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Global Mixed Signal IC Market By Type (Mixed Signal SoC, Microcontroller and Data Converter), By End User (Consumer Electronics, Medical & Healthcare, Telecommunication, Automotive, and Others), By Region, Industry Analysis and Forecast, 2020 - 2026

  • ID: 5305617
  • Report
  • February 2021
  • Region: Global
  • 180 pages
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
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FEATURED COMPANIES

  • Broadcom, Inc.
  • Ensilica Limited
  • Infineon Technologies AG
  • Intel Corporation
  • NXP Semiconductors N.V.
  • STMicroelectronics N.V.
  • MORE
The Global Mixed Signal IC Market size is expected to reach $141.5 billion by 2026, rising at a market growth of 7.6% CAGR during the forecast period. A mixed IC is considered as the combination of digital and analog IC on a single chip. Using these ICs, analog signals like light, sound, and heat can be converted into digital signals for processing electronic products. Mixed-signal ICs find considerable applications in automotive, security & surveillance, consumer electronics, communications, healthcare, IoT, and industrial equipment. Due to their dual ability, these ICs are extensively adopted in order to convert analog into digital and digital into analog.

One of the major drivers for the market growth includes its’ high demand in test & measurement devices. Mixed-signal ICs are increasingly being used for test & measurement instruments like digital oscilloscope, weigh use, spectrum analyzers, and precision measurement. Using mixed-signal ICs, manufacturers of the electronics industry can develop highly accurate components and devices, which are highly demanded from OEMs. Mixed-signal ICs play an important role in test and measurement systems as the data processing rate is high while at the same time keeping high accuracy. With the help of mixed-signal ICs, it becomes easier to transform analog signals into a digital image/signal that further aids in making the accurate decision.

The COVID-19 pandemic caused disturbances in the supply chain, a shutdown of business, uncertain scenarios in the stock market, and expands the panic situation among customer segments. The COVID-19 pandemic severely impacted the manufacturing process of various industries such as semiconductors & electronics. The demand & supply chain is further disrupted by trade barriers. Administrations of various countries have imposed strict lockdown regulations and have close down industries on a temporary basis, which negatively impacted the overall manufacturing process.

Type Outlook

Based on Type, the market is segmented into Mixed Signal SoC, Microcontroller and Data Converter. In 2019, the mixed-signal SoC segment acquired the major revenue share. This is because mixed-signal SoCs find potential application across various end-use industries like consumer electronics, IT & telecommunication, military & defense, medical & healthcare, and automotive. In addition, the adoption of mixed-signal SoCs is significantly boosted by its low power consumption. Using mixed-signal SoC, not only the size but also the power consumption can be reduced. As a result, the reliability of the overall framework gets superior, which is a major factor behind its adoption.

End User Outlook

Based on End User, the market is segmented into Consumer Electronics, Medical & Healthcare, Telecommunication, Automotive, and Others. On the basis of end-use, the consumer electronics segment procured the maximum revenue of the global mixed-signal IC market in 2019. There is high adoption of mixed-signal IC in mobile phones and electronics, due to substantial development of the telecommunication, electronics, and other industries. The global mixed-signal IC market is expected to grow due to the advent of the 5G network & high demand for low-power consumption devices.

Regional Outlook

Based on Regions, the market is segmented into North America, Europe, Asia Pacific, and Latin America, Middle East & Africa. In 2019, North America emerged as one of the leading regions; although, the market in the Asia-Pacific region is anticipated to develop at a quick rate in comparison to other regions. The growth of the Asia-Pacific market is estimated to be fuelled due to the factors like a surge in demand for consumer applications, high adoption of 5G technology, and low power consumption by mixed-signal ICs.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Analog Devices, Inc., Broadcom, Inc., Infineon Technologies AG, NXP Semiconductors N.V., Renesas Electronics Corporation, STMicroelectronics N.V., Texas Instruments, Inc., Intel Corporation, Telephonics Corporation (Griffon Corporation), and Ensilica Limited.

