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Global and China Automotive Intelligent Cockpit Platform Research Report, 2021

  • ID: 5354401
  • Report
  • May 2021
  • Region: Global, China
  • 330 pages
  • Research In China

FEATURED COMPANIES

  • Aptiv
  • BlackBerry
  • Continental
  • FAW Hongqi
  • Huawei
  • Neusoft Group
  • MORE
Next-Generation Intelligent Cockpit Platform: Deep Domain Integration, Pluggable Hardware, Reusable Software

As new-generation E/E architectures evolve, deep integration of cockpit domain may become a trend.

The development of automotive E/E architectures comes with the integration of ADAS functions and V2X systems into the cockpit domain that already combines conventional cockpit electronics.

Through the lens of function integration, the cockpit domain tends to be integrated. As well as basic capabilities including dashboard and center console, rear seat entertainment, HUD and voice, quite a few suppliers currently integrate also surround view camera, DMS, IMS and some ADAS functions into their intelligent cockpit platforms.

In Harman’s case, its cockpit platform already integrates L0 ADAS functions from AR navigation and 360° surround view to DMS/OMS and E-mirror. In future, Harman will combine intelligent cockpit domain controller and ADAS domain controller to support L1~L2+/L3 capabilities, giving OEMs scope for lowering their costs and simplifying systems.

In 2021, ThunderSoft also introduced TurboX Auto 4.5, its new-generation intelligent cockpit platform that allows the cockpit to integrate DMS and automated parking solution and interact with ADAS scenarios. Its intelligent cockpit that can start the built-in computing platform in the parking process optimizes low speed driving with stronger computing force or assists the driver in parking, providing better driving experience.

Cockpit SoC trends: stronger CPU and AI computing force, more displays and sensor interfaces, modular and renewable

1. With a tendency towards intelligent cockpit multi-sensor fusion, multi-mode interaction and multi-scene mode, cockpit SoC as the processing center needs breakthrough upgrades. The next-generation cockpit SoC will head in the following directions:

2. Increasingly strong CPU computing force: for example, Qualcomm Snapdragon SA8155P chip and SA8195P CPU boast computing force of 85KDMIPS and 150KDMIPS, respectively; SemiDrive’s latest X9U cockpit chip features CPU computing force of up to 100KDMIPS.

3. Needs for ever stronger AI computing force that allows the driver to interact with voice, graphics and even vehicle functions. In current stage, some mass-produced cockpit SoCs are embedded into AI accelerated computing platforms, affording computing force of 1~5TOPS. Examples include Nvidia Parker for Mercedes-Benz's first-generation MBUX, with AI computing force of 1TOPS, and Samsung’s mass-produced Exynos Auto V910 with AI computing force of approximately 1.9TOPS and its Exynos Auto V920 cockpit chip to be spawned around 2025 with NPU computing force of 30TOPs.

4. Access to more vehicle displays and sensors. For example, Qualcomm 8155/8195 supports up to 8 sensor outputs and 5-way displays; Samsung V910 supports 6-way displays; X9U, SemiDrive’s latest intelligent cockpit chip unveiled at Auto Shanghai 2021 supports 10 HD displays.

5. More advanced chip process. At present, 7nm and 8nm cockpit chips such as Qualcomm 8155/8195 and Samsung V910 have been mass-produced. Qualcomm’s new fourth-generation Snapdragon automotive cockpit chip adopts 5nm process and is projected to be produced in quantities in 2022.

6. Faster chip iteration, shorter release cycle. New cockpit chips are released every 1 or 2 years compared with previous 3 or 5 years, showing faster iteration.

7. Cockpit SoC also tends to be modular, replaceable and scalable. In April 2021, Huawei released 9610, an IVI module with built-in Kirin 990A automotive chip. The chip module featuring pluggable design can be upgraded by way of replacing central processing unit every three years, and each generation with the same interfaces allows direct replacement, covering the full life cycle of vehicles.

Neusoft Vehicle Computing Platform (VCP) also allows flexible, free configurations with hardware plug and unplug. The separation of the computing unit from the functional unit successfully decouples the software and hardware development process, making it a reality features and advantages like upgradable hardware, sharable computing force and scalable software, to build more flexible business models for automakers.

