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Power Discrete and Modules Market By Type, Component, Material and Industry Vertical: Global Opportunity Analysis and Industry Forecast, 2019-2026

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    Report

  • 333 Pages
  • February 2020
  • Region: Global
  • Allied Market Research
  • ID: 5019952
The global power discrete and modules market size was valued at $20.75billion in 2018, and is projected to reach $35.92 billion by 2026, growing at a CAGR of 6.40% from 2019 to 2026. While power discrete are single semiconductor devices such as diodes or transistors used to regulate voltages with lower power consumption and reduced heat generation, power modules are power controlling circuit elements integrated on an isolated-base package optimized in size to deliver high number of watts in the least amount of space.



IGBT, a power module, is a power switching transistor constructed to combine the high input impedance and high switching speeds of MOSFET with the low saturation voltage of BJT. IGBT is capable of handling large collector-emitter currents with virtually zero gate current drive. The increase in applications of IGBT in consumer electronics, automotive, energy & power, and industries boosts the growth of the power discrete and modules market. Moreover, growth of power electronics in small gadgets fuels the further growth of the power discrete and modules market.

The demand for power discrete and module is expected to increase rapidly during the forecast period, owing to various factors such as an increase in demand for power electronics modules across various industry verticals, increase in emphasis on power saving, and emergence and growth of electric vehicles. However, lack of a material availability such as GaN is estimated to hamper the market growth. Nonetheless, rise in number of government initiatives in HVDC and smart grids and technological advancement of power MOSFET are expected to provide lucrative growth opportunities to the power discrete and modules market players.

The global power discrete and modules market is segmented on the basis of type, component, material, industry vertical, and region. The type segment is bifurcated into power discrete and power module. Based on component, the market is categorized into thyristor, diode, rectifier, MOSFET, IGBT, and others. The material segment is bifurcated into SiC, GaN, and others. Based on industry vertical, the market is categorized into telecommunication; industrial; automotive; renewable; consumer &enterprise; military, defense, &aerospace; and medical. On the basis of region, it is analyzed across North America (the U.S., Mexico, and Canada), Europe (the UK, Germany, France, and rest of Europe), Asia-Pacific (China, India, Japan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).

The key players operating in the power discrete and module market are Infineon Technologies AG, Mitsubishi Electric Corporation, Toshiba Corporation, ON Semiconductor, STMicroelectronics, NXP Semiconductors, Renesas Electronics Corporation, Texas Instruments, ROHM Semiconductors, and Semtech Corporation.

KEY MARKET SEGMENTS

By Type
  • Power Discrete
  • Power Module

By Component
  • Thyristor
  • Diode
  • Rectifier
  • MOSFET
  • IGBT
  • Other

By Material
  • SiC
  • GaN
  • Others

By Industry Vertical
  • Telecommunication
  • Industrial
  • Automotive
  • Renewable
  • Consumer and Enterprise
  • Military, Defense, and Aerospace
  • Medical

By Region
  • North America
  • U.S.
  • Mexico
  • Canada
  • Europe
  • UK
  • Germany
  • France
  • Rest of Europe
  • Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
  • LAMEA
  • Latin America
  • Middle East
  • Africa

KEY PLAYERS
  • Infineon Technologies AG
  • Mitsubishi Electric Corporation
  • Toshiba Corporation
  • ON Semiconductor
  • STMicroelectronics
  • NXP Semiconductors
  • Renesas Electronics Corporation
  • Texas Instruments
  • ROHM Semiconductors
  • Semtech Corporation

