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Global Automotive Body Electronics Market: Regional Prospects, Investment Analysis, Opportunities, Trends, FDI, Import and Export Analysis, Entry Strategies and Forecast up to 2025

  • ID: 4899512
  • Report
  • December 2019
  • Region: Global
  • 280 pages
  • Infinium Global Research
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FEATURED COMPANIES

  • Continental AG
  • FUJITSU
  • Hyundai Mobile
  • Lear Corporation
  • NXP Semiconductors N.V.
  • STMicroelectronics
  • MORE
The automotive industry has experienced a significant advancement. It shows that automakers have been making abundant efforts to explore new growth opportunities through the improvement of car performance, which is driven by the increasingly stringent regulatory requirements. With the auto industry evolving towards, the development of auto electronics and technology innovation mainly focus on energy saving and environmental protection, safety, and comfort, communications, and entertainment, which has a positive impact on the growth of the automotive body electronics market. Automotive body electronics are mainly applied for the control of automotive body systems such as SRS, safety belts, seating, doors, windows, locks, and rearview mirrors.

The report provides an overview and, the current status of the automotive electronics industry and the development trends of selected segments. The report on the global automotive body electronics market covers segments such as component, body features, and application. The application segment covered in this report includes passive safety, driver assistance, passenger comfort, vehicle security system, infotainment systems, and chassis electronics. The driver assistance segment accounts for the maximum share of the market, which is about 29% of the total Share. The technological advancement of the automotive body electronics provided in the report gives a better picture of the future market. Further, stringent government regulations regarding driver safety and security along with the growing inclusion of road safety systems have elevated the market at a global level. Moreover, increasing consumer inclination towards luxury and hybrid vehicles and the integration of autonomous technologies in automobiles are escalating the demand for the automotive body electronics market across the globe.

An increase in demand for vehicle comfort and increasing production drives the growth of the automotive body electronics market. In addition, government laws regarding pollution and demand for ADAS equipped vehicles are fueling the growth of the automotive body electronics market. Now a day’s functional safety design support increasingly expected as the OEM’s are looking to optimize seat position, close windows and roof systems based upon input from vehicle sensors. Furthermore, the reduction in fuel consumption and emissions is increasing rapidly with the introduction of the start-stop system in the vehicle that automatically shuts down and restarts the IC engine reduces fuel consumption. However, malfunctioning of the system and economic slowdown is likely to hamper the growth of the automotive body electronics market. Furthermore, the introduction of the new inbuilt technologies in the car features are anticipated to create several growth opportunities for the key players in the automotive body electronics market. On the other hand, leveraging their technological advantages, many information technology companies have crossed over into the auto industry to promote the informatization and intelligent development of vehicles.

A market attractiveness analysis is provided in the report on the automotive body electronics market. The market attractiveness is dependent on the market size and growth rate of the industry. There are some additional factors including the number of competitors, pricing and operating margins, which affect the attractiveness of the market.

The Asia-Pacific was the most lucrative region for the automotive body electronics market and was accountable for 36.96% of the total market share in 2018. The emerging economies such as China, India, and Japan accommodate a significant population of electronic and automotive manufacturers. This is the primary factor that has a positive impact on the Asia Pacific automotive body electronics market. China is constructing a 100 km long highway with dedicated lanes for autonomous and semi-autonomous vehicles. By 2020, this infrastructure will host numerous electric vehicles that will employ an innumerable sensor and electric equipment that will assist these vehicles in toll payments, handling speed limits, and understanding the traffic. Moreover, several automotive manufacturers from North America contribute to the economy of the countries through the electronics industry. Furthermore, the presence of European companies such as Infineon Technologies AG, Robert Bosch GmbH and Delphi Automotive PLC is likely to lead the demand of Europe automotive body electronics market over the forecast period. On the other hand, countries in South America such as Brazil, Colombia, Brazil, Chile, Argentina are focusing on new technology vehicles.