Cockpit software platform: a standard, scalable, open integrated basic software platform

Quite a few technology firms including Continental EB, ThunderSoft, Neusoft Reach, Huawei, ArcherMind Technology and Banma Information Technology have made deployments in intelligent cockpit software platform.

At present, decoupling and separating the intelligent vehicle cockpit software and hardware has been a common belief. Based on service oriented architecture (SOA), the decoupling and reuse of vehicle software and hardware at the underling layer enable rapid iteration of software functions, and the interaction with users over the air (OTA) helps to deliver personalized and differentiated cockpit product experience.

TurboX Auto 4.5, ThunderSoft’s SOA-based intelligent cockpit platform, enables decoupling of scenarios and services, and rapid development and iteration of scenario services.

Besides needed rapid iteration of cockpit software, reusability, scalability and enough flexibility should also be taken into account in SOA design so that the needs for a mass of inputs can be satisfied with minimal software change.

Neusoft already builds its general standard software architecture and software platform that can fast adapt to different mainstream SoC hardware platforms, and help to realize mass production of high-, mid- and low-end multi-platform intelligent cockpits shortly to meet the needs of different OEMs.

In Jul. 2020, Foryou introduced ADAYO Automotive Open Platform (AAOP) which decouples the telematics software ecosystem at the upper layer and the hardware ecosystem at the underlying layer. AAOP focuses on the intelligent cockpit platform. Based on the standard, modular, layered and categorized software framework of AAOP, Huizhou Foryou General Electronics’ software development model can be transformed from project-based embedded software delivery to layered, categorized software development, which accelerates research and development, reduce R&D preparations and improve R&D efficiency.

Automotive market business models are undergoing disruption. Under the new cooperation model, components suppliers and OEMs partner more closely, and their joint development of cockpit software platforms will become a trend. Tier1s have even been a part of automakers’ engineering design, even partaking in their product design. Platform-based open cooperation on both hardware and software holds a trend. Tier1s are becoming so-called Tier0.5s, while Tier2s work towards Tier1s.
Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Aptiv
  • BlackBerry
  • Continental
  • FAW Hongqi
  • Huawei
  • Neusoft Group
  • MORE
1 Overview of Intelligent Cockpit Platform Development
1.1 Definition of Automotive Intelligent Cockpit Platform
1.2 New Functions (e.g., Multi-display Integration) Boost Intelligent Cockpit Platforms
1.3 Development of Intelligent Cockpit Follows the Trend of EE Architecture
1.4 Development Trends of Intelligent Cockpit Underlying Architecture (1)
1.5 Development Trends of Intelligent Cockpit Underlying Architecture (2)
1.6 Some ADAS Functions are Integrated into Intelligent Cockpits
1.7 Development Trends of Automotive Cockpits
1.8 Software and Hardware System Architecture of Intelligent Cockpit Platform
1.9 A Clear Trend for Separation between Cockpit Software and Hardware
1.10 SOC Trends
1.11 Multi-SOC Cockpit Architecture
1.12 Trends of Cross-border Industry Chain Integration
1.13 Shifts in Business Models
1.14 Comparison of Major Foreign Cockpit Platform Solutions
1.15 Comparison of Major Chinese Cockpit Platform Solutions

