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3D IC Market by Substrate type for Information and Communication Technology, Military, Consumer Electronics and Others Applications: Global Industry Perspective, Comprehensive Analysis, Size, Share, Growth, Segment, Trends and Forecast, 2016 - 2022

  • ID: 4853174
  • Report
  • March 2017
  • Region: Global
  • 110 pages
  • Zion Market Research
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Global 3D IC market report includes comprehensive and profound analysis on the global and regional level. The study gives historic data of the year 2015 and forecast for 2017-2022 on the basis of revenue (USD Million). Assessment of market dynamics gives a brief thought about the drivers, restraints, and opportunities of global 3D IC market. 

In order to give a comprehensive view of the 3D IC market, we have incorporated competitive landscape, value chain analysis, and analysis of Porter’s Five Forces model for this market. The study includes a market attractiveness analysis, in which product segments and application segments are assessed on the basis of their market size, general attractiveness, and growth rate.

The report provides company market share analysis in order to give a broader overview of the key players in the market. Additionally, the report also covers strategic developments of the market including acquisitions & mergers, new product launch, agreements, partnerships, collaborations & joint ventures and research & development, product & regional expansion.

The study provides a decisive view on the 3D IC market by segmenting the market based on product substrate type, substrate, applications, and regions. All the segments have been analyzed based on present and future trends and the market is estimated from 2016 to 2022. Based on the product the market is segmented into LED, memories, MEMS, sensor, logic and others. Key application market covered under this study includes information and communication technology, military, consumer electronics and others applications. The regional segmentation includes the current and forecast demand for Asia-Pacific, Europe, North America, Latin America and Middle East & Africa.

Some of the key players in 3D IC market include 3M Company, Tezzaron Semiconductor Corporation, Samsung, Taiwan Semiconductor Manufacturing Company, Ltd., Xilinx, United Microelectronics Corporation, STMicroelectronics and amongst others.

 This report segments the global 3D IC market as follows:

3D IC Market: Product Segment Analysis

  • LED
  • Memories
  • MEMS
  • Sensor
  • Logic
  • Others

3D IC Market: Substrate Type Segment Analysis

  • Silicon on Insulator (SOI)
  • Bulk Silicon

3D IC Market: Application Segment Analysis

  • Information and Communication Technology
  • Military
  • Consumer Electronics
  • Others

