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Technology Landscape, Trends and Opportunities in the Global HDI PCB Market

  • ID: 5003439
  • Report
  • September 2020
  • Region: Global
  • 150 pages
  • Lucintel
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FEATURED COMPANIES

  • AT&S
  • DAP Corporation
  • Ibiden Group
  • Meiko Electronics Co. Ltd
  • SEMCO
  • Siemens AG
  • MORE
The technologies in HDI PCB market have undergone significant change in recent years, traditional low density to advance high density PCBs. The rising wave of new technologies, such as 10+ layer technology are creating significant potential in smartphone, tablets, and automotive applications, and driving the demand for HDI PCB technologies.

In HDI PCB market, various technologies, such as 4-6 layers, 8-10 layers, and 10+ layers are used in various applications. Growth in consumer electronics, miniaturization of electronic devices, increasing demand for high performance PCBs, and growing adoption of advanced electronics and safety measures in the automotive are creating new opportunities for various HDI PCB technologies.

This report analyzes technology maturity, degree of disruption, competitive intensity, market potential, and other parameters of various technologies in the HDI PCB market.

The study includes technology readiness, competitive intensity, regulatory compliance, disruption potential, trends, forecasts and strategic implications for the global HDI PCB technology by application, technology, and region as follows:

Technology Readiness by Technology Type

Competitive Intensity and Regulatory Compliance

Disruption Potential by Technology Type

Trends and Forecasts by Technology Type [$M shipment analysis for 2013 to 2024]:
  • 4-6 Layer
  • 8-10 Layer
  • 10+ Layer
Trends and Forecasts by Application [$M shipment analysis for 2013 to 2024]:
  • Smartphone and Tablets
  • 4-6 Layer
  • 8-10 Layer
  • 10+ Layer
  • Telecom/Datacom
  • 4-6 Layer
  • 8-10 Layer
  • 10+ Layer
  • Computer
  • 4-6 Layer
  • 8-10 Layer
  • 10+ Layer
  • Consumer Electronics
  • 4-6 Layer
  • 8-10 Layer
  • 10+ Layer
  • Automotive
  • 4-6 Layer
  • 8-10 Layer
  • 10+ Layer
Trends and Forecasts by Region [$M shipment analysis for 2013 to 2024]:
  • North America
  • United States
  • Canada
  • Mexico
  • Europe
  • United Kingdom
  • Germany
  • France
  • Asia Pacific
  • Japan
  • China
  • South Korea
  • India
  • The Rest of the World
Latest Developments and Innovations HDI PCB Technologies

Companies/Ecosystems

Strategic Opportunities by Technology Type

Some of the companies profiled in this report include Siemens AG, Compeq Manufacturing Co. Ltd., TTM Technologies, Inc., Unimicron, AT&S, Ibiden Group, SEMCO, Unitech Printed Circuit Board Corp., Tripod Technology Corp., DAP Corporation, and Meiko Electronics Co. Ltd

This report answers the following 9 key questions:
Q.1 What are some of the most promising and high-growth technology opportunities for the HDI PCB market?
Q.2 Which technology will grow at a faster pace and why?
Q.3 What are the key factors affecting dynamics of different technologies? What are the drivers and challenges of these technologies in HDI PCB market?
Q.4 What are the levels of technology readiness, competitive intensity and regulatory compliance in this technology space?
Q.5 What are the business risks and threats to these technologies in HDI PCB market?
Q.6 What are the latest developments in HDI PCB technologies? Which companies are leading these developments?
Q.7 Which technologies have potential of disruption in this market?
Q.8 Who are the major players in this HDI PCB market? What strategic initiatives are being implemented by key players for business growth?
Q.9 What are strategic growth opportunities in this HDI PCB technology space?
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • AT&S
  • DAP Corporation
  • Ibiden Group
  • Meiko Electronics Co. Ltd
  • SEMCO
  • Siemens AG
  • MORE
1. Executive Summary

2. Technology Landscape
2.1. Technology Background and Evolution
2.2. Technology and Application Mapping
2.3. Supply Chain

3. Technology Readiness
3.1. Technology Commercialization and Readiness
3.2. Drivers and Challenges in HDI PCB Technologies
3.3. Competitive Intensity
3.4. Regulatory Compliance