2 Intelligent Cockpit Hardware Platform
2.1 Status Quo and Trends of Intelligent Cockpit Hardware Platform
2.1.1 Multi-ECU Integration in Traditional Cockpit
2.1.2 Design Examples of Cockpit Domain Controller
2.1.3 Cockpit Hardware Platform
2.1.4 Development Trends and Industrial Impacts of Cockpit Domain Controller
2.1.5 Solutions of Typical Cockpit Domain Controller Vendors and Their Customers
2.2 Major Intelligent Cockpit Hardware Platform Providers
2.2.1 Visteon Cockpit Domain Controller
2.2.2 Harman Intelligent Cockpit Hardware Platform
2.2.3 Panasonic SPYDR
2.2.4 Intel Cockpit Platform
2.2.5 Magneti Marelli Intelligent Cockpit Domain Controller
2.2.6 Aptiv Integrated Cockpit Controller
2.2.7 Huawei HarmonyOS Intelligent Cockpit IVI Module
2.2.8 Intelligent Cockpit Domain Products of NOBO Automotive System
2.2.9 iNest 2.0 Intelligent Cockpit of NOBO Automotive System
2.2.10 HASCO Intelligent Cockpit Domain Controller
2.2.11 The 1st-Generation “Enjoy Smart Future” Intelligent Cockpit of Jiangsu Changshu Automotive Trim Group
2.2.12 Faurecia Smart Cockpit
2.2.13 Horizon Halo In-vehicle Intelligent Interaction Solution of Horizon Robotics
2.2.14 Samsung Digital Cockpit 2021
2.3 Intelligent Cockpit Processor
2.3.1 Competitive Landscape of Cockpit Processor Vendors
2.3.2 Cockpit Processor Development Plans of Major Companies
2.3.3 Comparison of Main Cockpit Processors (1)
2.3.4 Comparison of Main Cockpit Processors (2)
2.3.5 Comparison of Main Cockpit Processors (3)
2.3.6 Development Trends of Cockpit Processor
2.4 Major Cockpit Processor Vendors and Their Products
2.4.1 Renesas R-CAR Series for Cockpit Processors
2.4.2 Intel A3900 Processor
2.4.3 Development History of Qualcomm Cockpit Processor
2.4.3.1 Qualcomm Snapdragon 3rd-generation Cockpit Platform
2.4.3.2 Qualcomm Snapdragon 4th-generation Cockpit Platform
2.4.4 NVIDIA Deep Learning Processor
2.4.5 NXP Cockpit Processor
2.4.6 TI Cockpit Chip
2.4.7 Samsung Cockpit Processor
2.4.8 Telechips Cockpit Processor
2.4.9 MediaTek Cockpit Chip
2.4.10 Horizon Robotics Automotive Cockpit Chip
2.4.11 Huawei HiSilicon Cockpit Chips: Kirin 710A
2.4.11 Huawei HiSilicon Cockpit Chips: Kirin 990A
2.4.12 Allwinner Cockpit Processor
2.4.13 SemiDrive Cockpit Chip: X9
2.4.13.1 SemiDrive X9H/X9P Intelligent Cockpit Solution
2.4.13.2 Four New Automotive Processor Chips of SemiDrive
2.4.14 UNISOC Intelligent Cockpit Chip
2.4.15 SiEngine Intelligent Cockpit Chip

3 Intelligent Cockpit Software Platform
3.1 Composition and Trends of Intelligent Cockpit Software Platform
3.1.1 What is Intelligent Cockpit Software Platform
3.1.2 Future Cockpit Needs a New Cockpit Software Architecture
3.1.3 Summary of Main Cockpit Software Solutions
3.1.4 ThunderSoft SOA-based Intelligent Cockpit Software Solution
3.1.5 Huawei HarmonyOS Cockpit Software Platform
3.1.6 Neusoft Reach SDV-oriented Solution
3.1.7 Banma Zhixing Intelligent Cockpit
3.1.8 Continental EB Integrated Software Platform
3.1.9 UAES AP Autosar-based Open Software Platform
3.1.10 SAIC SOA-based Software Platform
3.2 Major Vehicle Operating Systems and Providers
3.2.1 Status Quo of Automotive Operating Systems
3.2.2 Android Leads in IVI Operating System Market
3.2.3 In-vehicle Underlying Operating System Market Shares
3.2.4 Secondary Development on Underlying Operating System
3.2.5 BlackBerry QNX
3.2.5.1 Introduction to BlackBerry
3.2.5.2 QNX Cockpit Software Platform Solution
3.2.5.3 BlackBerry's Recent Collaborations in Automotive
3.2.6 Linux & AGL
3.2.7 Android & Android Auto
3.2.8 AliOS
3.2.9 Volkswagen VW.OS
3.2.10 Huawei HarmonyOS
3.2.11 Huawei HarmonyOS Cockpit Operating System (HOS)

