3D IC Market by Type, Component, Application and End User: Global Opportunity Analysis and Industry Forecast, 2021-2030

Table of Contents

CHAPTER 1: INTRODUCTION
1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY
2.1. Key findings
2.1.1. Top impacting factors
2.1.2. Top investment pockets
2.2. CXO perspective

CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key forces shaping the 3D IC technology
3.3. Patent analysis
3.3.1. By region, 2012–2020
3.3.2. By applicant, 2012–2020
3.4. COVID-19 impact analysis
3.4.1. COVID-19 outbreak
3.4.2. Impact on market size
3.4.3. End user trends, preferences, and budget impact
3.4.4. Opportunity window
3.5. Market dynamics
3.5.1. Drivers
3.5.1.1. Growing trend of miniaturization of electronics devices
3.5.1.2. Rising demand for Internet of Things (IoT) technology
3.5.1.3. Technological advancement in 3D packaging technology
3.5.2. Restraint
3.5.2.1. High initial capital investment and high cost of materials
3.5.3. Opportunity
3.5.3.1. High adoption of fan-out wafer level packaging technology

CHAPTER 4: 3D IC MARKET , BY TECHNOLOGY
4.1. Overview
4.2. Stacked 3D (3D SiC)
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country
4.3. Monolithic 3D
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country

CHAPTER 5: 3D IC MARKET, BY COMPONENT
5.1. Overview
5.2. Through Silicon Via (TSV)
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country
5.3. Through Glass Via (TGV)
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country
5.4. Silicon Interposer
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country

CHAPTER 6: 3D IC MARKET, BY APPLICATION
6.1. Overview
6.2. Logic
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis, by country
6.3. Imaging & optoelectronics
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis, by country
6.4. Memory
6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis, by country
6.5. MEMS/Sensors
6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by region
6.5.3. Market analysis, by country
6.6. LED
6.6.1. Key market trends, growth factors, and opportunities
6.6.2. Market size and forecast, by region
6.6.3. Market analysis, by country
6.7. Others
6.7.1. Key market trends, growth factors, and opportunities
6.7.2. Market size and forecast, by region
6.7.3. Market analysis, by country

CHAPTER 7: 3D IC MARKET, BY END-USER
7.1. Overview
7.2. Consumer electronics
7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market analysis, by country
7.3. Telecommunication
7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market analysis, by country
7.4. Automotive
7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast, by region
7.4.3. Market analysis, by country
7.5. Military & Aerospace
7.5.1. Key market trends, growth factors, and opportunities
7.5.2. Market size and forecast, by region
7.5.3. Market analysis, by country
7.6. Medical Device
7.6.1. Key market trends, growth factors, and opportunities
7.6.2. Market size and forecast, by region
7.6.3. Market analysis, by country
7.7. Industrial
7.7.1. Key market trends, growth factors, and opportunities
7.7.2. Market size and forecast, by region
7.7.3. Market analysis, by country
7.8. Others
7.8.1. Key market trends, growth factors, and opportunities
7.8.2. Market size and forecast, by region
7.8.3. Market analysis, by country

