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WLCSP Electroless Plating Market By Type and End Use: Global Opportunity Analysis and Industry Forecast, 2020-2027

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    Report

  • 197 Pages
  • April 2020
  • Region: Global
  • Allied Market Research
  • ID: 5118770
Electroless plating is also known as conversion coating or auto-catalytic plating. It is a non-galvanic plating method that involves several simultaneous reactions in aqueous solutions. Electroless plating is being used to form the conductive part of printed circuit boards in its manufacturing. It is a way of plating PCBs without using an external power source. The process involves placing the part in an aqueous solution and depositing nickel and creating a catalytic reduction of nickel ions to plate the part without any electrical energy dispersal.

Wafer level chip scale package refers to the technology of packaging an integrated circuit at the wafer level, instead of the traditional process of assembling individual units in packages after dicing them from wafer. Wafer level CSP differs from BGA as no bond wires or interposer connections are required. The key advantage of wafer level CSP as the die to PCB inductance is minimized, along with reduced package size, and enhanced thermal conduction characteristics.

WLCSP electroless plating technology is expected to increase the value of a semiconductor wafer product by adding functionality in its operation, increasing and maintaining the performance, while lowering the overall cost of packaging. The adoption of advanced WLCSP electroless plating is also creating demand for high performance chips for various consumer electronic products.

Factors such as need for circuit miniaturization and microelectronic devices, enhanced feature of WLCSP electroless plating providing better shielding as against traditional plating process, and cost-effectiveness of WLCSP electroless plating are expected to drive market growth. However, decline in growth of semiconductor industry and volatility of the prices of raw materials hamper market growth to a certain extent. Furthermore, increase in demand for WLCSP electroless plating in aerospace and healthcare industries is expected to be opportunistic for the market.

The global WLCSP electroless plating market is segmented into type, end use, and region. By type, the market is classified into nickel, copper, and composites. The nickel segment is further subdivided into low phosphorus, medium phosphorus, and high phosphorus. By end use, the market is divided into automotive, electronics, aerospace, machinery, and others. By region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA.

The key players profiled in the report include Atotech Deutschland GmbH, ARC Technologies, Inc., MacDermid, Inc., KC Jones Plating Company, Okuno Chemical Industries Co., Ltd. COVENTYA International, C. Uyemura & Co., Ltd., Nihon Parkerizing Co., Ltd., ERIE PLATING COMPANY, and Bales Metal Surface Solutions (Bales).

These key players have adopted strategies such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations, to enhance their market penetration.

KEY BENEFITS FOR STAKEHOLDERS
  • This study includes the analytical depiction of the WLCSP electroless plating market forecast along with the current trends and future estimations to determine the imminent investment pockets.
  • The report presents information regarding the key drivers, restraints, and opportunities in the market.
  • The WLCSP electroless plating market growth is quantitatively analyzed from 2019 to 2027 to highlight the financial competency of the industry.
  • Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the industry.

WLCSP ELECTROLESS PLATING MARKET SEGMENTATION

BY TYPE
  • Nickel
  • Low Phosphorus
  • Medium Phosphorus
  • High Phosphorus
  • Copper
  • Composite

BY END USE
  • Automotive
  • Electronics
  • Aerospace
  • Machinery
  • Others

BY REGION
  • North America
  • U.S.
  • Canada
  • Mexico
  • Europe
  • UK
  • Germany
  • France
  • Italy
  • Rest of Europe
  • Asia-Pacific
  • China
  • Japan
  • South Korea
  • Australia
  • Rest of Asia-Pacific
  • LAMEA
  • Latin America
  • Middle East
  • Africa