4 Intelligent Cockpit Platform Layout of Major OEMs
4.1 Summary of Cockpit Platform Layout of OEMs
4.1.1 New-generation E/E Architectures and Cockpit Layout of Foreign Traditional OEMs
4.1.2 Cockpit Layout of Traditional Chinese OEMs
4.1.3 Cockpit Platforms of Start-up Automakers
4.1.4 Cockpit Platforms of Emerging Automakers
4.1.5 Chip Layout of OEMs
4.1.6 Software Layout of OEMs
4.1.7 Mass Production of Intelligent Cockpit Platforms of Major Global OEMs (1)
4.1.8 Mass Production of Intelligent Cockpit Platforms of Major Global OEMs (2)
4.2 Tesla
4.2.1 Tesla
4.2.2 Tesla MCU
4.2.3 2021 Tesla Model S/X
4.3 BMW
4.3.1 Intelligent Cockpit Domain Layout
4.3.2 Intelligent Cockpit Domain Architecture Layout
4.3.3 Cockpit Software Layout
4.4 Volkswagen
4.4.1 Unified Automotive Electronic Architecture
4.4.2 ICAS Cockpit Domain System
4.4.3 Self-developed VW.OS
4.4.4 Digital Cockpit
4.5 Audi
4.5.1 Intelligent Cockpit Layout
4.5.2 Software and Hardware Layout
4.5.3 Cockpits of Main Audi Models
4.5.4 Virtual Cockpit
4.5.5 IVI system
4.6 Mercedes-Benz
4.6.1 Evolution of MBUX System
4.6.2 MBUX system
4.6.3 MB.OS
4.6.4 Dynamics in Cockpit
4.7 FAW Hongqi
4.7.1 Intelligent Cockpit Core Business Layout
4.7.2 Intelligent Cockpit Platform
4.7.3 HC3.0
4.7.4 Intelligent Cockpit Cases
4.7.5 i.RFlag
4.7.6 Future Intelligent Cockpit Layout
4.7.7 Partners and Recent Dynamics
4.8 Changan Automobile
4.8.1 Intelligent Cockpit Layout
4.8.2 UNI-K Equipped with IMS Intelligent Cockpit Interaction System
4.8.3 UNI-T Intelligent Cockpit Platform
4.8.4 Intelligent Cockpit Plan during the 14th Five-Year Plan Period
4.9 BYD
4.9.1 New EE architecture
4.9.2 Integrated Body Controller
4.9.3 Intelligent Cockpit Platform
4.10 Great Wall Motor
4.10.1 Intelligent Cockpit Layout
4.10.2 “Coffee Intelligence”
4.10.3 Composition of Haval New-generation Intelligent Connection System
4.10.4 Intelligent Cockpit Layout Plan of NOBO Automotive Systems
4.10.5 Intelligent Cockpit Domain Layout Plan of NOBO Automotive Systems
4.10.6 WEY Mocha
4.10.7 Partners and Recent Dynamics
4.11 SAIC
4.11.1 Intelligent Cockpit Development Plan
4.11.2 R Auto R-TECH
4.11.3 Galaxy Intelligent Vehicle Full Stack Solution
4.11.4 Marvel R
4.11.5 Intelligent Cockpit of IM Motors
4.11.6 SAIC-GM Virtual Cockpit System (VCS)
4.11.7 SAIC-GM Buick Cockpit Introduces Hypervisor Architecture
4.12 GAC
4.12.1 Intelligent Cockpit Layout
4.12.2 ADiGO 4.0 (Intelligent and Interconnected Driving)
4.12.3 SuperSense Interactive Intelligent Cockpit
4.13 Geely
4.13.1 Automotive Intelligent Cockpit
4.13.2 ZEEKER OS Intelligent Cockpit
4.13.3 Intelligent Digital Cockpit
4.14 Chery
4.14.1 Intelligent Cockpit Solutions (1)
4.14.2 Intelligent Cockpit Solutions (2)
4.14.3 Chery Lion Cloud System Planning
4.15 BAIC
4.15.1 Intelligent Cockpit Layout
4.15.2 Huawei HI Cockpit for BAIC ARCFOX αS
4.16 Weltmeister
4.16.1 WMConnect Intelligent Digital Cockpit
4.16.2 IdeaL4
4.17 Neta Auto
4.17.1 PIOVT Intelligent Cockpit System
4.17.2 Intelligent Cockpit Domain Controller
4.17.3 Automotive Product Planning
4.18 ENOVATE
4.18.1 5+X Intelligent Cockpit
4.18.2 Digital Architecture
4.19 Human Horizons
4.19.1 HiPhi X Intelligent Cockpit
4.19.2 Human Oriented Architecture (HOA)
4.19.3 Developer Platform Ecosystem
4.19.4 New-generation Intelligent Vehicle Operating System
4.20 Other OEMs
4.20.1 NIO ET7 Intelligent Cockpit
4.20.2 Xiaopeng Motors’ 3rd-generation Intelligent Cockpit
4.20.3 Xpeng P7 Intelligent Music Cockpit
4.20.4 Dongfeng Voyah FREE Intelligent Cockpit
4.20.5 Evergrande Auto Released Intelligent Cockpit