Table of Contents

Chapter 1: Introduction
1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: Executive summary
2.1. CXO perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.4. Porter’s five forces analysis
3.4.1. Moderate to high bargaining power of suppliers
3.4.2. Moderate threat of new entrants
3.4.3. Moderate threat of substitutes
3.4.4. Moderate to high intensity of rivalry
3.4.5. Moderate to high bargaining power of buyers
3.5. Patent Analysis
3.5.1. By Region (2012-2019)
3.5.2. By applicant
3.6. Market dynamics
3.6.1. Drivers
3.6.1.1. Increase in demand of power electronics modules across various industry verticals
3.6.1.2. Increasing emphasis on power saving.
3.6.1.3. Growth in demand of electric vehicles, plug-in electric vehicles, and hybrid electric vehicles.
3.6.2. Restraint
3.6.2.1. Lack of availability of GaN material
3.6.3. Opportunities
3.6.3.1. Government initiatives in HVDC and smart grid
3.6.3.1. Technological advancement in power MOSFET
CHAPTER 4: Power discrete and modules Market, BY type
4.1. Overview
4.2. Power discrete
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country
4.3. Power modules
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country
CHAPTER 5: Power discrete and modules Market, BY Component
5.1. Overview
5.2. Thyristor
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country
5.3. Diodes
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country
5.4. Rectifier
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country
5.5. MOSFET
5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis, by country
5.6. IGBT
5.6.1. Key market trends, growth factors, and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market analysis, by country
5.7. Others
5.7.1. Key market trends, growth factors, and opportunities
5.7.2. Market size and forecast, by region
5.7.3. Market analysis, by country
CHAPTER 6: Power discrete and modules Market, BY Material
6.1. Overview
6.2. SiC
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis, by country
6.3. GaN
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis, by country
6.4. Others
6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis, by country
CHAPTER 7: Power discrete and modules Market, BY Industry vertical
7.1. Overview
7.2. Telecommunication
7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market analysis, by country
7.3. Industrial
7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market analysis, by country
7.4. Automotive
7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast, by region
7.4.3. Market analysis, by country
7.5. Renewable
7.5.1. Key market trends, growth factors, and opportunities
7.5.2. Market size and forecast, by region
7.5.3. Market analysis, by country
7.6. Consumer Electronics
7.6.1. Key market trends, growth factors, and opportunities
7.6.2. Market size and forecast, by region
7.6.3. Market analysis, by country
7.7. Military & Defense
7.7.1. Key market trends, growth factors, and opportunities
7.7.2. Market size and forecast, by region
7.7.3. Market analysis, by country
7.8. Medical
7.8.1. Key market trends, growth factors, and opportunities
7.8.2. Market size and forecast, by region
7.8.3. Market analysis, by country
CHAPTER 8: Power discrete and modules market, BY Region
8.1. Overview
8.2. North America
8.2.1. Key market trends, growth factors, and opportunities
8.2.2. Market size and forecast, by type
8.2.3. Market size and forecast, by component
8.2.4. Market size and forecast, by material
8.2.5. Market size and forecast, by industry vertical
8.2.6. Market analysis, by country
8.2.6.1. U.S.
8.2.6.1.2. Market size and forecast, by type
8.2.6.1.3. Market size and forecast, by component
8.2.6.1.4. Market size and forecast, by material
8.2.6.1.5. Market size and forecast, by industry vertical
8.2.6.2. Canada
8.2.6.2.2. Market size and forecast, by type
8.2.6.2.3. Market size and forecast, by component
8.2.6.2.4. Market size and forecast, by material
8.2.6.2.5. Market size and forecast, by industry vertical
8.2.6.3. Mexico
8.2.6.3.2. Market size and forecast, by type
8.2.6.3.3. Market size and forecast, by component
8.2.6.3.4. Market size and forecast, by material
8.2.6.3.5. Market size and forecast, by industry vertical
8.3. Europe
8.3.1. Key market trends, growth factors, and opportunities
8.3.2. Market size and forecast, by type
8.3.3. Market size and forecast, by component
8.3.4. Market size and forecast, by material
8.3.5. Market size and forecast, by industry vertical
8.3.6. Market analysis, by country
8.3.6.1. Germany
8.3.6.1.2. Market size and forecast, by type
8.3.6.1.3. Market size and forecast, by component
8.3.6.1.4. Market size and forecast, by material
8.3.6.1.5. Market size and forecast, by industry vertical
8.3.6.2. France
8.3.6.2.2. Market size and forecast, by type
8.3.6.2.3. Market size and forecast, by component
8.3.6.2.4. Market size and forecast, by material
8.3.6.2.5. Market size and forecast, by industry vertical
8.3.6.3. UK
8.3.6.3.2. Market size and forecast, by type
8.3.6.3.3. Market size and forecast, by component
8.3.6.3.4. Market size and forecast, by material
