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Advanced IC Packaging Market Research Report by Application, by State - United States Forecast to 2026 - Cumulative Impact of COVID-19

  • ID: 5437798
  • Report
  • September 2021
  • Region: United States
  • 67 pages
  • 360iResearch™
UP TO OFF
until Dec 31st 2021
The United States Advanced IC Packaging Market Will Grow to USD 0.08 Million by 2026, at a CAGR of 0.06%

FEATURED COMPANIES

  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • Intel Corporation
  • Microchip Technology Inc.
  • Palomar Technologies
  • Texas Instruments
The United States Advanced IC Packaging Market size was estimated at USD 0.08 Million in 2020 and expected to reach USD 0.07 Million in 2021, at a Compound Annual Growth Rate (CAGR) 0.06% to reach USD 0.08 Million by 2026.



Market Statistics:


The report provides market sizing and forecast across five major currencies - USD, EUR GBP, JPY, and AUD. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2019 are considered historical years, 2020 as the base year, 2021 as the estimated year, and years from 2022 to 2026 are considered the forecast period.

Market Segmentation & Coverage:


This research report categorizes the Advanced IC Packaging to forecast the revenues and analyze the trends in each of the following sub-markets:
  • Based on Application, the Advanced IC Packaging Market was studied across Aerospace and Defense, Automotive and Transportation, IT and Telecom, and Mobile and Consumer.
  • Based on Type, the Advanced IC Packaging Market was studied across 2.5D Integrated Circuit, 2D Integrated Circuit, 3D Integrated Circuit, Fan Out Silicon In Package, Fan Out Wafer Level Package, Flip Chip, and Wafer Level Chip Scale Package.
  • Based on State, the Advanced IC Packaging Market was studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas.

Cumulative Impact of COVID-19:


COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.

Competitive Strategic Window:


The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.

FPNV Positioning Matrix:


The FPNV Positioning Matrix evaluates and categorizes the vendors in the Advanced IC Packaging Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.

Market Share Analysis:


The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.

Company Usability Profiles:


The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the United States Advanced IC Packaging Market, including Amkor Technology, Inc., Analog Devices, Inc., FlipChip International, LLC, Intel Corporation, International Business Machines Corporation, Microchip Technology Inc., Palomar Technologies, Qualcomm Technologies, Inc., Texas Instruments, and Veeco Instruments Inc..

The report provides insights on the following pointers:


1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments

The report answers questions such as:


1. What is the market size and forecast of the United States Advanced IC Packaging Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the United States Advanced IC Packaging Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the United States Advanced IC Packaging Market?
4. What is the competitive strategic window for opportunities in the United States Advanced IC Packaging Market?
5. What are the technology trends and regulatory frameworks in the United States Advanced IC Packaging Market?
6. What is the market share of the leading vendors in the United States Advanced IC Packaging Market?
7. What modes and strategic moves are considered suitable for entering the United States Advanced IC Packaging Market?
Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • Intel Corporation
  • Microchip Technology Inc.
  • Palomar Technologies
  • Texas Instruments
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders

2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary
3.1. Introduction
3.2. Market Outlook
3.3. Application Outlook
3.4. Type Outlook
3.5. State Outlook
3.6. Competitor Outlook

4. Market Overview
4.1. Introduction
4.2. Cumulative Impact of COVID-19

5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Proliferating semiconductor industry in the U.S. resulting in growing adoption of IC packages such as 3D
5.1.1.2. Surge in the demand for consumer electronics and mobile communications in the U.S
5.1.2. Restraints
5.1.2.1. Thermal-associated concerns due to higher level of integration
5.1.3. Opportunities
5.1.3.1. Emerging improvements in packaging density and development of cutting-edge technology
5.1.3.2. Increasing miniaturization of electronic products
5.1.4. Challenges
5.1.4.1. High unit cost of advanced IC packaging such as 2.5D IC and 3D IC packages

6. Advanced IC Packaging Market, by Application
6.1. Introduction
6.2. Aerospace and Defense
6.3. Automotive and Transportation
6.4. IT and Telecom
6.5. Mobile and Consumer

7. Advanced IC Packaging Market, by Type
7.1. Introduction
7.2. 2.5D Integrated Circuit
7.3. 2D Integrated Circuit
7.4. 3D Integrated Circuit
7.5. Fan Out Silicon In Package
7.6. Fan Out Wafer Level Package
7.7. Flip Chip
7.8. Wafer Level Chip Scale Package

8. California Advanced IC Packaging Market
8.1. Introduction

9. Florida Advanced IC Packaging Market
9.1. Introduction

10. Illinois Advanced IC Packaging Market
10.1. Introduction

11. New York Advanced IC Packaging Market
11.1. Introduction

12. Ohio Advanced IC Packaging Market
12.1. Introduction

13. Pennsylvania Advanced IC Packaging Market
13.1. Introduction

14. Texas Advanced IC Packaging Market
14.1. Introduction

15. Competitive Landscape
15.1. FPNV Positioning Matrix
15.1.1. Quadrants
15.1.2. Business Strategy
15.1.3. Product Satisfaction
15.2. Market Ranking Analysis
15.3. Market Share Analysis, By Key Player
15.4. Competitive Scenario
15.4.1. Merger & Acquisition
15.4.2. Agreement, Collaboration, & Partnership
15.4.3. New Product Launch & Enhancement
15.4.4. Investment & Funding
15.4.5. Award, Recognition, & Expansion