5 Global Intelligent Cockpit System Integrators
5.1 Harman
5.1.1 Profile
5.1.2 Intelligent Cockpit Platform
5.1.3 Intelligent Cockpit Solutions
5.1.4 ExP Solution
5.1.5 Intelligent Cockpit Pre-integrated with ADAS Functions
5.1.6 Development Plan for Intelligent Cockpit and ADAS Integration
5.1.7 Recent Dynamics
5.2 Visteon
5.2.1 Profile
5.2.2 Product Lines
5.2.3 Future Cockpit
5.2.4 SmartCore
5.2.5 Develop Intelligent Cockpit Solutions Together with Others
5.2.6 Dynamics
5.3 Faurecia
5.3.1 Profile
5.3.2 Clarion Automotive Electronics Product Lines
5.3.3 Faurecia Automotive Cockpit Electronics Market Size, 2025
5.3.4 Full-stack Cockpit Solution
5.3.5 Cockpit Intelligence Platform (CIP)
5.3.6 Cockpit Domain Controller (CDC)
5.3.7 Planning Goals of Cockpit Domain Controller
5.3.8 Intelligent Cockpit Layout and Cooperation
5.4 Aptiv
5.4.1 Profile
5.4.2 Smart Vehicle Architecture (SVA)
5.4.3 Domain Controller
5.4.4 Infotainment System
5.5 Bosch
5.5.1 Profile
5.5.2 Cockpit Domain Controller Products
5.5.3 Progress of Cockpit Domain Controller Projects
5.5.4 Development Route of Central Computing Platform
5.5.5 On-board Computing Platform
5.5.6 Fusion Control Product System Architecture
5.5.7 Fusion Control Product System Architecture Route
5.5.8 OSS Software Architecture of Multimedia Cockpit
5.5.9 Multimedia Domain Architecture
5.6 Continental
5.6.1 Profile
5.6.2 HPC
5.6.3 Cockpit HPC
5.6.4 Architecture Featuring Separated Software and Hardware
5.7 Denso
5.7.1 Profile
5.7.2 Cockpit Development Plan
5.7.3 Cockpit Integrated Control System
5.7.4 Cockpit Integrated Control System Based on Virtualization Technology
5.7.5 Harmony Core
5.7.6 Recent Dynamics
5.8 Panasonic
5.8.1 Automotive Business
5.8.2 Cockpit Electronics Layout
5.8.3 New-generation Connected Electronic Cockpit Solutions
5.8.4 Computing Architecture of Cockpit Electronics
5.8.5 Physical Architecture Examples of Cockpit Electronics
5.8.6 Integrated Center Console Display