The report provides profiles of the companies in the global automotive body electronics market such as Robert Bosch, Continental AG, DENSO Corporation, Hyundai Mob, HELLA, NXP Semiconductors, Texas Instruments, Renesas Technology Corp, Infineon Technologies, Cypress Semiconductor, STMicroelectronics, ZF, Dallas Semiconductors, Fujitsu Semiconductor, and Microsemi.
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Continental AG
  • FUJITSU
  • Hyundai Mobile
  • Lear Corporation
  • NXP Semiconductors N.V.
  • STMicroelectronics
  • MORE
1 Preface
1.1 Introduction
1.1.1 Segmentation and Research Scope
1.1.2 Definition, Abbreviations, and Assumptions
1.2 Research Methodology
1.2.1 Methodology
1.2.2 Research Methodology: An Outline
1.3 Research Approaches

2 Executive Summary
2.1 Global Automotive Body Electronics Market Highlights, (USD Billion)
2.2 Global Automotive Body Electronics Market Projection
2.3 Investment and Revenue Pockets
2.4 Global Automotive Body Electronics Market Regional Opportunities

3 Market Overview & Competitiveness
3.1 DRO Analysis
3.1.1 Drivers
3.1.1.1 Stringent Government Regulation Regarding Driver Safety and Security is Likely to Have Positive
3.1.1.2 Growing GDP and Increasing Adoption of Electric Vehicles
3.1.2 Restraints
3.1.2.1 Economic Slowdown in Developed Countries
3.1.3 Opportunities
3.1.3.1 Introduction of the New Inbuilt Technologies in the Car Features
3.2 Value Chain Analysis and Opportunities
3.2.1 Value Chain Analysis Framework
3.2.2 Investment Opportunities in the Value Chain
3.3 Market Attractiveness Analysis
3.3.1 Market Attractiveness Analysis by Region
3.3.2 Market Attractiveness Analysis by Component
3.3.3 Market Attractiveness Analysis by Body Features
3.3.4 Market Attractiveness Analysis by Application
3.4 Market Structures by Regions
3.4.1 North America
3.4.2 Europe
3.4.3 Asia-Pacific
3.4.4 Middle East and Africa
3.4.5 South America
3.5 Global Automotive Body Electronics Market Competitive Landscape and Leading Companies
3.5.1 Top 10 Companies in the World by Market Share or Market Presence
3.5.2 Key Marketing Strategies Analysis
3.5.3 Top 20 Industry Developments
3.6 Company Profiles
3.6.1 Robert Bosch GmbH
3.6.1.1 Overview
3.6.1.2 Company Snapshot
3.6.1.3 Revenue Comparison
3.6.1.4 Revenue, by Segments
3.6.1.5 Revenue, by Countries
3.6.1.6 Product Portfolio
3.6.1.7 Recent Developments
3.6.2 Continental AG
3.6.2.1 Overview
3.6.2.2 Company Snapshot
3.6.2.3 Revenue Comparison
3.6.2.4 Revenue, by Segments
3.6.2.5 Revenue, by Countries
3.6.2.6 Product Portfolio
3.6.3 DENSO Corporation
3.6.3.1 Overview
3.6.3.2 Company Snapshot
3.6.3.3 Revenue Comparison