16. Company Usability Profiles
16.1. Amkor Technology, Inc.
16.2. Analog Devices, Inc.
16.3. FlipChip International, LLC
16.4. Intel Corporation
16.5. International Business Machines Corporation
16.6. Microchip Technology Inc.
16.7. Palomar Technologies
16.8. Qualcomm Technologies, Inc.
16.9. Texas Instruments
16.10. Veeco Instruments Inc.

17. Appendix
17.1. Discussion Guide
17.2. License & Pricing

List of Figures
FIGURE 1. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, 2020 VS 2026 (USD MILLION)
FIGURE 2. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2020 (USD MILLION)
FIGURE 3. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2020 (USD MILLION)
FIGURE 4. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2020 VS 2026 (USD MILLION)
FIGURE 5. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, 2018-2026 (USD MILLION)
FIGURE 6. UNITED STATES ADVANCED IC PACKAGING MARKET: MARKET DYNAMICS
FIGURE 7. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2020 VS 2026 (%)
FIGURE 8. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2020 VS 2026 (USD MILLION)
FIGURE 9. COMPETITIVE STRATEGIC WINDOW FOR UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2026
FIGURE 10. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY AEROSPACE AND DEFENSE, 2018-2026 (USD MILLION)
FIGURE 11. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY AEROSPACE AND DEFENSE, BY STATE, 2020 VS 2026 (USD MILLION)
FIGURE 12. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE AND TRANSPORTATION, 2018-2026 (USD MILLION)
FIGURE 13. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE AND TRANSPORTATION, BY STATE, 2020 VS 2026 (USD MILLION)
FIGURE 14. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY IT AND TELECOM, 2018-2026 (USD MILLION)
FIGURE 15. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY IT AND TELECOM, BY STATE, 2020 VS 2026 (USD MILLION)
FIGURE 16. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE AND CONSUMER, 2018-2026 (USD MILLION)
FIGURE 17. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE AND CONSUMER, BY STATE, 2020 VS 2026 (USD MILLION)
FIGURE 18. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2020 VS 2026 (%)
FIGURE 19. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2020 VS 2026 (USD MILLION)
FIGURE 20. COMPETITIVE STRATEGIC WINDOW FOR UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2026
FIGURE 21. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY 2.5D INTEGRATED CIRCUIT, 2018-2026 (USD MILLION)
FIGURE 22. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY 2.5D INTEGRATED CIRCUIT, BY STATE, 2020 VS 2026 (USD MILLION)
FIGURE 23. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY 2D INTEGRATED CIRCUIT, 2018-2026 (USD MILLION)
FIGURE 24. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY 2D INTEGRATED CIRCUIT, BY STATE, 2020 VS 2026 (USD MILLION)
FIGURE 25. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY 3D INTEGRATED CIRCUIT, 2018-2026 (USD MILLION)
FIGURE 26. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY 3D INTEGRATED CIRCUIT, BY STATE, 2020 VS 2026 (USD MILLION)
FIGURE 27. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT SILICON IN PACKAGE, 2018-2026 (USD MILLION)
FIGURE 28. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT SILICON IN PACKAGE, BY STATE, 2020 VS 2026 (USD MILLION)
FIGURE 29. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT WAFER LEVEL PACKAGE, 2018-2026 (USD MILLION)
FIGURE 30. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT WAFER LEVEL PACKAGE, BY STATE, 2020 VS 2026 (USD MILLION)
FIGURE 31. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY FLIP CHIP, 2018-2026 (USD MILLION)
FIGURE 32. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY FLIP CHIP, BY STATE, 2020 VS 2026 (USD MILLION)
FIGURE 33. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL CHIP SCALE PACKAGE, 2018-2026 (USD MILLION)
FIGURE 34. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL CHIP SCALE PACKAGE, BY STATE, 2020 VS 2026 (USD MILLION)
FIGURE 35. CALIFORNIA ADVANCED IC PACKAGING MARKET SIZE, 2018-2026 (USD MILLION)
FIGURE 36. FLORIDA ADVANCED IC PACKAGING MARKET SIZE, 2018-2026 (USD MILLION)
FIGURE 37. ILLINOIS ADVANCED IC PACKAGING MARKET SIZE, 2018-2026 (USD MILLION)
FIGURE 38. NEW YORK ADVANCED IC PACKAGING MARKET SIZE, 2018-2026 (USD MILLION)
FIGURE 39. OHIO ADVANCED IC PACKAGING MARKET SIZE, 2018-2026 (USD MILLION)
FIGURE 40. PENNSYLVANIA ADVANCED IC PACKAGING MARKET SIZE, 2018-2026 (USD MILLION)
FIGURE 41. TEXAS ADVANCED IC PACKAGING MARKET SIZE, 2018-2026 (USD MILLION)
FIGURE 42. UNITED STATES ADVANCED IC PACKAGING MARKET: FPNV POSITIONING MATRIX
FIGURE 43. UNITED STATES ADVANCED IC PACKAGING MARKET: SHARE, BY KEY PLAYER, 2020
FIGURE 44. COMPETITIVE SCENARIO ANALYSIS IN UNITED STATES ADVANCED IC PACKAGING MARKET, BY TYPE