Strategies deployed in High Performance Computing (HPC) Chipset Market

Jan-2021: Intel launched the new N-series 10-nanometer Intel Pentium Silver and Intel Celeron processors. These processors provide an unmatched balance of performance, media and collaboration for education systems.

Nov-2020: IBM signed a joint development agreement with AMD for enhancing and extending the security and Artificial Intelligence (AI) offerings of both the companies. The agreement aimed to expand this vision by building upon open-source software, open standards, and open system architectures for driving 'confidential computing' in hybrid cloud environments.

Oct-2020: AMD completed the acquisition of Xilinx, an American technology company. Both the companies is expected to merge to create a new high-performance computing company. Xilinx’s technology is expected to be integrated into AMD’s products for actualizing a highly integrated CPU+FPGA solution.

Sep-2020: NVIDIA agreed to acquire British chip designer Arm, from SoftBankWe. The acquisition aims to maintain its open-licensing model and customer neutrality, offering customers in any industry, across the world, and is expected to further expand Arm’s IP licensing portfolio with NVIDIA’s world-leading GPU and AI technology.

Nov-2019: Intel introduced the new GPU Architecture with High-Performance Computing and AI Acceleration, and oneAPI Software Stack with Unified and Scalable Abstraction for Heterogeneous Architectures. The company launched its vision for accelerating its leadership in the convergence of high-performance computing (HPC) and artificial intelligence (AI) with new additions to its data-centric silicon portfolio and a new software initiative.

Jun-2019: AMD came into partnership with Samsung Exynos. Following this partnership, Samsung licensed AMD’s Radeon graphics technologies for use in mobile applications including smartphones. Samsung uses ultra-low power high-performance mobile graphics IP based on AMD Radeon graphics technologies for use in its devices.

Scope of the Study

Market Segments covered in the Report:

By Type
  • Mixed Signal SoC
  • Microcontroller
  • Data Converter
By End User
  • Consumer Electronics
  • Medical & Healthcare
  • Telecommunication
  • Automotive
  • Others
By Geography
  • North America
  • US
  • Canada
  • Mexico
  • Rest of North America
  • Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific
  • LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA
Companies Profiled
  • Broadcom, Inc.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Renesas Electronics Corporation
  • STMicroelectronics N.V.
  • Texas Instruments, Inc.
  • Intel Corporation
  • Telephonics Corporation (Griffon Corporation)
  • Ensilica Limited
Unique Offerings from the Publisher
  • Exhaustive coverage
  • Highest number of market tables and figures
  • Subscription based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Broadcom, Inc.
  • Ensilica Limited
  • Infineon Technologies AG
  • Intel Corporation
  • NXP Semiconductors N.V.
  • STMicroelectronics N.V.
  • MORE
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global Mixed Signal IC Market, by Type
1.4.2 Global Mixed Signal IC Market, by End User
1.4.3 Global Mixed Signal IC Market, by Geography
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. Global Mixed Signal IC Market by Type
3.1 Global Mixed Signal SoC Mixed Signal IC Market by Region
3.2 Global Microcontroller Mixed Signal IC Market by Region
3.3 Global Data Converter Mixed Signal IC Market by Region

Chapter 4. Global Mixed Signal IC Market by End User
4.1 Global Consumer Electronics Mixed Signal IC Market by Region
4.2 Global Medical & Healthcare Mixed Signal IC Market by Region
4.3 Global Telecommunication Mixed Signal IC Market by Region
4.4 Global Automotive Mixed Signal IC Market by Region
4.5 Global Others Mixed Signal IC Market by Region

