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Power Management IC Packaging Market Research Report by Type (BGA, HSOP32, and HVNON10), Solution, Application, State - United States Forecast to 2027 - Cumulative Impact of COVID-19

  • Report
  • 155 Pages
  • July 2022
  • Region: United States
  • 360iResearch™
  • ID: 5124308
UP TO OFF until Dec 31st 2022

FEATURED COMPANIES

  • 3D Plus, Inc.
  • ABLIC Inc.
  • Dialog Semiconductor
  • HANA Micron Inc.
  • Microchip Technology Inc
  • NXP Semiconductors N.V.
The United States Power Management IC Packaging Market size was estimated at USD 9,125.79 million in 2021, USD 10,073.89 million in 2022, and is projected to grow at a CAGR 6.94% to reach USD 13,655.98 million by 2027.

Market Statistics:


The report provides market sizing and forecast across 7 major currencies - USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2019 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.

Market Segmentation & Coverage:


This research report categorizes the Power Management IC Packaging to forecast the revenues and analyze the trends in each of the following sub-markets:
  • Based on Type, the market was studied across BGA, HSOP32, HVNON10, HVQFN, QFN, and WLCSP.
  • Based on Solution, the market was studied across Configurable PMICs, DC-to-DC Solutions, Linear Voltage Regulators, PMICs for Networking, PMICs for i.MX Application Processors, and Switching Regulators.
  • Based on Application, the market was studied across Automotive Infotainment & Telematic Devices, Digital Cameras, Digital TV Processor, Fitness Trackers & Wearable Devices, Portable Industrial & Medical Devices, Portable Media Players & Readers, Smartphones, and Tablets & PCs.
  • Based on State, the market was studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas.

Cumulative Impact of COVID-19:


COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.

Cumulative Impact of 2022 Russia Ukraine Conflict:


We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for Power Management IC Packaging market considering the current update on the conflict and its global response.

Competitive Strategic Window:


The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.

FPNV Positioning Matrix:


The FPNV Positioning Matrix evaluates and categorizes the vendors in the Power Management IC Packaging Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.

Market Share Analysis:


The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.

Competitive Scenario:


The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.

Company Usability Profiles:


The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the United States Power Management IC Packaging Market, including 3D Plus, Inc., ABLIC Inc., Analog Devices / Linear Technology, Dialog Semiconductor, Good-Ark Semiconductor USA Corp., HANA Micron Inc., Jilin Sino-Microelectronics Co., Ltd., Maxim Integrated Products Inc, Microchip Technology Inc, NXP Semiconductors N.V., ON Semiconductor Corporation, Semtech Corporation, Shenzhen Electronics Group Co., Ltd., Texas Instruments Incorporated, Toshiba Corporation, and Wuxi China Resources Microelectronics Co. Ltd..

The report provides insights on the following pointers:


1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments

The report answers questions such as:


1. What is the market size and forecast of the United States Power Management IC Packaging Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the United States Power Management IC Packaging Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the United States Power Management IC Packaging Market?
4. What is the competitive strategic window for opportunities in the United States Power Management IC Packaging Market?
5. What are the technology trends and regulatory frameworks in the United States Power Management IC Packaging Market?
6. What is the market share of the leading vendors in the United States Power Management IC Packaging Market?
7. What modes and strategic moves are considered suitable for entering the United States Power Management IC Packaging Market?

FEATURED COMPANIES

  • 3D Plus, Inc.
  • ABLIC Inc.
  • Dialog Semiconductor
  • HANA Micron Inc.
  • Microchip Technology Inc
  • NXP Semiconductors N.V.

