Global Market for Semiconductor Wafers, by Wafer-Bonding Method, Through 2023
Table 9: Global Market Volume for Semiconductor Wafers, by Wafer-Bonding Method, Through 2023
Table 10: Global Market for Semiconductor Wafers, by Node Size, Through 2023
Table 11: Global Market Volume for Semiconductor Wafers, by Node Size, Through 2023
Table 12: Global Market for Semiconductor Wafers, by Region, Through 2023
Table 13: Global Market Volume for Semiconductor Wafers, by Region, Through 2023
Table 14: Global Market for Semiconductor Wafers in Telecommunications End-Use Applications, Through 2023
Table 15: Global Market for Semiconductor Wafers in Telecommunication End-Use Applications, by Crystal Growth Method, Through 2023
Table 16: Global Market Volume for Semiconductor Wafers in Telecommunications End-Use Applications, by Crystal Growth Method, Through 2023
Table 17: Global Market for Semiconductor Wafers in Telecommunication End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 18: Global Market Volume for Semiconductor Wafers, in Telecommunications End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 19: Global Market for Semiconductor Wafers in Telecommunication End-Use Applications, by Node Size, Through 2023
Table 20: Global Market Volume for Semiconductor Wafers in Telecommunications End-Use Applications, by Node Size, Through 2023
Table 21: Global Market for Semiconductor Wafers in Telecommunications End-Use Applications, by Region, Through 2023
Table 22: Global Market Volume for Semiconductor Wafers in Telecommunications End-Use Applications, by Region, Through 2023
Table 23: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, Through 2023
Table 24: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Crystal Growth Method, Through 2023
Table 25: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Crystal Growth Method, Through 2023
Table 26: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 27: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 28: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Node Size, Through 2023
Table 29: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Node Size, Through 2023
Table 30: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Region, Through 2023
Table 31: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Region, Through 2023
Table 32: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, Through 2023
Table 33: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, by Crystal Growth Method, Through 2023
Table 34: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Crystal Growth Method, Through 2023
Table 35: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 36: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 37: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, by Node Size, Through 2023
Table 38: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Node Size, Through 2023
Table 39: Global Market for Semiconductor Wafers in Healthcare End-Use Applications by Region, Through 2023
Table 40: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Region, Through 2023
Table 41: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, Through 2023
Table 42: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Crystal Growth Method, Through 2023
Table 43: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Crystal Growth Method, Through 2023
Table 44: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 45: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 46: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Node Size, Through 2023
Table 47: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Node Size, Through 2023
Table 48: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Region, Through 2023
Table 49: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Region, Through 2023
Table 50: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, Through 2023
Table 51: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Crystal Growth Method, Through 2023
Table 52: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Crystal Growth Method, Through 2023
Table 53: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 54: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 55: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Node Size Through 2023
Table 56: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Node Size, Through 2023
Table 57: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Region, Through 2023
Table 58: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Region, Through 2023
Table 59: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, Through 2023
Table 60: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Crystal Growth Method, Through 2023
Table 61: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Crystal Growth Method, Through 2023
Table 62: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 63: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 64: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Node Size, Through 2023
Table 65: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Node Size, Through 2023
Table 66: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Region, Through 2023
Table 67: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Region, Through 2023
Table 68: Global Market for Semiconductor Wafers in Retail and Other End-Use Applications, Through 2023
Table 69: Global Market for Semiconductor Wafers in Retail and Others End-Use Applications, by Crystal Growth Method, Through 2023
Table 70: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Crystal Growth Method, Through 2023
Table 71: Global Market for Semiconductor Wafers in Retail and Other End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 72: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 73: Global Market for Semiconductor Wafers in Retail and Other End-Use Applications, by Node Size, Through 2023
Table 74: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Node Size, Through 2023
Table 75: Global Market for Semiconductor Wafers in Retail and Others End-Use Applications, by Region, Through 2023
Table 76: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Region, Through 2023
Table 77: U.S. Patents on Semiconductor Wafer Technologies, by Patent Category, 1976 Through Aug. 2018
Table 78: U.S. Patent Trends: Semiconductor Wafer Technologies, by Year Granted, 1976 Through Aug. 2018
Table 79: U.S. Patent Shares of Semiconductor Wafer Technologies, by Assignee’s Country, 1976 Through Aug. 2018
Table 80: U.S. Patent Holders of Semiconductor Wafer Technologies, 1976 Through Aug. 2018
Table 81: Patent Holders with Three or More U.S. Patents on Food Processing and Food Packaging Technologies, 1976 Through July 2018