Chapter 5. Global Mixed Signal IC Market by Region
5.1 North America Mixed Signal IC Market
5.1.1 North America Mixed Signal IC Market by Type
5.1.1.1 North America Mixed Signal SoC Mixed Signal IC Market by Country
5.1.1.2 North America Microcontroller Mixed Signal IC Market by Country
5.1.1.3 North America Data Converter Mixed Signal IC Market by Country
5.1.2 North America Mixed Signal IC Market by End User
5.1.2.1 North America Consumer Electronics Mixed Signal IC Market by Country
5.1.2.2 North America Medical & Healthcare Mixed Signal IC Market by Country
5.1.2.3 North America Telecommunication Mixed Signal IC Market by Country
5.1.2.4 North America Automotive Mixed Signal IC Market by Country
5.1.2.5 North America Others Mixed Signal IC Market by Country
5.1.3 North America Mixed Signal IC Market by Country
5.1.3.1 US Mixed Signal IC Market
5.1.3.1.1 US Mixed Signal IC Market by Type
5.1.3.1.2 US Mixed Signal IC Market by End User
5.1.3.2 Canada Mixed Signal IC Market
5.1.3.2.1 Canada Mixed Signal IC Market by Type
5.1.3.2.2 Canada Mixed Signal IC Market by End User
5.1.3.3 Mexico Mixed Signal IC Market
5.1.3.3.1 Mexico Mixed Signal IC Market by Type
5.1.3.3.2 Mexico Mixed Signal IC Market by End User
5.1.3.4 Rest of North America Mixed Signal IC Market
5.1.3.4.1 Rest of North America Mixed Signal IC Market by Type
5.1.3.4.2 Rest of North America Mixed Signal IC Market by End User
5.2 Europe Mixed Signal IC Market
5.2.1 Europe Mixed Signal IC Market by Type
5.2.1.1 Europe Mixed Signal SoC Mixed Signal IC Market by Country
5.2.1.2 Europe Microcontroller Mixed Signal IC Market by Country
5.2.1.3 Europe Data Converter Mixed Signal IC Market by Country
5.2.2 Europe Mixed Signal IC Market by End User
5.2.2.1 Europe Consumer Electronics Mixed Signal IC Market by Country
5.2.2.2 Europe Medical & Healthcare Mixed Signal IC Market by Country
5.2.2.3 Europe Telecommunication Mixed Signal IC Market by Country
5.2.2.4 Europe Automotive Mixed Signal IC Market by Country
5.2.2.5 Europe Others Mixed Signal IC Market by Country
5.2.3 Europe Mixed Signal IC Market by Country
5.2.3.1 Germany Mixed Signal IC Market
5.2.3.1.1 Germany Mixed Signal IC Market by Type
5.2.3.1.2 Germany Mixed Signal IC Market by End User
5.2.3.2 UK Mixed Signal IC Market
5.2.3.2.1 UK Mixed Signal IC Market by Type
5.2.3.2.2 UK Mixed Signal IC Market by End User
5.2.3.3 France Mixed Signal IC Market
5.2.3.3.1 France Mixed Signal IC Market by Type
5.2.3.3.2 France Mixed Signal IC Market by End User
5.2.3.4 Russia Mixed Signal IC Market
5.2.3.4.1 Russia Mixed Signal IC Market by Type
5.2.3.4.2 Russia Mixed Signal IC Market by End User
5.2.3.5 Spain Mixed Signal IC Market
5.2.3.5.1 Spain Mixed Signal IC Market by Type
5.2.3.5.2 Spain Mixed Signal IC Market by End User
5.2.3.6 Italy Mixed Signal IC Market
5.2.3.6.1 Italy Mixed Signal IC Market by Type
5.2.3.6.2 Italy Mixed Signal IC Market by End User
5.2.3.7 Rest of Europe Mixed Signal IC Market
5.2.3.7.1 Rest of Europe Mixed Signal IC Market by Type
5.2.3.7.2 Rest of Europe Mixed Signal IC Market by End User
5.3 Asia Pacific Mixed Signal IC Market
5.3.1 Asia Pacific Mixed Signal IC Market by Type
5.3.1.1 Asia Pacific Mixed Signal SoC Mixed Signal IC Market by Country
5.3.1.2 Asia Pacific Microcontroller Mixed Signal IC Market by Country