4. Technology Trends and Forecasts Analysis from 2013-2024
4.1. HDI PCB Opportunity
4.2. Technology Trends (2013-2018) and Forecasts (2019-2024)
4.2.1. 4-6 Layer
4.2.2. 8-10 Layer
4.2.3. 10+ Layer
4.3. Technology Trends (2013-2018) and Forecasts (2019-2024) by Application Segments
4.3.1. Smartphone and Tablets
4.3.1.1. 4-6 Layer
4.3.1.2. 8-10 Layer
4.3.1.3. 10+ Layer
4.3.2. Telecom/Datacom
4.3.2.1. 4-6 Layer
4.3.2.2. 8-10 Layer
4.3.2.3. 10+ Layer
4.3.3. Computer
4.3.3.1. 4-6 Layer
4.3.3.2. 8-10 Layer
4.3.3.3. 10+ Layer
4.3.4. Consumer Electronics
4.3.4.1. 4-6 Layer
4.3.4.2. 8-10 Layer
4.3.4.3. 10+ Layer
4.3.5. Automotive
4.3.5.1. 4-6 Layer
4.3.5.2. 8-10 Layer
4.3.5.3. 10+ Layer

5. Technology Opportunities (2013-2024) by Region
5.1. HDI PCB Market by Region
5.2. North American HDI PCB Technology Market
5.2.1. Canadian HDI PCB Technology Market
5.2.2. Mexican HDI PCB Technology Market
5.3. European HDI PCB Technology Market
5.3.1. German HDI PCB Technology Market
5.3.2. French HDI PCB Technology Market
5.4. APAC HDI PCB Technology Market
5.4.1. Chinese HDI PCB Technology Market
5.4.2. Japanese HDI PCB Technology Market
5.4.3. Indian HDI PCB Technology Market
5.4.4. South Korean HDI PCB Technology Market
5.5. ROW HDI PCB Technology Market

6. Latest Developments and Innovations in the HDI PCB Technologies

7. Companies/Ecosystem
7.1. Product Portfolio Analysis
7.2. Market Share Analysis
7.3. Geographical Reach

8. Strategic Implications
8.1. Implications
8.2. Growth Opportunity Analysis
8.2.1. Growth Opportunities for the HDI PCB Market by Technology
8.2.2. Growth Opportunities for the HDI PCB Market by Application
8.2.3. Growth Opportunities for the HDI PCB Market by Region
8.3. Emerging Trends in the HDI PCB Market
8.4. Disruption Potential
8.5. Strategic Analysis
8.5.1. New Product Development
8.5.2. Capacity Expansion of the HDI PCB Market
8.5.3. Mergers, Acquisitions, and Joint Ventures in the HDI PCB Market

9. Company Profiles of Leading Players
9.1. Siemens AG
9.2. Compeq Manufacturing Co. Ltd.
9.3. TTM Technologies, Inc.
9.4. Unimicron
9.5. AT&S
9.6. Ibiden Group
9.7. SEMCO
9.8. Unitech Printed Circuit Board Corp.
9.9. Tripod Technology Corp.
9.10. DAP Corporation
9.11. Meiko Electronics Co. Ltd

*Full List of Figures and Tables Available on Enquiry.
Note: Product cover images may vary from those shown
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  • Siemens AG
  • Compeq Manufacturing Co. Ltd.
  • TTM Technologies, Inc.
  • Unimicron
  • AT&S
  • Ibiden Group
  • SEMCO
  • Unitech Printed Circuit Board Corp.
  • Tripod Technology Corp.
  • DAP Corporation
  • Meiko Electronics Co. Ltd
Note: Product cover images may vary from those shown
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The analyst has been in the business of market research and management consulting since 2000 and has published over 600 market intelligence reports in various markets/applications and served over 1,000 clients worldwide. Each study is a culmination of four months of full-time effort performed by the analyst team. The analysts used the following sources for the creation and completion of this valuable report:

  • In-depth interviews of the major players in the market
  • Detailed secondary research from competitors’ financial statements and published data
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of professionals, who have analyzed and tracked the market over the years.

Extensive research and interviews are conducted in the supply chain of the market to estimate market share, market size, trends, drivers, challenges and forecasts.

Thus, the analyst compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. The analyst then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process.

 

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