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Wafer-level Packaging Equipment : Global Strategic Business Report

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    Report

  • 289 Pages
  • April 2024
  • Region: Global
  • Global Industry Analysts, Inc
  • ID: 5140353
Description Jump to:

Global Wafer-level Packaging Equipment Market to Reach $20.8 Billion by 2030

The global market for Wafer-level Packaging Equipment estimated at US$5.4 Billion in the year 2022, is projected to reach a revised size of US$20.8 Billion by 2030, growing at a CAGR of 18.4% over the analysis period 2022-2030.

The U.S. Market is Estimated at $1.4 Billion, While China is Forecast to Grow at 23.4% CAGR

The Wafer-level Packaging Equipment market in the U.S. is estimated at US$1.4 Billion in the year 2022. China, the world's second largest economy, is forecast to reach a projected market size of US$5.6 Billion by the year 2030 trailing a CAGR of 23.4% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 13.1% and 15.8% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 14.2% CAGR.

Select Competitors (Total 31 Featured) -

  • Applied Materials, Inc.
  • Disco, Inc.
  • EV Group
  • Rudolph Technologies, Inc.
  • Semes Co., Ltd.
  • Suss MicroTec AG
  • ULVAC Technologies, Inc.

What's New?

  • Special coverage on Russia-Ukraine war; global inflation; easing of zero-Covid policy in China and its `bumpy` reopening; supply chain disruptions, global trade tensions; and risk of recession.
  • Global competitiveness and key competitor percentage market shares
  • Market presence across multiple geographies - Strong/Active/Niche/Trivial
  • Online interactive peer-to-peer collaborative bespoke updates
  • Access to digital archives and the publisher's Research Platform
  • Complimentary updates for one year

Table of Contents

I. METHODOLOGYII. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
  • Influencer Market Insights
  • World Market Trajectories
  • Wafer-level Packaging Equipment - Global Key Competitors Percentage Market Share in 2021 (E)
  • Impact of Covid-19 and a Looming Global Recession
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2021 (E)
2. FOCUS ON SELECT PLAYERS3. MARKET TRENDS & DRIVERS
4. GLOBAL MARKET PERSPECTIVE
  • Table 1: World Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 2: World 8-Year Perspective for Wafer-level Packaging Equipment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2023 & 2030
  • Table 3: World Wafer-level Packaging Equipment Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
III. MARKET ANALYSIS
  • UNITED STATES
  • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2023 (E)
  • Table 4: USA Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • CANADA
  • Table 5: Canada Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • JAPAN
  • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2023 (E)
  • Table 6: Japan Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • CHINA
  • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2023 (E)
  • Table 7: China Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • EUROPE
  • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2023 (E)
  • Table 8: Europe Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 9: Europe 8-Year Perspective for Wafer-level Packaging Equipment by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2023 & 2030
  • FRANCE
  • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2023 (E)
  • Table 10: France Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • GERMANY
  • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2023 (E)
  • Table 11: Germany Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • ITALY
  • Table 12: Italy Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • UNITED KINGDOM
  • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2023 (E)
  • Table 13: UK Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • SPAIN
  • Table 14: Spain Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • RUSSIA
  • Table 15: Russia Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • REST OF EUROPE
  • Table 16: Rest of Europe Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • ASIA-PACIFIC
  • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2023 (E)
  • Table 17: Asia-Pacific Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 18: Asia-Pacific 8-Year Perspective for Wafer-level Packaging Equipment by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2023 & 2030
  • AUSTRALIA
  • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2023 (E)
  • Table 19: Australia Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • INDIA
  • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2023 (E)
  • Table 20: India Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • SOUTH KOREA
  • Table 21: South Korea Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • REST OF ASIA-PACIFIC
  • Table 22: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • LATIN AMERICA
  • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2023 (E)
  • Table 23: Latin America Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 24: Latin America 8-Year Perspective for Wafer-level Packaging Equipment by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2023 & 2030
  • ARGENTINA
  • Table 25: Argentina Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • BRAZIL
  • Table 26: Brazil Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • MEXICO
  • Table 27: Mexico Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • REST OF LATIN AMERICA
  • Table 28: Rest of Latin America Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • MIDDLE EAST
  • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2023 (E)
  • Table 29: Middle East Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 30: Middle East 8-Year Perspective for Wafer-level Packaging Equipment by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2023 & 2030
  • IRAN
  • Table 31: Iran Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • ISRAEL
  • Table 32: Israel Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • SAUDI ARABIA
  • Table 33: Saudi Arabia Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • UNITED ARAB EMIRATES
  • Table 34: UAE Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • REST OF MIDDLE EAST
  • Table 35: Rest of Middle East Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • AFRICA
  • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2023 (E)
  • Table 36: Africa Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
IV. COMPETITION

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • Applied Materials, Inc.
  • Disco, Inc.
  • EV Group
  • Rudolph Technologies, Inc.
  • Semes Co., Ltd.
  • Suss MicroTec AG
  • ULVAC Technologies, Inc.

Table Information

Report AttributeDetails
No. of Pages289
PublishedApril 2024
Forecast Period2022 - 2030
Estimated Market Value ( USD ) in 2022 $ 5.4 Billion
Forecasted Market Value ( USD ) by 2030 $ 20.8 Billion
Compound Annual Growth Rate18.4%
Regions CoveredGlobal

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About the Wafer Level Packaging Market

Wafer Level Packaging (WLP) is a type of semiconductor packaging technology that is used to package integrated circuits (ICs) at the wafer level. It is a cost-effective and reliable way to package ICs, as it eliminates the need for additional packaging steps. WLP is used in a variety of applications, including consumer electronics, automotive, and medical devices. WLP is a form of chip-scale packaging, which is a type of packaging technology that reduces the size of the package and increases the number of ICs that can be placed on a single wafer. This technology also reduces the cost of packaging and increases the performance of the ICs. WLP is also used to reduce the number of interconnects between the ICs and the package, which reduces the power consumption of the ICs. The Wafer Level Packaging market is expected to grow in the coming years due to the increasing demand for smaller and more efficient ICs. The market is also expected to benefit from the increasing demand for consumer electronics and automotive applications. Some of the major companies in the Wafer Level Packaging market include Amkor Technology, STATS ChipPAC, ASE Group, and Chipbond Technology. Show Less Read more

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