Table of Contents

Chapter 1: Introduction
1.1. Report Description
1.2. Key Benefits for Stakeholders
1.3. Key Market Segments
1.4. Research Methodology
1.4.1. Primary Research
1.4.2. Secondary Research
1.4.3. Analyst Tools and Models
Chapter 2: Executive Summary
2.1. Cxo Perspective
Chapter 3: Market Overview
3.1. Market Definition and Scope
3.2. Key Findings
3.2.1. Top Impacting Factors
3.2.2. Top Investment Pockets
3.2.3. Top Winning Strategies
3.3. Porter’S Five Forces Analysis
3.4. Key Player Positioning (2019)
3.5. Market Dynamics
3.5.1. Drivers
3.5.1.1. Impending Need for Circuit Miniaturization and Micro Electric Devices
3.5.1.2. Wlcsp Electroless Plating Provides Better Shielding as Against Traditional Plating Process
3.5.1.3. Cost-Effectiveness of Wlcsp Electroless Plating
3.5.2. Restraints
3.5.2.1. Slow-Paced Growth of the Semiconductor Industry
3.5.2.2. Volatility of the Prices of Raw Materials
3.5.3. Opportunity
3.5.3.1. Increase in Demand for Wlcsp Electroless Plating in Aerospace and Healthcare Industry Vertical
3.6. Electroless Plating for Wlcsp Bump and Other Parts of Wlcsp
3.6.1. What Are Semiconductor Bumps?
Chapter 4: Wlcsp Electroless Plating Market, by Type
4.1. Overview
4.2. Nickel
4.2.1. Low Phosphorus
4.2.2. Medium Phosphorus
4.2.3. High Phosphorus
4.2.4. Key Market Trends, Growth Factors and Opportunities
4.2.5. Market Size and Forecast, by Region
4.2.6. Market Analysis by Country
4.3. Copper
4.3.1. Key Market Trends, Growth Factors, and Opportunities
4.3.2. Market Size and Forecast, by Region
4.3.3. Market Analysis by Country
4.4. Composites
4.4.1. Key Market Trends, Growth Factors, and Opportunities
4.4.2. Market Size and Forecast, by Region
4.4.3. Market Analysis by Country
Chapter 5: Wlcsp Electroless Platingmarket, by End Use
5.1. Overview
5.2. Automotive
5.2.1. Key Market Trends, Growth Factors and Opportunities
5.2.2. Market Size and Forecast, by Region
5.2.3. Market Analysis by Country
5.3. Electronics
5.3.1. Key Market Trends, Growth Factors, and Opportunities
5.3.2. Market Size and Forecast, by Region
5.3.3. Market Analysis by Country
5.4. Aerospace
5.4.1. Key Market Trends, Growth Factors, and Opportunities
5.4.2. Market Size and Forecast, by Region
5.4.3. Market Analysis by Country
5.5. Machinery
5.5.1. Key Market Trends, Growth Factors, and Opportunities
5.5.2. Market Size and Forecast, by Region
5.5.3. Market Analysis by Country
5.6. Others
5.6.1. Key Market Trends, Growth Factors, and Opportunities
5.6.2. Market Size and Forecast, by Region
5.6.3. Market Analysis by Country
Chapter 6: Wlcsp Electroless Plating Market, by Region
6.1. Overview
6.2. North America
6.2.1. Key Market Trends, Growth Factors, and Opportunities
6.2.2. Market Size and Forecast, by Type
6.2.3. Market Size and Forecast, by End Use
6.2.4. Market Analysis by Country
6.2.4.1. U. S.
6.2.4.1.1. Market Size and Forecast, by Type
6.2.4.1.2. Market Size and Forecast, by End Use
6.2.4.2. Canada
6.2.4.2.1. Market Size and Forecast, by Type
6.2.4.2.2. Market Size and Forecast, by End Use
6.2.4.3. Mexico
6.2.4.3.1. Market Size and Forecast, by Type
6.2.4.3.2. Market Size and Forecast, by End Use
6.3. Europe
6.3.1. Key Market Trends, Growth Factors, and Opportunities
6.3.2. Market Size and Forecast, by Type
6.3.3. Market Size and Forecast, by End Use
6.3.4. Market Analysis by Country
6.3.4.1. UK
6.3.4.1.1. Market Size and Forecast, by Type
6.3.4.1.2. Market Size and Forecast, by End Use
6.3.4.2. Germany
6.3.4.2.1. Market Size and Forecast, by Type
6.3.4.2.2. Market Size and Forecast, by End Use