5.3.1.3 Asia Pacific Data Converter Mixed Signal IC Market by Country
5.3.2 Asia Pacific Mixed Signal IC Market by End User
5.3.2.1 Asia Pacific Consumer Electronics Mixed Signal IC Market by Country
5.3.2.2 Asia Pacific Medical & Healthcare Mixed Signal IC Market by Country
5.3.2.3 Asia Pacific Telecommunication Mixed Signal IC Market by Country
5.3.2.4 Asia Pacific Automotive Mixed Signal IC Market by Country
5.3.2.5 Asia Pacific Others Mixed Signal IC Market by Country
5.3.3 Asia Pacific Mixed Signal IC Market by Country
5.3.3.1 China Mixed Signal IC Market
5.3.3.1.1 China Mixed Signal IC Market by Type
5.3.3.1.2 China Mixed Signal IC Market by End User
5.3.3.2 Japan Mixed Signal IC Market
5.3.3.2.1 Japan Mixed Signal IC Market by Type
5.3.3.2.2 Japan Mixed Signal IC Market by End User
5.3.3.3 India Mixed Signal IC Market
5.3.3.3.1 India Mixed Signal IC Market by Type
5.3.3.3.2 India Mixed Signal IC Market by End User
5.3.3.4 South Korea Mixed Signal IC Market
5.3.3.4.1 South Korea Mixed Signal IC Market by Type
5.3.3.4.2 South Korea Mixed Signal IC Market by End User
5.3.3.5 Singapore Mixed Signal IC Market
5.3.3.5.1 Singapore Mixed Signal IC Market by Type
5.3.3.5.2 Singapore Mixed Signal IC Market by End User
5.3.3.6 Malaysia Mixed Signal IC Market
5.3.3.6.1 Malaysia Mixed Signal IC Market by Type
5.3.3.6.2 Malaysia Mixed Signal IC Market by End User
5.3.3.7 Rest of Asia Pacific Mixed Signal IC Market
5.3.3.7.1 Rest of Asia Pacific Mixed Signal IC Market by Type
5.3.3.7.2 Rest of Asia Pacific Mixed Signal IC Market by End User
5.4 LAMEA Mixed Signal IC Market
5.4.1 LAMEA Mixed Signal IC Market by Type
5.4.1.1 LAMEA Mixed Signal SoC Mixed Signal IC Market by Country
5.4.1.2 LAMEA Microcontroller Mixed Signal IC Market by Country
5.4.1.3 LAMEA Data Converter Mixed Signal IC Market by Country
5.4.2 LAMEA Mixed Signal IC Market by End User
5.4.2.1 LAMEA Consumer Electronics Mixed Signal IC Market by Country
5.4.2.2 LAMEA Medical & Healthcare Mixed Signal IC Market by Country
5.4.2.3 LAMEA Telecommunication Mixed Signal IC Market by Country
5.4.2.4 LAMEA Automotive Mixed Signal IC Market by Country
5.4.2.5 LAMEA Others Mixed Signal IC Market by Country
5.4.3 LAMEA Mixed Signal IC Market by Country
5.4.3.1 Brazil Mixed Signal IC Market
5.4.3.1.1 Brazil Mixed Signal IC Market by Type
5.4.3.1.2 Brazil Mixed Signal IC Market by End User
5.4.3.2 Argentina Mixed Signal IC Market
5.4.3.2.1 Argentina Mixed Signal IC Market by Type
5.4.3.2.2 Argentina Mixed Signal IC Market by End User
5.4.3.3 UAE Mixed Signal IC Market
5.4.3.3.1 UAE Mixed Signal IC Market by Type
5.4.3.3.2 UAE Mixed Signal IC Market by End User
5.4.3.4 Saudi Arabia Mixed Signal IC Market
5.4.3.4.1 Saudi Arabia Mixed Signal IC Market by Type
5.4.3.4.2 Saudi Arabia Mixed Signal IC Market by End User
5.4.3.5 South Africa Mixed Signal IC Market
5.4.3.5.1 South Africa Mixed Signal IC Market by Type
5.4.3.5.2 South Africa Mixed Signal IC Market by End User
5.4.3.6 Nigeria Mixed Signal IC Market
5.4.3.6.1 Nigeria Mixed Signal IC Market by Type
5.4.3.6.2 Nigeria Mixed Signal IC Market by End User
5.4.3.7 Rest of LAMEA Mixed Signal IC Market
5.4.3.7.1 Rest of LAMEA Mixed Signal IC Market by Type
5.4.3.7.2 Rest of LAMEA Mixed Signal IC Market by End User