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.2. Restraints
5.1.3. Opportunities
5.1.4. Challenges
5.2. Cumulative Impact of COVID-19
6. Power Management Ic Packaging Market, by Type
6.1. Introduction
6.2. Bga
6.3. Hsop32
6.4. Hvnon10
6.5. Hvqfn
6.6. Qfn
6.7. Wlcsp
7. Power Management Ic Packaging Market, by Solution
7.1. Introduction
7.2. Configurable Pmics
7.3. Dc-To-Dc Solutions
7.4. Linear Voltage Regulators
7.5. Pmics for Networking
7.6. Pmics for I.Mx Application Processors
7.7. Switching Regulators
8. Power Management Ic Packaging Market, by Application
8.1. Introduction
8.2. Automotive Infotainment & Telematic Devices
8.3. Digital Cameras
8.4. Digital Tv Processor
8.5. Fitness Trackers & Wearable Devices
8.6. Portable Industrial & Medical Devices
8.7. Portable Media Players & Readers
8.8. Smartphones
8.9. Tablets & Pcs
9. California Power Management Ic Packaging Market10. Florida Power Management Ic Packaging Market11. Illinois Power Management Ic Packaging Market12. New York Power Management Ic Packaging Market13. Ohio Power Management Ic Packaging Market14. Pennsylvania Power Management Ic Packaging Market15. Texas Power Management Ic Packaging Market
16. Competitive Landscape
16.1. Fpnv Positioning Matrix
16.1.1. Quadrants
16.1.2. Business Strategy
16.1.3. Product Satisfaction
16.2. Market Ranking Analysis
16.3. Market Share Analysis, by Key Player
16.4. Competitive Scenario
16.4.1. Merger & Acquisition
16.4.2. Agreement, Collaboration, & Partnership
16.4.3. New Product Launch & Enhancement
16.4.4. Investment & Funding
16.4.5. Award, Recognition, & Expansion
17. Company Usability Profiles
17.1. 3D Plus, Inc.
17.2. Ablic Inc.
17.3. Analog Devices / Linear Technology
17.4. Dialog Semiconductor
17.5. Good-Ark Semiconductor Usa Corp.
17.6. Hana Micron Inc.
17.7. Jilin Sino-Microelectronics Co., Ltd.
17.8. Maxim Integrated Products Inc
17.9. Microchip Technology Inc
17.10. Nxp Semiconductors N.V.
17.11. on Semiconductor Corporation
17.12. Semtech Corporation
17.13. Shenzhen Electronics Group Co., Ltd.
17.14. Texas Instruments Incorporated
17.15. Toshiba Corporation
17.16. Wuxi China Resources Microelectronics Co. Ltd.
18. Appendix
18.1. Discussion Guide
18.2. License & Pricing
List of Figures
FIGURE 1. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET: RESEARCH PROCESS
FIGURE 2. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2021 VS 2027 (USD MILLION)
FIGURE 3. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2019-2027 (USD MILLION)
FIGURE 4. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY STATE, 2021 VS 2027 (%)
FIGURE 5. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 6. COMPETITIVE STRATEGIC WINDOW FOR UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY STATE, 2027
FIGURE 7. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET DYNAMICS
FIGURE 8. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2021 VS 2027 (%)
FIGURE 9. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2021 VS 2027 (USD MILLION)
FIGURE 10. COMPETITIVE STRATEGIC WINDOW FOR UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2027
FIGURE 11. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY BGA, 2019-2027 (USD MILLION)
FIGURE 12. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY BGA, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 13. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HSOP32, 2019-2027 (USD MILLION)
FIGURE 14. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HSOP32, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 15. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HVNON10, 2019-2027 (USD MILLION)
FIGURE 16. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HVNON10, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 17. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HVQFN, 2019-2027 (USD MILLION)
FIGURE 18. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HVQFN, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 19. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY QFN, 2019-2027 (USD MILLION)
FIGURE 20. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY QFN, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 21. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY WLCSP, 2019-2027 (USD MILLION)
FIGURE 22. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY WLCSP, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 23. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2021 VS 2027 (%)
FIGURE 24. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2021 VS 2027 (USD MILLION)
FIGURE 25. COMPETITIVE STRATEGIC WINDOW FOR UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2027
FIGURE 26. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY CONFIGURABLE PMICS, 2019-2027 (USD MILLION)
FIGURE 27. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY CONFIGURABLE PMICS, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 28. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DC-TO-DC SOLUTIONS, 2019-2027 (USD MILLION)
FIGURE 29. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DC-TO-DC SOLUTIONS, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 30. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY LINEAR VOLTAGE REGULATORS, 2019-2027 (USD MILLION)
FIGURE 31. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY LINEAR VOLTAGE REGULATORS, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 32. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PMICS FOR NETWORKING, 2019-2027 (USD MILLION)
