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Innovations in Neuromorphic Computing, GaNtronics, Advanced Data Storage, Wearables, VCSEL, and Processors

  • ID: 4876834
  • Report
  • November 2019
  • Region: Global
  • 32 Pages
  • Frost & Sullivan
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This Microelectronics TechVision Opportunity Engine (TOE) profiles advancements in neuromorphic computing, GaNtronics, advanced data storage, wearables, VCSEL, and processors. Innovations include advancements neuromorphic chips, gallium arsenide-based electronics, printing technology for developing curvy electronics, advancements in optical data storage and NVMe-oF Storage, wearables, implantable chips, VCSEL, and processors.

The Microelectronics TechVision Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility, and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Note: Product cover images may vary from those shown
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Advances in Neuromorphic Computing, GaNtronics, Advanced Data Storage, Wearables, VCSEL, and Processors

  • Novel Neuromorphic Chip Technology for Internet-of-Things and Artificial Intelligence Applications
  • Impact Across Various Industries and Growth Opportunities
  • Gallium Arsenide Technology for 5G Front-end Applications
  • Impact Across Various Industries and Growth Opportunities
  • Innovative Printing Technology for Developing Curvy Electronics
  • Impact Across Various Industries and Growth Opportunities
  • Novel Radio Frequency Identification Technology for Wireless Applications
  • Impact Across Various Industries and Growth Opportunities
  • Optical Storage Disc Integrates Backward Compatibility and Enables High Capacity Storage
  • Application Diversity and Analyst Viewpoint
  • NVMe-oF Storage Platform with High Availability and Without a Single Point of Failure
  • Application Diversity and Analyst Viewpoint
  • Wearable Smart Ring Uses Bone Conduction to Act as a Personal Assistant
  • Application Diversity and Analyst Viewpoint
  • Wearable Smart Earbud Integrates AI to Translate Languages in Real-Time
  • Application Diversity and Analyst Viewpoint
  • Implantable Chip to Improve Conditions of Paralytic Patients
  • Applications of Implantable Chips
  • Wafer-level Optoelectronic Testing for VCSELs
  • Applications of VCSELs
  • Transformative Electronics for Next-generation Wearables
  • Applications of Stretchable Electronic Solutions
  • Parallel Processing Technology for Autonomous Applications
  • Applications of Multi-core Chipsets
  • Key Contacts
Note: Product cover images may vary from those shown
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