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Semiconductor Assembly and Packaging Services - Global Market Trajectory & Analytics

  • ID: 5140306
  • Report
  • April 2021
  • Region: Global
  • 142 pages
  • Global Industry Analysts, Inc
Global Semiconductor Assembly and Packaging Services Market to Reach $8.5 Billion by 2027

Amid the COVID-19 crisis, the global market for Semiconductor Assembly and Packaging Services estimated at US$6.1 Billion in the year 2020, is projected to reach a revised size of US$8.5 Billion by 2027, growing at a CAGR of 4.7% over the analysis period 2020-2027. Communication, one of the segments analyzed in the report, is projected to record a 5.1% CAGR and reach US$4.1 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Computing & Networking segment is readjusted to a revised 4.5% CAGR for the next 7-year period.



The U.S. Market is Estimated at $1.8 Billion, While China is Forecast to Grow at 4.5% CAGR

The Semiconductor Assembly and Packaging Services market in the U.S. is estimated at US$1.8 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$1.5 Billion by the year 2027 trailing a CAGR of 4.5% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.4% and 3.9% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 4.5% CAGR.

Industrial & Automotive Segment to Record 4.1% CAGR

In the global Industrial & Automotive segment, USA, Canada, Japan, China and Europe will drive the 4.2% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$557.1 Million in the year 2020 will reach a projected size of US$742.1 Million by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$942.9 Million by the year 2027.

Select Competitors (Total 52 Featured):
  • Amkor Technology, Inc.
  • ASE Group
  • Intel Corporation
  • Samsung Electronics Co., Ltd.
  • Siliconware Precision Industries Co., Ltd.
  • TSMC Ltd.
Note: Product cover images may vary from those shown
I. METHODOLOGY

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW
  • Influencer Market Insights
  • World Market Trajectories
  • Impact of Covid-19 and a Looming Global Recession
2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE
  • Table 1: World Current & Future Analysis for Semiconductor Assembly and Packaging Services by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 2: World Historic Review for Semiconductor Assembly and Packaging Services by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 3: World 15-Year Perspective for Semiconductor Assembly and Packaging Services by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2020 & 2027
  • Table 4: World Current & Future Analysis for Communication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 5: World Historic Review for Communication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 6: World 15-Year Perspective for Communication by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
  • Table 7: World Current & Future Analysis for Computing & Networking by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 8: World Historic Review for Computing & Networking by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 9: World 15-Year Perspective for Computing & Networking by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
  • Table 10: World Current & Future Analysis for Industrial & Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 11: World Historic Review for Industrial & Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 12: World 15-Year Perspective for Industrial & Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
  • Table 13: World Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 14: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 15: World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
III. MARKET ANALYSIS
  • UNITED STATES
  • Table 16: USA Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 17: USA Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 18: USA 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • CANADA
  • Table 19: Canada Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 20: Canada Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 21: Canada 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • JAPAN
  • Table 22: Japan Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 23: Japan Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 24: Japan 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • CHINA
  • Table 25: China Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 26: China Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 27: China 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • EUROPE
  • Table 28: Europe Current & Future Analysis for Semiconductor Assembly and Packaging Services by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 29: Europe Historic Review for Semiconductor Assembly and Packaging Services by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 30: Europe 15-Year Perspective for Semiconductor Assembly and Packaging Services by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2020 & 2027
  • Table 31: Europe Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 32: Europe Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 33: Europe 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • FRANCE
  • Table 34: France Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 35: France Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 36: France 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • GERMANY
  • Table 37: Germany Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 38: Germany Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 39: Germany 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • ITALY
  • Table 40: Italy Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 41: Italy Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 42: Italy 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • UNITED KINGDOM
  • Table 43: UK Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 44: UK Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 45: UK 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • REST OF EUROPE
  • Table 46: Rest of Europe Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 47: Rest of Europe Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 48: Rest of Europe 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • ASIA-PACIFIC
  • Table 49: Asia-Pacific Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 50: Asia-Pacific Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 51: Asia-Pacific 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • REST OF WORLD
  • Table 52: Rest of World Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 53: Rest of World Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 54: Rest of World 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
IV. COMPETITION
  • Total Companies Profiled: 52
Note: Product cover images may vary from those shown
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