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Europe Mixed Signal IC Market By Type (Mixed Signal SoC, Microcontroller and Data Converter), By End User (Consumer Electronics, Medical & Healthcare, Telecommunication, Automotive, and Others), By Country, Industry Analysis and Forecast, 2020 - 2026

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    Report

  • 89 Pages
  • February 2021
  • Region: Europe
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5305618
The Europe Mixed Signal IC Market is expected to witness market growth of 7.5% CAGR during the forecast period (2020-2026).

High frequency switching circuits are highly required in 5G technology. Generally, these switching circuits are utilized in mixed signal ICs. The mixed signal ICs has acquired massive popularity due to the adoption of 5G technology & other wireless technologies. At higher frequencies, distortion and losses raise. Due to this, the requirement for unique techniques is created which is available in mixed signal ICs.

Moreover, mixed-signal IC is significantly used in different applications in the consumer electronics industry, where they are installed in mobile phones, notebooks, led drivers, and other electronics devices. Hence, the above-mentioned scenarios explained the high utilization & demand of mixed signal ICs across different industry verticals. These factors are expected to propel the development of the mixed signal IC market during the forecast period.

Due to the surge in demand from the consumer electronics & telecommunication industries, the mixed-signal IC market is anticipated to witness considerable growth. This is ascribed to the fact that mixed-signal ICs are incorporated into the majority of devices like mobile phones, cameras, implantable devices, and modems routers, due to their compact size and high productivity.

Based on Type, the market is segmented into Mixed Signal SoC, Microcontroller and Data Converter. Based on End User, the market is segmented into Consumer Electronics, Medical & Healthcare, Telecommunication, Automotive, and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.

The Germany market dominated the Europe Telecommunication Mixed Signal IC Market by Country in 2019, growing at a CAGR of 7.5 % during the forecast period. The UK market is experiencing a CAGR of 7.9% during (2020 - 2026). Additionally, The France market is poised to grow at a CAGR of 9.4% during (2020 - 2026).

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Analog Devices, Inc., Broadcom, Inc., Infineon Technologies AG, NXP Semiconductors N.V., Renesas Electronics Corporation, STMicroelectronics N.V., Texas Instruments, Inc., Intel Corporation, Telephonics Corporation (Griffon Corporation), and Ensilica Limited.

Scope of the Study

Market Segments covered in the Report:

By Type
  • Mixed Signal SoC
  • Microcontroller
  • Data Converter

By End User
  • Consumer Electronics
  • Medical & Healthcare
  • Telecommunication
  • Automotive
  • Others

By Country
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe

Companies Profiled
  • Broadcom, Inc.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Renesas Electronics Corporation
  • STMicroelectronics N.V.
  • Texas Instruments, Inc.
  • Intel Corporation
  • Telephonics Corporation (Griffon Corporation)
  • Ensilica Limited