6.3.4.3. France
6.3.4.3.1. Market Size and Forecast, by Type
6.3.4.3.2. Market Size and Forecast, by End Use
6.3.4.4. Italy
6.3.4.4.1. Market Size and Forecast, by Type
6.3.4.4.2. Market Size and Forecast, by End Use
6.3.4.5. Rest of Europe
6.3.4.5.1. Market Size and Forecast, by Type
6.3.4.5.2. Market Size and Forecast, by End Use
6.4. Asia-Pacific
6.4.1. Key Market Trends, Growth Factors, and Opportunities
6.4.2. Market Size and Forecast, by Type
6.4.3. Market Size and Forecast, by End Use
6.4.4. Market Analysis by Country
6.4.4.1. China
6.4.4.1.1. Market Size and Forecast, by Type
6.4.4.1.2. Market Size and Forecast, by End Use
6.4.4.2. Japan
6.4.4.2.1. Market Size and Forecast, by Type
6.4.4.2.2. Market Size and Forecast, by End Use
6.4.4.3. South Korea
6.4.4.3.1. Market Size and Forecast, by Type
6.4.4.3.2. Market Size and Forecast, by End Use
6.4.4.4. Australia
6.4.4.4.1. Market Size and Forecast, by Type
6.4.4.4.2. Market Size and Forecast, by End Use
6.4.4.5. Rest of Asia-Pacific
6.4.4.5.1. Market Size and Forecast, by Type
6.4.4.5.2. Market Size and Forecast, by End Use
6.5. LAMEA
6.5.1. Key Market Trends, Growth Factors, and Opportunities
6.5.2. Market Size and Forecast, by Type
6.5.3. Market Size and Forecast, by End Use
6.5.4. Market Analysis by Country
6.5.4.1. Latin America
6.5.4.1.1. Market Size and Forecast, by Type
6.5.4.1.2. Market Size and Forecast, by End Use
6.5.4.2. Middle East
6.5.4.2.1. Market Size and Forecast, by Type
6.5.4.2.2. Market Size and Forecast, by End Use
6.5.4.3. Africa
6.5.4.3.1. Market Size and Forecast, by Type
6.5.4.3.2. Market Size and Forecast, by End Use
Chapter 7: Company Profiles
7.1. Arc Technologies, Inc.
7.1.1. Company Overview
7.1.2. Key Executives
7.1.3. Company Snapshot
7.1.4. Product Portfolio
7.2. Atotech Deutschland GmbH
7.2.1. Company Overview
7.2.2. Key Executives
7.2.3. Company Snapshot
7.2.4. Operating Business Segments
7.2.5. Product Portfolio
7.2.6. R&D Expenditure
7.2.7. Business Performance
7.2.8. Key Strategic Moves and Developments
7.3. Bales (Bales Metal Surface Solutions)
7.3.1. Company Overview
7.3.2. Key Executives
7.3.3. Company Snapshot
7.3.4. Product Portfolio
7.3.5. Key Strategic Moves and Developments
7.4. C. Uyemura & Co. Ltd.
7.4.1. Company Overview
7.4.2. Key Executives
7.4.3. Company Snapshot
7.4.4. Operating Business Segments
7.4.5. Product Portfolio
7.4.6. R&D Expenditure
7.4.7. Business Performance
7.4.8. Key Strategic Moves and Developments
7.5. Coventya International
7.5.1. Company Overview
7.5.2. Key Executives
7.5.3. Company Snapshot
7.5.4. Product Portfolio
7.5.5. Key Strategic Moves and Developments
7.6. Erie Plating Company
7.6.1. Company Overview
7.6.2. Key Executives
7.6.3. Company Snapshot
7.6.4. Product Portfolio
7.7. Kc Jones Plating Company
7.7.1. Company Overview
7.7.2. Key Executives
7.7.3. Company Snapshot
7.7.4. Product Portfolio
7.7.5. Key Strategic Moves and Developments
7.8. Macdermid, Inc.
7.8.1. Company Overview
7.8.2. Key Executives
7.8.3. Company Snapshot
7.8.4. Product Portfolio
7.8.5. Key Strategic Moves and Developments
7.9. Nihon Parkerizing Co. Ltd.
7.9.1. Company Overview
7.9.2. Key Executives
7.9.3. Company Snapshot
7.9.4. Operating Business Segments
7.9.5. Product Portfolio
7.9.6. R&D Expenditure
7.9.7. Business Performance
7.9.8. Key Strategic Moves and Developments
7.10. Okuno Chemical Industries Co. Ltd.
7.10.1. Company Overview
7.10.2. Key Executives
7.10.3. Company Snapshot
7.10.4. Product Portfolio
7.10.5. Key Strategic Moves and Developments