FIGURE 33. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PMICS FOR NETWORKING, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 34. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PMICS FOR I.MX APPLICATION PROCESSORS, 2019-2027 (USD MILLION)
FIGURE 35. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PMICS FOR I.MX APPLICATION PROCESSORS, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 36. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SWITCHING REGULATORS, 2019-2027 (USD MILLION)
FIGURE 37. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SWITCHING REGULATORS, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 38. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2021 VS 2027 (%)
FIGURE 39. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2021 VS 2027 (USD MILLION)
FIGURE 40. COMPETITIVE STRATEGIC WINDOW FOR UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2027
FIGURE 41. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY AUTOMOTIVE INFOTAINMENT & TELEMATIC DEVICES, 2019-2027 (USD MILLION)
FIGURE 42. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY AUTOMOTIVE INFOTAINMENT & TELEMATIC DEVICES, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 43. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DIGITAL CAMERAS, 2019-2027 (USD MILLION)
FIGURE 44. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DIGITAL CAMERAS, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 45. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DIGITAL TV PROCESSOR, 2019-2027 (USD MILLION)
FIGURE 46. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DIGITAL TV PROCESSOR, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 47. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY FITNESS TRACKERS & WEARABLE DEVICES, 2019-2027 (USD MILLION)
FIGURE 48. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY FITNESS TRACKERS & WEARABLE DEVICES, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 49. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PORTABLE INDUSTRIAL & MEDICAL DEVICES, 2019-2027 (USD MILLION)
FIGURE 50. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PORTABLE INDUSTRIAL & MEDICAL DEVICES, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 51. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PORTABLE MEDIA PLAYERS & READERS, 2019-2027 (USD MILLION)
FIGURE 52. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PORTABLE MEDIA PLAYERS & READERS, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 53. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SMARTPHONES, 2019-2027 (USD MILLION)
FIGURE 54. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SMARTPHONES, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 55. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TABLETS & PCS, 2019-2027 (USD MILLION)
FIGURE 56. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TABLETS & PCS, BY STATE, 2021 VS 2027 (USD MILLION)
FIGURE 57. CALIFORNIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2019-2027 (USD MILLION)
FIGURE 58. FLORIDA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2019-2027 (USD MILLION)
FIGURE 59. ILLINOIS POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2019-2027 (USD MILLION)
FIGURE 60. NEW YORK POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2019-2027 (USD MILLION)
FIGURE 61. OHIO POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2019-2027 (USD MILLION)
FIGURE 62. PENNSYLVANIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2019-2027 (USD MILLION)
FIGURE 63. TEXAS POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2019-2027 (USD MILLION)
FIGURE 64. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET: FPNV POSITIONING MATRIX, 2021
FIGURE 65. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2021
FIGURE 66. COMPETITIVE SCENARIO ANALYSIS IN UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET, BY TYPE
List of Tables
TABLE 1. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SEGMENTATION & COVERAGE
TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2016-2020
TABLE 3. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2019-2027 (USD MILLION)
TABLE 4. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY STATE, 2019-2027 (USD MILLION)
TABLE 5. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2019-2027 (USD MILLION)
TABLE 6. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY BGA, BY STATE, 2019-2027 (USD MILLION)
TABLE 7. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HSOP32, BY STATE, 2019-2027 (USD MILLION)
TABLE 8. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HVNON10, BY STATE, 2019-2027 (USD MILLION)
TABLE 9. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HVQFN, BY STATE, 2019-2027 (USD MILLION)
TABLE 10. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY QFN, BY STATE, 2019-2027 (USD MILLION)
TABLE 11. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY WLCSP, BY STATE, 2019-2027 (USD MILLION)
TABLE 12. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2019-2027 (USD MILLION)
TABLE 13. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY CONFIGURABLE PMICS, BY STATE, 2019-2027 (USD MILLION)
TABLE 14. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DC-TO-DC SOLUTIONS, BY STATE, 2019-2027 (USD MILLION)
TABLE 15. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY LINEAR VOLTAGE REGULATORS, BY STATE, 2019-2027 (USD MILLION)
TABLE 16. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PMICS FOR NETWORKING, BY STATE, 2019-2027 (USD MILLION)
TABLE 17. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PMICS FOR I.MX APPLICATION PROCESSORS, BY STATE, 2019-2027 (USD MILLION)