8.3.6.3.5. Market size and forecast, by industry vertical
8.3.6.4. Rest of Europe
8.3.6.4.2. Market size and forecast, by type
8.3.6.4.3. Market size and forecast, by component
8.3.6.4.4. Market size and forecast, by material
8.3.6.4.5. Market size and forecast, by industry vertical
8.4. Asia-Pacific
8.4.1. Key market trends, growth factors, and opportunities
8.4.2. Market size and forecast, by type
8.4.3. Market size and forecast, by component
8.4.4. Market size and forecast, by material
8.4.5. Market size and forecast, by industry vertical
8.4.6. Market analysis, by country
8.4.6.1. Japan
8.4.6.1.2. Market size and forecast, by type
8.4.6.1.3. Market size and forecast, by component
8.4.6.1.4. Market size and forecast, by material
8.4.6.1.5. Market size and forecast, by industry vertical
8.4.6.2. China
8.4.6.2.1. Market size and forecast, by type
8.4.6.2.2. Market size and forecast, by component
8.4.6.2.3. Market size and forecast, by material
8.4.6.2.4. Market size and forecast, by industry vertical
8.4.6.3. India
8.4.6.3.2. Market size and forecast, by type
8.4.6.3.3. Market size and forecast, by component
8.4.6.3.4. Market size and forecast, by material
8.4.6.3.5. Market size and forecast, by industry vertical
8.4.6.4. South Korea
8.4.6.4.2. Market size and forecast, by type
8.4.6.4.3. Market size and forecast, by component
8.4.6.4.4. Market size and forecast, by material
8.4.6.4.5. Market size and forecast, by industry vertical
8.4.6.5. Rest of Asia-Pacific
8.4.6.5.2. Market size and forecast, by type
8.4.6.5.3. Market size and forecast, by component
8.4.6.5.4. Market size and forecast, by material
8.4.6.5.5. Market size and forecast, by industry vertical
8.5. LAMEA
8.5.1. Key market trends, growth factors, and opportunities
8.5.2. Market size and forecast, by type
8.5.3. Market size and forecast, by component
8.5.4. Market size and forecast, by material
8.5.5. Market size and forecast, by industry vertical
8.5.6. Market analysis, by country
8.5.6.1. Latin America
8.5.6.1.2. Market size and forecast, by type
8.5.6.1.3. Market size and forecast, by component
8.5.6.1.4. Market size and forecast, by material
8.5.6.1.5. Market size and forecast, by industry vertical
8.5.6.2. Middle East
8.5.6.2.2. Market size and forecast, by type
8.5.6.2.3. Market size and forecast, by component
8.5.6.2.4. Market size and forecast, by material
8.5.6.2.5. Market size and forecast, by industry vertical
8.5.6.3. Africa
8.5.6.3.2. Market size and forecast, by type
8.5.6.3.3. Market size and forecast, by component
8.5.6.3.4. Market size and forecast, by material
8.5.6.3.5. Market size and forecast, by industry vertical
CHAPTER 9: COMPETITIVE LANDSCAPE
9.1. Introduction
9.1.1. Market player positioning, 2019
9.2. Top winning strategies
9.3. Product Mapping Of Top 10 Player
9.4. Competitive Dashboard
9.5. Competitive Heatmap
CHAPTER 10: Company profiles
10.1. Infineon Technologies AG
10.1.1. Company overview
10.1.2. Company snapshot
10.1.3. Operating business segments
10.1.4. Product portfolio
10.1.5. Business performance
10.1.6. Key strategic moves and developments
10.2. Mitsubishi Electric Corporation
10.2.1. Company overview
10.2.2. Company snapshot
10.2.3. Operating business segments
10.2.4. Product portfolio
10.2.5. Business performance
10.2.6. Key strategic moves and developments
10.3. NXP Semiconductor
10.3.1. Company overview
10.3.2. Company snapshot
10.3.3. Product portfolio
10.3.4. Product portfolio
10.3.5. R&D Expenditure
10.3.6. Business performance
10.3.7. Key strategic moves and developments
10.4. ON Semiconductor
10.4.1. Company overview
10.4.2. Company snapshot
10.4.3. Operating business segments
10.4.4. Product portfolio
10.4.5. Business performance
10.4.6. Key strategic moves and developments
10.5. ROHM Semiconductors
10.5.1. Company overview
10.5.2. Company snapshot
10.5.3. Operating business segments
10.5.4. Product portfolio
10.5.5. R&D Expenditure
10.5.6. Business performance
10.5.7. Key strategic moves and developments
10.6. Renesas Electronics
10.6.1. Company overview
10.6.2. Company snapshot
10.6.3. Operating business segments
10.6.4. Product portfolio
10.6.5. R&D Expenditure
10.6.6. Business performance
10.6.7. Key strategic moves and developments
10.7. STMicroelectronics
10.7.1. Company overview
10.7.2. Company snapshot
10.7.3. Operating business segments
10.7.4. Product portfolio
10.7.5. R&D Expenditure
10.7.6. Business performance
10.7.7. Key strategic moves and developments
10.8. Semtech Corporation
10.8.1. Company overview
10.8.2. Company snapshot
10.8.3. Operating business segments
10.8.4. Product portfolio
10.8.5. Business performance
10.8.6. Key strategic moves and developments
10.9. Texas Instruments
10.9.1. Company overview
10.9.2. Company snapshot
10.9.3. Operating business segments
10.9.4. Product portfolio
10.9.5. R&D Expenditure
10.9.6. Business performance
10.9.7. Key strategic moves and developments
10.10. Toshiba Corporation
10.10.1. Company overview
10.10.2. Company snapshot
10.10.3. Operating business segments
10.10.4. Product portfolio
10.10.5. Business performance
10.10.6. Key strategic moves and developments