Executive Summary

According to the report titled, 'WLCSP Electroless Plating Market By Type and End Use: Opportunity Analysis and Industry Forecast, 2020-2027', the global WLCSP electroless plating market was valued at $1.77 billion in 2019, and is projected to reach $2.88 billion by 2027, registering a CAGR of 5.9% from 2020 to 2027.

WLCSP electroless plating involves metal ions within a chemical solution. A uniform layer is deposited onto the surface of the semiconductor wafer by using electroless plating reaction. This process involves only chemical reaction, and no electric current is required. The main advantage of electroless plating is that a uniform deposit is achieved every time the reaction takes place.

In addition, electroless coating penetrates into narrow blind holes, to ensure no gas entrapment. It is used for wide range of engineering applications where chemical and wear resistance, and high hardness are required. Electroless plating is used in various applications, such as plastic injection molds, die casting molds, glass production molds, and salvage of mold parts.

According to WLCSP electroless plating market trends, WLCSP electroless plating is a type of surface finish deposition method in electronic packaging. With advancements in electronic products, the industry is shifting toward this process on the basis of its advantages. However, the WLCSP electroless plating process is unstable. Its stability fully depends on the substrate material, the pretreatment process, the type of solution used, and the pH and temperature during plating.

WLCSP electroless plating is less porous than any other electroplates and provides a barrier of corrosion to protect the metal. This plating technology provides large flexibility of thickness and volume of the plating, which easily fills the pits on the metal surface of the semiconductor wafer. This allows for a wider variety of electronic parts, which needs to be coated of plated through electroless plating with a uniform surface. In addition, electroless nickel plating provides better corrosion protection as against other plating techniques in the industry.

Furthermore, features such as less porous, high thermal conductivity, as well as high electrical and magnetic conductivity of WLCSP electroless plating provides better shielding capabilities as against traditional plating process. This majorly drives the growth of the WLCSP electroless plating market share globally.

In addition, WLCSP electroless plating is applied with zero or very less comprehensive stress. No electricity is required in this plating or coating process. The entire process takes place through chemical reaction. As no electricity is required in the coating process, the accuracy level of the process is quite high, even with less equipment. These factors promote cost-effectiveness of WLCSP electroless plating. This type of plating requires less cost as compared to electroplating, which lowers down its cost. In addition, the requirement of no external current for coating process makes it a convenient process and majorly drives the WLCSP electroless plating market growth.

According to WLCSP electroless plating market forecast, North America is one of the key contributors to the WLCSP electroless plating market owing to the increase in number of electronics, automotive, and machinery applications, which fuels the demand for the WLCSP electroless plating in the region. The need for intelligent and smart devices and technology platforms by different industries has increased the use of advanced packaging solutions, which creates demand for WLCSP electroless plating.

Moreover, the use of microcontrollers and microprocessors in consumer electronics and electric vehicles is expected to drive the market for WLCSP electroless plating during the forecast period. The early adoption of new technology and presence of different U.S.-based companies facilitate the exploration of newer applications of the technologies. In the highly fragmented market, companies have adopted merger and acquisition strategies to increase their market share.

Key Findings of the Study:

By Type, the Nickel segment generated the highest revenue in 2019.
By End Use, Electronics segment generated the highest revenue in 2019.

The key players profiled in the report include Atotech Deutschland GmbH, ARC Technologies, Inc., MacDermid, Inc., KC Jones Plating Company, Okuno Chemical Industries Co., Ltd. COVENTYA International, C. Uyemura & Co., Ltd., Nihon Parkerizing Co., Ltd., ERIE PLATING COMPANY, and Bales Metal Surface Solutions (Bales). These key players have adopted strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations, to enhance their market penetration

Companies Mentioned

  • Atotech Deutschland GmbH
  • ARC Technologies Inc.
  • MacDermid Inc.
  • KC Jones Plating Company
  • Okuno Chemical Industries Co. Ltd. COVENTYA International
  • C. Uyemura & Co. Ltd.
  • Nihon Parkerizing Co. Ltd.
  • ERIE PLATING COMPANY
  • Bales Metal Surface Solutions (Bales

Methodology

The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.

They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.

They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:

  • Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
  • Scientific and technical writings for product information and related preemptions
  • Regional government and statistical databases for macro analysis
  • Authentic news articles and other related releases for market evaluation
  • Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast

Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.

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