Chapter 6. Company Profiles
6.1 Analog Devices, Inc.
6.1.1 Company Overview
6.1.2 Financial Analysis
6.1.3 Segmental and Regional Analysis
6.1.4 Research & Development Expenses
6.1.5 Recent strategies and developments:
6.1.5.1 Acquisition and Mergers:
6.1.5.2 Product Launches and Product Expansions:
6.1.5.3 Geographical Expansions:
6.1.6 SWOT Analysis
6.2 Broadcom, Inc.
6.2.1 Company Overview
6.2.2 Financial Analysis
6.2.3 Segmental and Regional Analysis
6.2.4 Research & Development Expense
6.2.5 SWOT Analysis
6.3 Infineon Technologies AG
6.3.1 Company Overview
6.3.2 Financial Analysis
6.3.3 Segmental and Regional Analysis
6.3.4 Research & Development Expense
6.3.5 SWOT Analysis
6.4 NXP Semiconductors N.V.
6.4.1 Company Overview
6.4.2 Financial Analysis
6.4.3 Regional Analysis
6.4.4 Research & Development Expense
6.4.5 SWOT Analysis
6.5 Renesas Electronics Corporation
6.5.1 Company Overview
6.5.2 Financial Analysis
6.5.3 Segmental and Regional Analysis
6.5.4 Research & Development Expense
6.5.5 Recent strategies and developments:
6.5.5.1 Acquisition and Mergers:
6.6 STMicroelectronics N.V.
6.6.1 Company Overview
6.6.2 Financial Analysis
6.6.3 Segmental and Regional Analysis
6.6.4 Research & Development Expense
6.6.5 Recent strategies and developments:
6.6.5.1 Partnerships, Collaborations, and Agreements:
6.6.6 SWOT Analysis
6.7 Texas Instruments, Inc.
6.7.1 Company Overview
6.7.2 Financial Analysis
6.7.3 Segmental and Regional Analysis
6.7.4 Research & Development Expense
6.7.5 Recent strategies and developments:
6.7.5.1 Partnerships, Collaborations, and Agreements:
6.7.6 SWOT Analysis
6.8 Intel Corporation
6.8.1 Company Overview
6.8.2 Financial Analysis
6.8.3 Segmental and Regional Analysis
6.8.4 Research & Development Expenses
6.8.5 SWOT Analysis
6.9 Telephonics Corporation (Griffon Corporation)
6.9.1 Company Overview
6.9.2 Financial Analysis
6.9.3 Segmental and Regional Analysis
6.10. Ensilica Limited
6.10.1 Company Overview
Note: Product cover images may vary from those shown
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  • Broadcom, Inc.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Renesas Electronics Corporation
  • STMicroelectronics N.V.
  • Texas Instruments, Inc.
  • Intel Corporation
  • Telephonics Corporation (Griffon Corporation)
  • Ensilica Limited
Note: Product cover images may vary from those shown
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