6 Chinese Intelligent Cockpit System Integrators
6.1 Desay SV
6.1.1 Profile
6.1.2 Revenue
6.1.3 Progress of New Products
6.1.4 Intelligent Cockpit Technology Upgrade Route
6.1.5 Layout History of Intelligent Cockpit
6.1.6 Intelligent Cockpit 3.0
6.1.7 Intelligent Cockpit Domain Controller
6.1.8 Dynamics in Intelligent Cockpit Layout
6.2 Neusoft Group
6.2.1 Profile
6.2.2 Automotive Electronics Layout
6.2.3 Intelligent Cockpit System
6.2.4 C4 Pro Intelligent Cockpit System
6.2.5 Next-generation Intelligent Cockpit Platform
6.2.6 Intelligent Cockpit Software Platform
6.2.7 Profile of Neusoft Reach
6.2.8 Basic Software Platform of Neusoft Reach
6.2.9 Dynamics in Intelligent Cockpit
6.3 Hangsheng Electronics
6.3.1 Profile
6.3.2 Intelligent Cockpit Layout
6.4 CooKoo
6.5 Huawei
6.5.1 Intelligent Vehicle Solution
6.5.2 Intelligent Cockpit Solution
6.5.3 Intelligent Cockpit Operating System (HOS)
6.5.4 HarmonyOS Intelligent Cockpit Ecosystem
6.5.5 Intelligent Cockpit Development Platform (CDP)
6.5.6 Intelligent Commercial Vehicle Cockpit Design
6.5.7 CDC Intelligent Cockpit Platform
6.5.8 Automotive CC Architecture
6.5.9 5G Intelligent Cockpit
6.5.10 Dynamics in Cooperation
6.6 ThunderSoft
6.6.1 Profile
6.6.2 Revenue
6.6.3 Intelligent Connected Vehicle Layout
6.6.4 Intelligent Cockpit Solution
6.6.5 Intelligent Cockpit TurboX Auto 4.5
6.6.6 Cockpit Domain Integrated Scenario
6.6.7 TurboX Auto 4.0
6.6.8 Business Model and Recent Dynamics
6.7 AUTOAI
6.7.1 Profile
6.7.2 Virtualized Intelligent Cockpit Solution
6.7.3 Non-virtualized Intelligent Cockpit Solution
6.7.4 Athena OS 2.0
6.8 ArcherMind Technology
6.8.1 Profile
6.8.2 Revenue
6.8.3 ArcherMind EX4.0
6.8.4 ArcherMind EX5.0
6.8.5 Main Dynamics
6.9 BICV
6.9.1 Profile
6.9.2 Intelligent Cockpit Domain Controller
6.10 Joyson Electronics
6.10.1 Intelligent Cockpit Solution
6.10.2 Innovative Intelligent Cockpit System
6.10.3 Integrated Intelligent Cockpit System
6.10.4 One-machine Dual-system Cockpit Solution
6.11 Huizhou Foryou General Electronics
6.11.1 ADAYO Automotive Electronics Business
6.11.2 Foryou Released Cockpit Domain Controller and New-generation Intelligent Cockpit Solution
6.11.3 ADAYO Intelligent Cockpit Solution
6.11.4 Open Platform
6.11.5 Intelligent Cockpit Development Plan
6.11.6 Recent Dynamics
6.12 Other Intelligent Cockpit Solution Providers
Note: Product cover images may vary from those shown
  • BlackBerry
  • Volkswagen
  • Huawei
  • Tesla
  • BMW
  • Volkswagen
  • Audi
  • Mercedes-Benz
  • FAW Hongqi
  • Changan Automobile
  • BYD
  • Great Wall Motor
  • SAIC
  • GAC
  • Geely
  • Chery
  • BAIC
  • Weltmeister
  • Neta Auto
  • ENOVATE
  • Human Horizons
  • Harman
  • Visteon
  • Faurecia
  • Aptiv
  • Bosch
  • Continental
  • Denso
  • Panasonic
  • Desay SV
  • Neusoft Group
  • Hangsheng Electronics
  • CooKoo
  • Huawei
  • ThunderSoft
  • AUTOAI
  • ArcherMind Technology
  • BICV
  • Joyson Electronics
  • Huizhou Foryou General Electronics
Note: Product cover images may vary from those shown

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