Affected by a slowdown in the global economy and sluggish demand in the consumer market, worldwide OSAT (Outsourced Semiconductor Assembly and Test) industry shipment value dropped by 1.93% YoY to US$28.893 billion in 2019. The first half of 2019 suffered a more severe impact as downstream vendors pulled forward in the second half of 2018 and overall product sales declined last year. Despite a mild recovery in the end market in the second half, the OSAT industry still registered weaker revenue performance in the entire 2019 than in 2018. This report reviews the shipment performance of the worldwide OSAT industry in 2019 and analyzes its development trends in 2020.
List of Topics:
- Development of the global OSAT (Outsourced Semiconductor Assembly and Test) industry, covering shipment value for the period 2016-2020
- Development of leading OSAT vendors, including Amkor, JECT, Tianshui Huatian, and TongFu Microelectronics
- Development of the Taiwanese OSAT industry, touching on the development of ASE, PTI, and KYEC
Table of Contents
1. Worldwide OSAT Shipment Value
1.1 Worldwide Shipment Value Picks Up in 2H19
1.2 Slight Shipment Value Growth Expected in 2020 due to COVID-19 Outbreak
1.3 Taiwan Takes Up the Largest Shipment Value Share in 2019, Followed by China
1.3.1 OSAT Vendor Rankings Remain Steady with KYEC and UTAC Switching Places
1.3.2 Taiwanese OSAT Industry Shipment Value Declines by 0.2% in 2019, Lower than Global Average
2. Leading international vendors Development
2.1 Amkor Revenue Declines in 2019 with Continued Focus on SiP
2.2 JCET Builds Advanced Bases via JV with Consistent Focus on High-end Packaging Technology
2.3 Acquisition of Unisem Benefits Tianshui Huatian’s Business Performance in 2019
2.4 AMD’s Strong Growth Drive TFME’s Growth
3. Development of Taiwanese OSAT Vendors
3.1 ASE Continues to Expand Capacity with Strong Growth Momentum for SiP
3.1.1 Ongoing Acquisition and Capacity Expansion to Prepare for Massive Market Demand
3.1.2 SiP Still an Important Growth Driver
3.2 PTI Spreads Development Efforts across Advanced Packaging Technologies
3.3 KYEC Revenue Hits Record High on Strong 5G, AI, and CIS Testing Demand
4. Analyst's Perspective
Appendix
List of Companies
List of Tables
Table 1 ASE Revenue by Business Type
List of Figures
Figure 1 Worldwide OSAT Industry Shipment Value and Growth Rates, 2016 - 2020
Figure 2 World’s Top Ten OSAT Vendors by Revenue in 2019
Figure 3 Taiwanese OSAT Industry Shipment Value and Growth Rates, 2016 - 2020
Figure 4 Amkor’s Revenue by Product Application
Figure 5 ASE IC Packaging and Testing Revenue by Product Portfolio
Samples
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Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- AMD
- Amkor
- Apple
- ASE
- ASML
- Asteelflash
- Broadcom
- ChipBond Technology
- ChipMOS
- Fabtronic
- Financiere AFG SAS
- HiSilicon
- Huawei
- Intel
- JCET
- JSCK
- KYEC
- MediaTek
- NXP
- Powertech
- Qorvo
- Qualcomm
- Samsung
- Sigurd Group
- Skyworks
- SMIC
- Sony
- STATS ChipPAC
- Tianshui Tuatian Technology
- TongFu Microelectronics
- Unisem
- USI Electronics
- UTAC
Methodology
Primary research with a holistic, cross-domain approach
The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.
Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:
Method
- Component supplier interviews
- System supplier interviews
- User interviews
- Channel interviews
- IPO interviews
- Focus groups
- Consumer surveys
- Production databases
- Financial data
- Custom databases
Methodology
- Technology forecasting and assessment
- Product assessment and selection
- Product life cycles
- Added value analysis
- Market trends
- Scenario analysis
- Competitor analysis
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