The Latin America, Middle East and Africa Mixed Signal IC Market is expected to witness market growth of 7.9% CAGR during the forecast period (2020-2026).
Developing specific features by using analog modules & incorporating it with mixed signal can enhance performance to a large extent and can push various innovations. These modules accessible in the market can be incorporated into systems to create features which can offer high level of analog integration variables combined with low power performance and less costs. These advancements in the system offer distinct solutions that are completely programmable which bring considerable cost savings. These factors are likely to boost the development of mixed IC market during the forecast period.
Mixed-signal design integrates new digital processing & storage with analog circuitry that allows electronic framework interacts with real-world. To be extremely advantageous for the society, mixed-signal application needs to integrate a superior degree of functional performance, efficiency, reliability, and versatility.
The conventional electromechanical systems are substituted with solid-state electronic systems in the industrial market. The integration of transducer directly on the silicon is the unique feature of the majority of these systems. Examples of these systems include magnetic, temperature, and light sensing. These applications offer an additional layer of intelligence directly at the sensing node. Intelligent communication over long-term statistical performance monitoring, the communications network (protocol), and local in service diagnostic functionality are facilitated by the flexibility which is achieved after integrating a microprocessor in the design. These extra features are bringing highly reliable and high-performance sensing systems to the industry.
Based on Type, the market is segmented into Mixed Signal SoC, Microcontroller and Data Converter. Based on End User, the market is segmented into Consumer Electronics, Medical & Healthcare, Telecommunication, Automotive, and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The Brazil market dominated the LAMEA Medical & Healthcare Mixed Signal IC Market by Country in 2019, thereby, achieving a market value of $537 million by 2026. The Argentina market is expected to witness a CAGR of 7.6% during (2020 - 2026). Additionally, The UAE market is experiencing a CAGR of 6.8% during (2020 - 2026).
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Analog Devices, Inc., Broadcom, Inc., Infineon Technologies AG, NXP Semiconductors N.V., Renesas Electronics Corporation, STMicroelectronics N.V., Texas Instruments, Inc., Intel Corporation, Telephonics Corporation (Griffon Corporation), and Ensilica Limited.
Scope of the Study
Market Segments covered in the Report:
By Type
By End User
By Country
Companies Profiled
Unique Offerings from the Publisher
Developing specific features by using analog modules & incorporating it with mixed signal can enhance performance to a large extent and can push various innovations. These modules accessible in the market can be incorporated into systems to create features which can offer high level of analog integration variables combined with low power performance and less costs. These advancements in the system offer distinct solutions that are completely programmable which bring considerable cost savings. These factors are likely to boost the development of mixed IC market during the forecast period.
Mixed-signal design integrates new digital processing & storage with analog circuitry that allows electronic framework interacts with real-world. To be extremely advantageous for the society, mixed-signal application needs to integrate a superior degree of functional performance, efficiency, reliability, and versatility.
The conventional electromechanical systems are substituted with solid-state electronic systems in the industrial market. The integration of transducer directly on the silicon is the unique feature of the majority of these systems. Examples of these systems include magnetic, temperature, and light sensing. These applications offer an additional layer of intelligence directly at the sensing node. Intelligent communication over long-term statistical performance monitoring, the communications network (protocol), and local in service diagnostic functionality are facilitated by the flexibility which is achieved after integrating a microprocessor in the design. These extra features are bringing highly reliable and high-performance sensing systems to the industry.
Based on Type, the market is segmented into Mixed Signal SoC, Microcontroller and Data Converter. Based on End User, the market is segmented into Consumer Electronics, Medical & Healthcare, Telecommunication, Automotive, and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The Brazil market dominated the LAMEA Medical & Healthcare Mixed Signal IC Market by Country in 2019, thereby, achieving a market value of $537 million by 2026. The Argentina market is expected to witness a CAGR of 7.6% during (2020 - 2026). Additionally, The UAE market is experiencing a CAGR of 6.8% during (2020 - 2026).
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Analog Devices, Inc., Broadcom, Inc., Infineon Technologies AG, NXP Semiconductors N.V., Renesas Electronics Corporation, STMicroelectronics N.V., Texas Instruments, Inc., Intel Corporation, Telephonics Corporation (Griffon Corporation), and Ensilica Limited.
Scope of the Study
Market Segments covered in the Report:
By Type
- Mixed Signal SoC
- Microcontroller
- Data Converter
By End User
- Consumer Electronics
- Medical & Healthcare
- Telecommunication
- Automotive
- Others
By Country
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Companies Profiled
- Broadcom, Inc.
- Infineon Technologies AG
- NXP Semiconductors N.V.
- Renesas Electronics Corporation
- STMicroelectronics N.V.
- Texas Instruments, Inc.
- Intel Corporation
- Telephonics Corporation (Griffon Corporation)
- Ensilica Limited
Unique Offerings from the Publisher
- Exhaustive coverage
- Highest number of market tables and figures
- Subscription based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. LAMEA Mixed Signal IC Market by Type
Chapter 4. LAMEA Mixed Signal IC Market by End User
Chapter 5. LAMEA Mixed Signal IC Market by Country
Chapter 6. Company Profiles
Companies Mentioned
- Broadcom, Inc.
- Infineon Technologies AG
- NXP Semiconductors N.V.
- Renesas Electronics Corporation
- STMicroelectronics N.V.
- Texas Instruments, Inc.
- Intel Corporation
- Telephonics Corporation (Griffon Corporation)
- Ensilica Limited
Methodology
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