3.6.3.4 Revenue, by Segments
3.6.3.5 Revenue, by Countries
3.6.3.6 Product Portfolio
3.6.3.7 Recent Developments
3.6.4 Hyundai Mobile
3.6.4.1 Overview
3.6.4.2 Company Snapshot
3.6.4.3 Revenue Comparison
3.6.4.4 Product Portfolio
3.6.4.5 Recent Developments
3.6.5 HELLA GmbH & Co. KGaA
3.6.5.1 Overview
3.6.5.2 Company Snapshot
3.6.5.3 Revenue Comparison
3.6.5.4 Revenue, by Segments
3.6.5.5 Revenue, by Countries
3.6.5.6 Product Portfolio
3.6.6 NXP Semiconductors N.V.
3.6.6.1 Overview
3.6.6.2 Company Snapshot
3.6.6.3 Revenue Comparison
3.6.6.4 Revenue, by Segments
3.6.6.5 Revenue, by Countries
3.6.6.6 Product Portfolio
3.6.6.7 Recent Developments
3.6.7 Texas Instruments
3.6.7.1 Overview
3.6.7.2 Company Snapshot
3.6.7.3 Revenue Comparison
3.6.7.4 Revenue, by Segments
3.6.7.5 Revenue, by Countries
3.6.7.6 Product Portfolio
3.6.8 Renesas Electronics Corporation
3.6.8.1 Overview
3.6.8.2 Company Snapshot
3.6.8.3 Revenue Comparison
3.6.8.4 Revenue, by Segments
3.6.8.5 Revenue, by Countries
3.6.8.6 Product Portfolio
3.6.9 Infineon Technologies AG
3.6.9.1 Overview
3.6.9.2 Company Snapshot
3.6.9.3 Revenue Comparison
3.6.9.4 Revenue, by Segments
3.6.9.5 Revenue, by Countries
3.6.9.6 Product Portfolio
3.6.10 Cypress Semiconductor Corporation
3.6.10.1 Overview
3.6.10.2 Company Snapshot
3.6.10.3 Revenue Comparison
3.6.10.4 Revenue, by Segments
3.6.10.5 Revenue, by Countries
3.6.10.6 Product Portfolio
3.6.11 STMicroelectronics
3.6.11.1 Overview
3.6.11.2 Company Snapshot
3.6.11.3 Revenue Comparison
3.6.11.4 Revenue Breakdown, by Segment
3.6.11.5 Revenue, by Region
3.6.11.6 Product Portfolio
3.6.12 ZF Friedrichshafen AG
3.6.12.1 Overview
3.6.12.2 Company Snapshot
3.6.12.3 Revenue Comparison
3.6.12.4 Revenue Breakdown, by Segment
3.6.12.5 Revenue, by Region
3.6.12.6 Product Portfolio
3.6.12.7 Recent Developments
3.6.13 FUJITSU
3.6.13.1 Overview
3.6.13.2 Company Snapshot
3.6.13.3 Revenue Comparison
3.6.13.4 Revenue Breakdown, by Segment
3.6.13.5 Revenue, by Region
3.6.13.6 Product Portfolio
3.6.14 Microsemi Corporation
3.6.14.1 Overview
3.6.14.2 Company Snapshot
3.6.14.3 Revenue Comparison
3.6.14.4 Revenue Breakdown, by Segment
3.6.14.5 Product Portfolio
3.6.15 Lear Corporation
3.6.15.1 Overview
3.6.15.2 Company Snapshot
3.6.15.3 Revenue Comparison
3.6.15.4 Revenue, by Region
3.6.15.5 Product Portfolio

4. Global Automotive Body Electronics Market: Regional Prospects, Investment Analysis, Opportunities, Trends, FDI, Import and Export Analysis, Entry Strategies and Forecast up to 2025
4.1 Overview
4.1.1 Market Sizing and General Trends
4.1.2 Matrix
4.1.2.1 by Region
4.1.2.2 by Component
4.1.2.3 by Body Features
4.1.2.4 by Application