TABLE 18. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SWITCHING REGULATORS, BY STATE, 2019-2027 (USD MILLION)
TABLE 19. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2019-2027 (USD MILLION)
TABLE 20. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY AUTOMOTIVE INFOTAINMENT & TELEMATIC DEVICES, BY STATE, 2019-2027 (USD MILLION)
TABLE 21. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DIGITAL CAMERAS, BY STATE, 2019-2027 (USD MILLION)
TABLE 22. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DIGITAL TV PROCESSOR, BY STATE, 2019-2027 (USD MILLION)
TABLE 23. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY FITNESS TRACKERS & WEARABLE DEVICES, BY STATE, 2019-2027 (USD MILLION)
TABLE 24. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PORTABLE INDUSTRIAL & MEDICAL DEVICES, BY STATE, 2019-2027 (USD MILLION)
TABLE 25. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PORTABLE MEDIA PLAYERS & READERS, BY STATE, 2019-2027 (USD MILLION)
TABLE 26. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SMARTPHONES, BY STATE, 2019-2027 (USD MILLION)
TABLE 27. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TABLETS & PCS, BY STATE, 2019-2027 (USD MILLION)
TABLE 28. CALIFORNIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2019-2027 (USD MILLION)
TABLE 29. CALIFORNIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2019-2027 (USD MILLION)
TABLE 30. CALIFORNIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2019-2027 (USD MILLION)
TABLE 31. CALIFORNIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2019-2027 (USD MILLION)
TABLE 32. FLORIDA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2019-2027 (USD MILLION)
TABLE 33. FLORIDA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2019-2027 (USD MILLION)
TABLE 34. FLORIDA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2019-2027 (USD MILLION)
TABLE 35. FLORIDA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2019-2027 (USD MILLION)
TABLE 36. ILLINOIS POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2019-2027 (USD MILLION)
TABLE 37. ILLINOIS POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2019-2027 (USD MILLION)
TABLE 38. ILLINOIS POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2019-2027 (USD MILLION)
TABLE 39. ILLINOIS POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2019-2027 (USD MILLION)
TABLE 40. NEW YORK POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2019-2027 (USD MILLION)
TABLE 41. NEW YORK POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2019-2027 (USD MILLION)
TABLE 42. NEW YORK POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2019-2027 (USD MILLION)
TABLE 43. NEW YORK POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2019-2027 (USD MILLION)
TABLE 44. OHIO POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2019-2027 (USD MILLION)
TABLE 45. OHIO POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2019-2027 (USD MILLION)
TABLE 46. OHIO POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2019-2027 (USD MILLION)
TABLE 47. OHIO POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2019-2027 (USD MILLION)
TABLE 48. PENNSYLVANIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2019-2027 (USD MILLION)
TABLE 49. PENNSYLVANIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2019-2027 (USD MILLION)
TABLE 50. PENNSYLVANIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2019-2027 (USD MILLION)
TABLE 51. PENNSYLVANIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2019-2027 (USD MILLION)
TABLE 52. TEXAS POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2019-2027 (USD MILLION)
TABLE 53. TEXAS POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2019-2027 (USD MILLION)
TABLE 54. TEXAS POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2019-2027 (USD MILLION)
TABLE 55. TEXAS POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2019-2027 (USD MILLION)
TABLE 56. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET: FPNV POSITIONING MATRIX - SCORES, 2021
TABLE 57. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET: FPNV POSITIONING MATRIX - BUSINESS STRATEGY, 2021
TABLE 58. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET: FPNV POSITIONING MATRIX - PRODUCT SATISFACTION, 2021
TABLE 59. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET RANKING
TABLE 60. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2021
TABLE 61. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET MERGER & ACQUISITION
TABLE 62. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET AGREEMENT, COLLABORATION, & PARTNERSHIP
TABLE 63. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET NEW PRODUCT LAUNCH & ENHANCEMENT
TABLE 64. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET INVESTMENT & FUNDING
TABLE 65. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET AWARD, RECOGNITION, & EXPANSION
TABLE 66. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET: LICENSE & PRICING
  • 3D Plus, Inc.
  • ABLIC Inc.
  • Analog Devices / Linear Technology
  • Dialog Semiconductor
  • Good-Ark Semiconductor USA Corp.
  • HANA Micron Inc.
  • Jilin Sino-Microelectronics Co., Ltd.
  • Maxim Integrated Products Inc
  • Microchip Technology Inc
  • NXP Semiconductors N.V.
  • ON Semiconductor Corporation
  • Semtech Corporation
  • Shenzhen Electronics Group Co., Ltd.
  • Texas Instruments Incorporated
  • Toshiba Corporation
  • Wuxi China Resources Microelectronics Co. Ltd.

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