List of Tables
TABLE 1. UNITED STATES ADVANCED IC PACKAGING MARKET: MARKET SEGMENTATION & COVERAGE
TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2016–2020
TABLE 3. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, 2018-2026 (USD MILLION)
TABLE 4. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2026 (USD MILLION)
TABLE 5. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY AEROSPACE AND DEFENSE, BY STATE, 2018-2026 (USD MILLION)
TABLE 6. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE AND TRANSPORTATION, BY STATE, 2018-2026 (USD MILLION)
TABLE 7. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY IT AND TELECOM, BY STATE, 2018-2026 (USD MILLION)
TABLE 8. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE AND CONSUMER, BY STATE, 2018-2026 (USD MILLION)
TABLE 9. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2026 (USD MILLION)
TABLE 10. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY 2.5D INTEGRATED CIRCUIT, BY STATE, 2018-2026 (USD MILLION)
TABLE 11. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY 2D INTEGRATED CIRCUIT, BY STATE, 2018-2026 (USD MILLION)
TABLE 12. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY 3D INTEGRATED CIRCUIT, BY STATE, 2018-2026 (USD MILLION)
TABLE 13. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT SILICON IN PACKAGE, BY STATE, 2018-2026 (USD MILLION)
TABLE 14. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT WAFER LEVEL PACKAGE, BY STATE, 2018-2026 (USD MILLION)
TABLE 15. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY FLIP CHIP, BY STATE, 2018-2026 (USD MILLION)
TABLE 16. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL CHIP SCALE PACKAGE, BY STATE, 2018-2026 (USD MILLION)
TABLE 17. CALIFORNIA ADVANCED IC PACKAGING MARKET SIZE, 2018-2026 (USD MILLION)
TABLE 18. FLORIDA ADVANCED IC PACKAGING MARKET SIZE, 2018-2026 (USD MILLION)
TABLE 19. ILLINOIS ADVANCED IC PACKAGING MARKET SIZE, 2018-2026 (USD MILLION)
TABLE 20. NEW YORK ADVANCED IC PACKAGING MARKET SIZE, 2018-2026 (USD MILLION)
TABLE 21. OHIO ADVANCED IC PACKAGING MARKET SIZE, 2018-2026 (USD MILLION)
TABLE 22. PENNSYLVANIA ADVANCED IC PACKAGING MARKET SIZE, 2018-2026 (USD MILLION)
TABLE 23. TEXAS ADVANCED IC PACKAGING MARKET SIZE, 2018-2026 (USD MILLION)
TABLE 24. UNITED STATES ADVANCED IC PACKAGING MARKET: SCORES
TABLE 25. UNITED STATES ADVANCED IC PACKAGING MARKET: BUSINESS STRATEGY
TABLE 26. UNITED STATES ADVANCED IC PACKAGING MARKET: PRODUCT SATISFACTION
TABLE 27. UNITED STATES ADVANCED IC PACKAGING MARKET: RANKING
TABLE 28. UNITED STATES ADVANCED IC PACKAGING MARKET: SHARE, BY KEY PLAYER, 2020
TABLE 29. UNITED STATES ADVANCED IC PACKAGING MARKET: MERGER & ACQUISITION
TABLE 30. UNITED STATES ADVANCED IC PACKAGING MARKET: AGREEMENT, COLLABORATION, & PARTNERSHIP
TABLE 31. UNITED STATES ADVANCED IC PACKAGING MARKET: NEW PRODUCT LAUNCH & ENHANCEMENT
TABLE 32. UNITED STATES ADVANCED IC PACKAGING MARKET: INVESTMENT & FUNDING
TABLE 33. UNITED STATES ADVANCED IC PACKAGING MARKET: AWARD, RECOGNITION, & EXPANSION
TABLE 34. UNITED STATES ADVANCED IC PACKAGING MARKET: LICENSE & PRICING
Note: Product cover images may vary from those shown
  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • FlipChip International, LLC
  • Intel Corporation
  • International Business Machines Corporation
  • Microchip Technology Inc.
  • Palomar Technologies
  • Qualcomm Technologies, Inc.
  • Texas Instruments
  • Veeco Instruments Inc.
Note: Product cover images may vary from those shown

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