3D IC Market: Regional Segment Analysis

  • North America
  • U.S.
  • Europe
  • UK
  • France
  • Germany
  • Asia Pacific
  • China
  • Japan
  • India
  • Latin America
  • Brazil
  • Middle East and Africa
Note: Product cover images may vary from those shown
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  • Chapter 1. Introduction
    • 1.1. Report description and scope
    • 1.2. Research scope
    • 1.3. Research methodology
      • 1.3.1. Market research process
      • 1.3.2. Market research methodology
  • Chapter 2. Executive Summary
    • 2.1. Global 3D IC market, 2016 – 2022 (USD Million)
    • 2.2. Global 3D IC market : Snapshot
  • Chapter 3. 3D IC – Market Dynamics
    • 3.1. Introduction
    • 3.2. Value Chain Analysis
    • 3.3. Market drivers
      • 3.3.1. Global 3D IC market drivers: Impact analysis
      • 3.3.2. Growing demand from consumer electronics and ICT
      • 3.3.3. Increasing number of portable devices such as smartphone, tablets etc.
    • 3.4. Market restraints
      • 3.4.1. Global 3D IC market restraints: Impact analysis
      • 3.4.2. Increasing competition with newest technologies
      • 3.4.3. High cost and thermal conductivity issues
    • 3.5. Opportunities
      • 3.5.1. Increasing application areas globally
      • 3.5.2. Emerging IT analytics in Asia Pacific region
    • 3.6. Porter’s five forces analysis
      • 3.6.1. Bargaining power of suppliers
      • 3.6.2. Bargaining power of buyers
      • 3.6.3. Threat from new entrants
      • 3.6.4. Threat from new substitutes
      • 3.6.5. Degree of competition
    • 3.7. Market attractiveness analysis
      • 3.7.1. Market attractiveness analysis, by product segment
      • 3.7.2. Market attractiveness analysis, by substrate type segment
      • 3.7.3. Market attractiveness analysis, by application segment
      • 3.7.4. Market attractiveness analysis, by regional segment
  • Chapter 4. Global 3D IC Market – Competitive Landscape
    • 4.1. Company market share analysis
      • 4.1.1. Global 3D IC market: company market share, 2016
    • 4.2. Strategic Development
      • 4.2.1. Acquisitions & Mergers
      • 4.2.2. New Product Launch
      • 4.2.3. Agreements, Partnerships, Collaborations and Joint Ventures
      • 4.2.4. Research and Development, Product and Regional Expansion
  • Chapter 5. Global 3D IC Market – Product Segment Analysis
    • 5.1. Global 3D IC market: product overview
      • 5.1.1. Global 3D IC market revenue share, by product, 2016 and 2022
    • 5.2. LED
      • 5.2.1. Global LED for 3D IC market, 2016 – 2022 (USD Million)
    • 5.3. Memories
      • 5.3.1. Global memories for 3D IC market, 2016 – 2022 (USD Million)
    • 5.4. MEMS
      • 5.4.1. Global MEMS for 3D IC market, 2016 – 2022 (USD Million)
    • 5.5. Sensor
      • 5.5.1. Global sensor for 3D IC market, 2016 – 2022 (USD Million)
    • 5.6. Logic
      • 5.6.1. Global logic for 3D IC market, 2016 – 2022 (USD Million)
    • 5.7. Others
      • 5.7.1. Global others product for 3D IC market, 2016 – 2022 (USD Million)
  • Chapter 6. Global 3D IC Market – Substrate Type Segment Analysis
    • 6.1. Global 3D IC market: substrate type overview
      • 6.1.1. Global 3D IC market revenue share, by substrate type, 2016 and 2022
    • 6.2. Silicon On Insulator
      • 6.2.1. Global silicon on insulator for 3D IC market, 2016 – 2022 (USD Million)
    • 6.3. Bulk Silicon
      • 6.3.1. Global bulk silicon for 3D IC market, 2016 – 2022 (USD Million)
  • Chapter 7. Global 3D IC Market – Application Segment Analysis
    • 7.1. Global 3D IC market: Application overview
      • 7.1.1. Global 3D IC market revenue share, by application, 2015 and 2020
    • 7.2. Information and Communication Technology
      • 7.2.1. Global 3D IC market for information and communication technology, 2016 – 2022 (USD Million)
    • 7.3. Military
      • 7.3.1. Global 3D IC market for military, 2016 – 2022(USD Million)
    • 7.4. Consumer Electronics
      • 7.4.1. Global medical & healthcare market for consumer electronics, 2016 – 2022 (USD Million)
    • 7.5. Others
      • 7.5.1. Global 3D IC market for others application, 2016 - 2022(USD Million)
  • Chapter 8. Global 3D IC Market – Regional Segment Analysis
    • 8.1. Global 3D IC market: Regional overview
      • 8.1.1. Global 3D IC market revenue share, by region, 2016 and 2022
    • 8.2. North America
      • 8.2.1. North America 3D IC market revenue, by product, 2016 – 2022 (USD Million)
      • 8.2.2. North America 3D IC market revenue, by substrate type , 2016 – 2022 (USD Million)
      • 8.2.3. North America 3D IC market revenue, by application, 2016 – 2022 (USD Million)
    • 8.3. Europe
      • 8.3.1. Europe 3D IC market revenue, by product , 2016 – 2022 (USD Million)
      • 8.3.2. Europe 3D IC market revenue, by substrate type , 2016 – 2022 (USD Million)
      • 8.3.3. Europe 3D IC market revenue, by application, 2016 – 2022 (USD Million)
    • 8.4. Asia Pacific
      • 8.4.1. Asia Pacific 3D IC market revenue, by product, 2016 – 2022, (USD Million)
      • 8.4.2. Asia Pacific 3D IC market revenue, by substrate type , 2016 – 2022, (USD Million)
      • 8.4.3. Asia Pacific 3D IC market revenue, by application, 2016 – 2022, (USD Million)
    • 8.5. Latin America
      • 8.5.1. Latin America 3D IC market revenue, by product , 2016 – 2022(USD Million)
      • 8.5.2. Latin America 3D IC market revenue, by substrate type , 2016 – 2022(USD Million)
      • 8.5.3. Latin America 3D IC market revenue, by application, 2016 – 2022(USD Million)
    • 8.6. Middle East and Africa
      • 8.6.1. Middle East and Africa 3D IC market revenue, by product, 2016 – 2022 (USD Million)
      • 8.6.2. Middle East and Africa 3D IC market revenue, by substrate type, 2016 – 2022 (USD Million)
      • 8.6.3. Middle East and Africa 3D IC market revenue, by application, 2016 – 2022(USD Million)
  • Chapter 9. Company Profile
    • 9.1. 3M Company
      • 9.1.1. Overview
      • 9.1.2. Financials
      • 9.1.3. Product portfolio
      • 9.1.4. Business strategy
      • 9.1.5. Recent developments
    • 9.2. Tezzaron Semiconductor Corporation
      • 9.2.1. Overview
      • 9.2.2. Financials
      • 9.2.3. Product portfolio
      • 9.2.4. Business strategy
      • 9.2.5. Recent developments
    • 9.3. Samsung
      • 9.3.1. Overview
      • 9.3.2. Financials
      • 9.3.3. Product portfolio
      • 9.3.4. Business strategy
      • 9.3.5. Recent developments
    • 9.4. Taiwan Semiconductor Manufacturing Company, Ltd.
      • 9.4.1. Overview
      • 9.4.2. Financials
      • 9.4.3. Product portfolio
      • 9.4.4. Business strategy
      • 9.4.5. Recent developments
    • 9.5. Xilinx
      • 9.5.1. Overview
      • 9.5.2. Financials
      • 9.5.3. Product portfolio
      • 9.5.4. Business strategy
      • 9.5.5. Recent developments
    • 9.6. United Microelectronics Corporation
      • 9.6.1. Overview
      • 9.6.2. Financials
      • 9.6.3. Product portfolio
      • 9.6.4. Business strategy
      • 9.6.5. Recent developments
    • 9.7. STMicroelectronics
      • 9.7.1. Overview
      • 9.7.2. Financials
      • 9.7.3. Product portfolio
      • 9.7.4. Business strategy
      • 9.7.5. Recent developments
    • 9.8. MonolithIC 3D Inc.
      • 9.8.1. Overview
      • 9.8.2. Financials
      • 9.8.3. Product portfolio
      • 9.8.4. Business strategy
      • 9.8.5. Recent developments
Note: Product cover images may vary from those shown
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