Unique Offerings from the Publisher
  • Exhaustive coverage
  • Highest number of market tables and figures
  • Subscription based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Mixed Signal IC Market, by Type
1.4.2 Europe Mixed Signal IC Market, by End User
1.4.3 Europe Mixed Signal IC Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.1 Market Restraints
Chapter 3. Europe Mixed Signal IC Market by Type
3.1 Europe Mixed Signal SoC Mixed Signal IC Market by Country
3.2 Europe Microcontroller Mixed Signal IC Market by Country
3.3 Europe Data Converter Mixed Signal IC Market by Country
Chapter 4. Europe Mixed Signal IC Market by End User
4.1 Europe Consumer Electronics Mixed Signal IC Market by Country
4.2 Europe Medical & Healthcare Mixed Signal IC Market by Country
4.3 Europe Telecommunication Mixed Signal IC Market by Country
4.4 Europe Automotive Mixed Signal IC Market by Country
4.5 Europe Others Mixed Signal IC Market by Country
Chapter 5. Europe Mixed Signal IC Market by Country
5.1 Germany Mixed Signal IC Market
5.1.1 Germany Mixed Signal IC Market by Type
5.1.2 Germany Mixed Signal IC Market by End User
5.2 UK Mixed Signal IC Market
5.2.1 UK Mixed Signal IC Market by Type
5.2.2 UK Mixed Signal IC Market by End User
5.3 France Mixed Signal IC Market
5.3.1 France Mixed Signal IC Market by Type
5.3.2 France Mixed Signal IC Market by End User
5.4 Russia Mixed Signal IC Market
5.4.1 Russia Mixed Signal IC Market by Type
5.4.2 Russia Mixed Signal IC Market by End User
5.5 Spain Mixed Signal IC Market
5.5.1 Spain Mixed Signal IC Market by Type
5.5.2 Spain Mixed Signal IC Market by End User
5.6 Italy Mixed Signal IC Market
5.6.1 Italy Mixed Signal IC Market by Type
5.6.2 Italy Mixed Signal IC Market by End User
5.7 Rest of Europe Mixed Signal IC Market
5.7.1 Rest of Europe Mixed Signal IC Market by Type
5.7.2 Rest of Europe Mixed Signal IC Market by End User
Chapter 6. Company Profiles
6.1 Analog Devices, Inc.
6.1.1 Company Overview
6.1.2 Financial Analysis
6.1.3 Segmental and Regional Analysis
6.1.4 Research & Development Expenses
6.1.5 Recent strategies and developments:
6.1.5.1 Acquisition and Mergers:
6.1.5.2 Product Launches and Product Expansions:
6.1.5.3 Geographical Expansions:
6.1.6 SWOT Analysis
6.2 Broadcom, Inc.
6.2.1 Company Overview
6.2.2 Financial Analysis
6.2.3 Segmental and Regional Analysis
6.2.4 Research & Development Expense
6.2.5 SWOT Analysis
6.3 Infineon Technologies AG
6.3.1 Company Overview
6.3.2 Financial Analysis
6.3.3 Segmental and Regional Analysis
6.3.4 Research & Development Expense
6.3.5 SWOT Analysis
6.4 NXP Semiconductors N.V.
6.4.1 Company Overview
6.4.2 Financial Analysis
6.4.3 Regional Analysis
6.4.4 Research & Development Expense
6.4.5 SWOT Analysis
6.5 Renesas Electronics Corporation
6.5.1 Company Overview
6.5.2 Financial Analysis
6.5.3 Segmental and Regional Analysis
6.5.4 Research & Development Expense
6.5.5 Recent strategies and developments:
6.5.5.1 Acquisition and Mergers:
6.6 STMicroelectronics N.V.
6.6.1 Company Overview
6.6.2 Financial Analysis
6.6.3 Segmental and Regional Analysis
6.6.4 Research & Development Expense
6.6.5 Recent strategies and developments:
6.6.5.1 Partnerships, Collaborations, and Agreements:
6.6.6 SWOT Analysis
6.7 Texas Instruments, Inc.
6.7.1 Company Overview
6.7.2 Financial Analysis
6.7.3 Segmental and Regional Analysis
6.7.4 Research & Development Expense
6.7.5 Recent strategies and developments:
6.7.5.1 Partnerships, Collaborations, and Agreements:
6.7.6 SWOT Analysis
6.8 Intel Corporation
6.8.1 Company Overview
6.8.2 Financial Analysis
6.8.3 Segmental and Regional Analysis
6.8.4 Research & Development Expenses
6.8.5 SWOT Analysis
6.9 Telephonics Corporation (Griffon Corporation)
6.9.1 Company Overview
6.9.2 Financial Analysis
6.9.3 Segmental and Regional Analysis
6.10. Ensilica Limited
6.10.1 Company Overview

Companies Mentioned

  • Broadcom, Inc.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Renesas Electronics Corporation
  • STMicroelectronics N.V.
  • Texas Instruments, Inc.
  • Intel Corporation
  • Telephonics Corporation (Griffon Corporation)
  • Ensilica Limited

Methodology

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