5. Global Automotive Body Electronics Market, by Region
5.1 Overview
5.2 North America Automotive Body Electronics Market
5.2.1 North America Automotive Body Electronics Market, by Components
5.2.2 North America Automotive Body Electronics Market, by Body Features
5.2.3 North America Automotive Body Electronics Market, by Application
5.2.4 North America Automotive Body Electronics Market, by Country
5.2.4.1 The U.S.
5.2.4.1.1 Legal and Government Framework
5.2.4.1.2 Import Export Data and Top 5 Export Destinations
5.2.4.1.3 Tax and Tariff Structure
5.2.4.1.4 FDI Norms
5.2.4.1.5 FDI Current Vs Past and Prospects
5.2.4.1.6 Procedures for Investment in the U.S.
5.2.4.1.7 Modes of Entry in the U.S.
5.2.4.1.8 PESTEL Analysis (PPP)
5.2.4.1.9 Factor Analysis
5.2.4.1.10 Porter Diamond Model
5.3 Europe Automotive Body Electronics Market
5.3.1 Europe Automotive Body Electronics Market, by Components
5.3.2 Europe Automotive Body Electronics Market, by Body Features
5.3.3 Europe Automotive Body Electronics Market, by Application
5.3.4 Europe Automotive Body Electronics Market, by Country
5.3.4.1 Germany
5.3.4.1.1 Legal and Government Framework
5.3.4.1.2 Import Export Data and Top 5 Export Destinations
5.3.4.1.3 Tax and Tariff Structure
5.3.4.1.4 FDI Norms
5.3.4.1.5 FDI Current Vs Past and Prospects
5.3.4.1.6 Procedures for Investment in Germany
5.3.4.1.7 Modes of Entry in Germany
5.3.4.1.8 Pestel Analysis (PPP)
5.3.4.1.9 Factor Analysis
5.3.4.1.10 Porter Diamond Model
5.3.4.2 The U.K.
5.3.4.2.1 Legal and Government Framework
5.3.4.2.2 Import Export Data and Top 5 Export Destinations
5.3.4.2.3 Tax and Tariff Structure
5.3.4.2.4 FDI Norms
5.3.4.2.5 FDI Current Vs Past and Prospects
5.3.4.2.6 Procedures for Investment in the U.K.
5.3.4.2.7 Modes of Entry in the U.K.
5.3.4.2.8 Pestel Analysis (PPP)
5.3.4.2.9 Factor Analysis
5.3.4.2.10 Porter Diamond Model
5.4 Asia-Pacific Automotive Body Electronics Market
5.4.1 Asia-Pacific Automotive Body Electronics Market, by Components
5.4.2 Asia-Pacific Automotive Body Electronics Market, by Body Features
5.4.3 Asia-Pacific Automotive Body Electronics Market, by Application
5.4.4 Asia-Pacific Automotive Body Electronics Market, by Country
5.4.4.1 China
5.4.4.1.1 Legal and Government Framework
5.4.4.1.2 Import Export Data and Top 5 Export Destinations
5.4.4.1.3 Tax and Tariff Structure
5.4.4.1.4 FDI Norms
5.4.4.1.5 FDI Current Vs Past and Prospects
5.4.4.1.6 Procedures for Investment in China
5.4.4.1.7 Modes of Entry in China
5.4.4.1.8 Pestel Analysis (PPP)
5.4.4.1.9 Factor Analysis
5.4.4.1.10 Porter Diamond Model
5.4.4.2 Japan
5.4.4.2.1 Legal and Government Framework
5.4.4.2.2 Import Export Data and Top 5 Export Destinations
5.4.4.2.3 Tax and Tariff Structure
5.4.4.2.4 FDI Norms
5.4.4.2.5 FDI Current Vs Past and Prospects
5.4.4.2.6 Procedures for Investment in Japan
5.4.4.2.7 Modes of Entry in Japan
5.4.4.2.8 PESTEL Analysis (PPP)
5.4.4.2.9 Factor Analysis
5.4.4.2.10 Porter Diamond Model
5.4.4.3 India
5.4.4.3.1 Legal and Government Framework
5.4.4.3.2 Import Export Data and Top 5 Export Destinations
5.4.4.3.3 Tax and Tariff Structure
5.4.4.3.4 FDI Norms
5.4.4.3.5 FDI Current Vs Past and Prospects
5.4.4.3.6 Procedures for Investment in India
5.4.4.3.7 Modes of Entry in India
5.4.4.3.8 PESTEL Analysis (PPP)
5.4.4.3.9 Factor Analysis
5.4.4.3.10 Porter Diamond Model
5.4.4.4 South Korea
5.4.4.4.1 Legal and Government Framework
5.4.4.4.2 Import Export Data and Top 5 Export Destinations
5.4.4.4.3 Tax and Tariff Structure
5.4.4.4.4 FDI Norms
5.4.4.4.5 FDI Current Vs Past and Prospects
5.4.4.4.6 Procedures for Investment in South Korea
5.4.4.4.7 Modes of Entry in South Korea
5.4.4.4.8 PESTEL Analysis (PPP)
5.4.4.4.9 Factor Analysis
5.4.4.4.10 Porter Diamond Model
5.5 MEA Automotive Body Electronics Market
5.5.1 MEA Automotive Body Electronics Market, by Components
5.5.2 MEA Automotive Body Electronics Market, by Body Features
5.5.3 MEA Automotive Body Electronics Market, by Application
5.5.4 MEA Automotive Body Electronics Market, by Country
5.5.4.1 Saudi Arabia
5.5.4.1.1 Legal and Government Framework
5.5.4.1.2 Import Export Data and Top 5 Export Destinations
5.5.4.1.3 Tax and Tariff Structure
5.5.4.1.4 FDI Norms
5.5.4.1.5 FDI Current Vs Past and Prospects
5.5.4.1.6 Procedures for Investment in Saudi Arabia
5.5.4.1.7 Modes of Entry in Saudi Arabia
5.5.4.1.8 PESTEL Analysis (PPP)
5.5.4.1.9 Factor Analysis
5.5.4.1.10 Porter Diamond Model
5.6 South America Automotive Body Electronics Market
5.6.1 South America Automotive Body Electronics Market, by Components
5.6.2 South America Automotive Body Electronics Market, by Body Features
5.6.3 South America Automotive Body Electronics Market, by Application
5.6.4 South America Automotive Body Electronics Market, by Country
5.6.4.1 Brazil
5.6.4.1.1 Legal and Government Framework
5.6.4.1.2 Import Export Data and Top 5 Export Destinations
5.6.4.1.3 Tax and Tariff Structure
5.6.4.1.4 FDI Norms
5.6.4.1.5 FDI Current Vs Past and Prospects
5.6.4.1.6 Procedures for Investment in Brazil
5.6.4.1.7 Modes of Entry in Brazil
5.6.4.1.8 PESTEL Analysis (PPP)
5.6.4.1.9 Factor Analysis
5.6.4.1.10 Porter Diamond Model