Executive Summary

According to the report titled 'Power Discrete and Modules Market by Type, Component, Material, and Industry Vertical: Global Opportunity Analysis and Industry Forecast, 2019-2026,' the global power discrete and modules market size was valued at $20.75billion in 2018, and is projected to reach $35.92billion by 2026, growing at a CAGR of 6.4% from 2019 to 2026. The power modules segment contributed nearly 65% of the share in 2018.

Power module or also called power electronic module is a set of power components integrated in power semiconductor devices. Power devices can attain extremely low resistance and high-frequency switching. These properties are exploited in high-efficiency power supplies, electric vehicle (EV), hybrid electric vehicle (HEV), photovoltaic inverters, and RF switching. These devices are applicable in power supplies for server, IT equipment, high-efficiency & stable power supplies, and EV & HEV devices.

Around 4.6 metric tons of carbon dioxide is emitted by vehicles every year; thereby, developing a need to adopt a sustainable form of transportation to control environmental degradation. As a result, the adequate information on controlling the carbon footprint has steered the demand for electric vehicles globally. In 2017, there were more than 3.1 million electric cars globally, 50% more than the previous year, thus, rising the demand for power electronics components. This growing demand for power electronics components is expected to boost the growth for power discrete and modules market. Power discrete and modules are widely used in electric vehicles and charging stations for electric motors, controller unit, voltage converters, and inverters.

Increase in demand for power electronics across various industry verticals, growing concern on power saving, and rise in demand for electric vehicles are the major factors that drive the growth of the power discrete and modules market. In addition, increase in industrialization demanding efficient electronics devices and equipment and rise in disposable income leading to high demand for consumer electronics fuel the growth of the power discrete and modules industry. However, lack of availability of GaN material is estimated to hamper the power discrete and modules market. Furthermore, increase in technological advancement of power MOSFET and rise in governmental initiatives in HVDC and smart grids are anticipated to generate new power discrete and modules market opportunities.

In 2018, IGBT product type of power modules contributed over 40% share in the power discrete and modules market, and is expected to maintain its dominant position throughout the analysis period, owing to its capability to handle large collector-emitter currents with virtually zero gate current drive and high switching speeds. The growing demand for IGBT for various consumer electronics and industrial applications is propelling the growth of the power discrete and modules market.

Power module type segment dominated with over65% share in 2018. A power module consists of multiple semiconductor chips mounted on an isolated substrate, which is mounted on a heat sinking copper base plate. It is gaining popularity globally, owing to unmatched efficiency and durability. Low-power consumption and light-weight design of power electronics boost the adoption of power modules in applications such as welding systems and other industrial systems. Asia-Pacific is the leading region, owing to the high adoption of power modules in energy and power sector for faster switching. However, the escalation of consumer electronics products is anticipated to fuel the adoption of power discrete and modules.

According to Ankit Prajapati, Lead Analyst, Semiconductor and Electronics, 'In terms of revenue, power discrete and modules market size is growing at an unparalleled rate and is projected to continue this trend during the forecast period. Changing energy trends, rise indisposable income, surge in urbanization and industrialization, and increase in initiatives toward sustainable development are some of the primary factors that drive the growth of the power discrete and modules market share globally.”

Key findings of the study
  • In terms of revenue, IGBTcontributed the maximum market share in 2018, and is expected to maintain its lead throughout the forecast period.
  • SiCis expected to grow at the highest CAGR during the forecast period.
  • In 2018, the power modules type segment held nearly two-third of the power discrete and modules market share, which was the highest among all the types.
  • In 2018, Asia-Pacific accounted for more than half of the total power discrete and modules market growth globally and is expected to dominate the market in the future.

Based on region, the global power discrete and modules market trends are analyzed across North America Europe, Asia-Pacific, and LAMEA. In 2018, in terms of revenue, Asia-Pacific accounted for more than half of the power discrete and modules market, and is expected to retain its dominant position, owing to the presence of well-established power discrete and modules market companies, government initiatives, and rise in demand for power electronics devices.

The key players operating in the market include Infineon Technologies AG, Mitsubishi Electric Corporation, Toshiba Corporation, ON Semiconductor, STMicroelectronics, NXP Semiconductors, Renesas Electronics Corporation, Texas Instruments, ROHM Semiconductors, and Semtech Corporation.

Companies Mentioned

  • Infineon Technologies AG
  • Mitsubishi Electric Corporation
  • Toshiba Corporation
  • ON Semiconductor
  • STMicroelectronics
  • NXP Semiconductors
  • Renesas Electronics Corporation
  • Texas Instruments
  • ROHM Semiconductors
  • Semtech Corporation.

Methodology

The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.

They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.

They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:

  • Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
  • Scientific and technical writings for product information and related preemptions
  • Regional government and statistical databases for macro analysis
  • Authentic news articles and other related releases for market evaluation
  • Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast

Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.

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