List of Figures
Summary Figure: Global Market for Semiconductor Wafers, Through 2017-2023
Note: Product cover images may vary from those shown
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4 of 5

FEATURED COMPANIES

  • 3M
  • Disco Corp.
  • Lintec Corp.
  • Samsung
  • Sumco Corp.
  • Tsmc
  • MORE

Semiconductor wafers covered in this report include silicon and compound semiconductor materials. Stability in the ASP will be largely due to price escalation in silicon wafers in 2018-2019. Compound semiconductor wafers, on the other hand, will witness a steady decline in ASP. Silicon wafer manufacturing requires substantive investment and long gestation periods. Consequently, there are only a few wafer manufacturers large enough to influence pricing. The rest cater mainly to niche markets. Another pertinent observation is that the scale of operations in silicon wafers is substantially higher than in compound semiconductors. The ASP of silicon wafers is also much lower. There is an ever-growing pressure on silicon availability due to demand from the solar/photovoltaic (PV) cell industry. Superior material properties of specific compound semiconductors have prompted designers to increasingly look toward compound semiconductors.

The low ASP of silicon wafers is primarily due to the abundant availability of silicon for compound semiconductors; notwithstanding the pressure exerted by solar/PV cell industry. It should also be remembered that compound semiconductors are in demand in the solar/PV cell industry, though not to the same extent as silicon. There is an additional factor that lowers the ASP of silicon wafers. Presently, silicon wafers, alone, are available in 300 mm diameters, commercially. This is in sharp contrast to compound semiconductors. Even 200 mm wafer sizes are yet to achieve mainstream status. Greater diameters translate into greater surface area. This ultimately translates into greater yield. While the requirement for semiconductor materials increases proportionally to the square of the ratio of diameters; materials account for only a fraction of the overall manufacturing process cost. Other contributing factors to the manufacturing cost do not increase it to the same extent. It is always attractive, operationally, to work with larger diameters. The advantage of working with larger diameters is more pronounced for silicon wafers as the basic material cost is lower than that of compound semiconductors. Consequently, a comparable increase in yield is achieved with much lower incremental costs for silicon, compared to compound semiconductors.

For ASP movement, wafer manufacturers have historically resorted to a steady annual reduction in wafer prices followed by an occasional rise (once every few years) in response to rising input costs. This spike in prices is followed by a steady decline, yearly, which is expected as the input costs stabilize and manufacturers benefit from the depreciation of equipment. The spike in prices in 2018-2019 however, is expected to be sharp enough to keep prices on an even keel in 2023, compared to 2018 levels.

Note: Product cover images may vary from those shown
5 of 5
  • 3M
  • Aixtron
  • Alineason
  • Applied Materials
  • Brewer Science Inc.
  • Cmk Sro
  • Disco Corp.
  • Electronics And Materials Corp. Ltd (E&M)
  • Elkem
  • Ev Group
  • Globalwafers Japan Co. Ltd.
  • Hemlock Semiconductor Corp.
  • Ii-Vi Epiworks
  • Intel
  • Kokusai Electric
  • Lintec Corp.
  • Mechatronik Systemtechnik Gmbh
  • Micron
  • Nichia Corp.
  • Nissan Chemical Corp.
  • Okmetic
  • Powerchip
  • Samsung
  • Shanghai Simgui Technology
  • Shin-Etsu Chemical Co. Ltd.
  • Silicon Materials Inc.
  • Silicon Valley Microelectronics
  • Siltronic Ag
  • Siltronix Silicon Technologies
  • Sk Hynix
  • Sk Siltron
  • Soitec
  • Sumco Corp.
  • Suss Micro Tec Ag
  • Synova
  • Thermcraft
  • Tokuyama Corp.
  • Toshiba
  • Tsmc
  • Ulvac Inc.
  • Umc
  • Virginia Semiconductor
  • Wacker Chemie Ag
  • Wafer Works Corp.
  • Wafer World Inc
Note: Product cover images may vary from those shown
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