6. Global Automotive Body Electronics Market, by Components
6.1 Overview
6.2 MCU
6.3 ICs
6.4 Sensors
6.5 DC-DC converters
6.6 Other Components

7. Global Automotive Body Electronics Market, by Body Features
7.1 Overview
7.2 Windows and Door Modules
7.3 Seating Modules
7.4 Roof Module Control
7.5 Light Control
7.6 Wiper and Mirror Module
7.7 Auto HVAC
7.8 Remote Keyless Entry

8. Global Automotive Body Electronics Market, by Application
8.1 Overview
8.2 Passive Safety
8.3 Driver Assistance
8.4 Passenger Comfort
8.5 Vehicle Security System
8.6 Infotainment Systems
8.7 Chassis Electronics

9. Strategic Recommendations

10. Conclusion

11. Appendix
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  • Robert Bosch GmbH
  • Continental AG
  • DENSO Corporation
  • Hyundai Mobile
  • HELLA GmbH & Co. KGaA
  • NXP Semiconductors N.V.
  • Texas Instruments
  • Renesas Electronics Corporation
  • Infineon Technologies AG
  • Cypress Semiconductor Corporation
  • STMicroelectronics
  • ZF Friedrichshafen AG
  • FUJITSU
  • Microsemi Corporation
  • Lear Corporation
Note: Product cover images may vary from those shown
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