CHAPTER 8: 3D IC MARKET, BY REGION
8.1. Overview
8.2. North America
8.2.1. Key market trends, growth factors, and opportunities
8.2.2. Market size and forecast, by type
8.2.3. Market size and forecast, by component
8.2.4. Market size and forecast, by application
8.2.5. Market size and forecast, by end user
8.2.6. Market analysis, by country
8.2.6.1. U. S.
8.2.6.1.1. Market size and forecast, by type
8.2.6.1.2. Market size and forecast, by component
8.2.6.1.3. Market size and forecast, by application
8.2.6.1.4. Market size and forecast, by end user
8.2.6.2. Canada
8.2.6.2.1. Market size and forecast, by type
8.2.6.2.2. Market size and forecast, by component
8.2.6.2.3. Market size and forecast, by application
8.2.6.2.4. Market size and forecast, by end user
8.2.6.3. Mexico
8.2.6.3.1. Market size and forecast, by type
8.2.6.3.2. Market size and forecast, by component
8.2.6.3.3. Market size and forecast, by application
8.2.6.3.4. Market size and forecast, by end user
8.3. Europe
8.3.1. Key market trends, growth factors, and opportunities
8.3.2. Market size and forecast, by type
8.3.3. Market size and forecast, by component
8.3.4. Market size and forecast, by application
8.3.5. Market size and forecast, by end user
8.3.6. Market analysis, by country
8.3.6.1. Germany
8.3.6.1.1. Market size and forecast, by type
8.3.6.1.2. Market size and forecast, by component
8.3.6.1.3. Market size and forecast, by application
8.3.6.1.4. Market size and forecast, by end user
8.3.6.2. UK
8.3.6.2.1. Market size and forecast, by type
8.3.6.2.2. Market size and forecast, by component
8.3.6.2.3. Market size and forecast, by application
8.3.6.2.4. Market size and forecast, by end user
8.3.6.3. France
8.3.6.3.1. Market size and forecast, by type
8.3.6.3.2. Market size and forecast, by component
8.3.6.3.3. Market size and forecast, by application
8.3.6.3.4. Market size and forecast, by end user
8.3.6.4. Italy
8.3.6.4.1. Market size and forecast, by type
8.3.6.4.2. Market size and forecast, by component
8.3.6.4.3. Market size and forecast, by application
8.3.6.4.4. Market size and forecast, by end user
8.3.6.5. Rest of Europe
8.3.6.5.1. Market size and forecast, by type
8.3.6.5.2. Market size and forecast, by component
8.3.6.5.3. Market size and forecast, by application
8.3.6.5.4. Market size and forecast, by end user
8.4. Asia-Pacific
8.4.1. Key market trends, growth factors, and opportunities
8.4.2. Market size and forecast, by type
8.4.3. Market size and forecast, by component
8.4.4. Market size and forecast, by application
8.4.5. Market size and forecast, by end user
8.4.6. Market analysis, by country
8.4.6.1. China
8.4.6.1.1. Market size and forecast, by type
8.4.6.1.2. Market size and forecast, by component
8.4.6.1.3. Market size and forecast, by application
8.4.6.1.4. Market size and forecast, by end user
8.4.6.2. Japan
8.4.6.2.1. Market size and forecast, by type
8.4.6.2.2. Market size and forecast, by component
8.4.6.2.3. Market size and forecast, by application
8.4.6.2.4. Market size and forecast, by end user
8.4.6.3. South Korea
8.4.6.3.1. Market size and forecast, by type
8.4.6.3.2. Market size and forecast, by component
8.4.6.3.3. Market size and forecast, by application
8.4.6.3.4. Market size and forecast, by end user
8.4.6.4. Taiwan
8.4.6.4.1. Market size and forecast, by type
8.4.6.4.2. Market size and forecast, by component
8.4.6.4.3. Market size and forecast, by application
8.4.6.4.4. Market size and forecast, by end user
8.4.6.5. India
8.4.6.5.1. Market size and forecast, by type
8.4.6.5.2. Market size and forecast, by component
8.4.6.5.3. Market size and forecast, by application
8.4.6.5.4. Market size and forecast, by end user
8.4.6.6. Rest of Asia-Pacific
8.4.6.6.1. Market size and forecast, by type
8.4.6.6.2. Market size and forecast, by component
8.4.6.6.3. Market size and forecast, by application
8.4.6.6.4. Market size and forecast, by end user
8.5. LAMEA
8.5.1. Key market trends, growth factors, and opportunities
8.5.2. Market size and forecast, by type
8.5.3. Market size and forecast, by component
8.5.4. Market size and forecast, by application
8.5.5. Market size and forecast, by end user
8.5.6. Market analysis, by country
8.5.6.1. Latin America
8.5.6.1.1. Market size and forecast, by type
8.5.6.1.2. Market size and forecast, by component
8.5.6.1.3. Market size and forecast, by application
8.5.6.1.4. Market size and forecast, by end user
8.5.6.2. Middle East
8.5.6.2.1. Market size and forecast, by type
8.5.6.2.2. Market size and forecast, by component
8.5.6.2.3. Market size and forecast, by application
8.5.6.2.4. Market size and forecast, by end user
8.5.6.3. Africa
8.5.6.3.1. Market size and forecast, by type
8.5.6.3.2. Market size and forecast, by component
8.5.6.3.3. Market size and forecast, by application
8.5.6.3.4. Market size and forecast, by end user

CHAPTER 9: COMPETITIVE LANDSCAPE
9.1. Introduction
9.1.1. Market player positioning, 2020
9.2. Top winning strategies
9.3. Product mapping of top 10 players
9.4. Competitive dashboard
9.5. Competitive heatmap

CHAPTER 10: COMPANY PROFILES
10.1. AMKOR TECHNOLOGY
10.1.1. Company overview
10.1.2. Key executive
10.1.3. Company snapshot
10.1.4. Product portfolio
10.1.5. R&D expenditure
10.1.6. Business performance
10.2. ASE GROUP
10.2.1. Company overview
10.2.2. Key executives
10.2.3. Company snapshot
10.2.4. Operating business segments
10.2.5. Product portfolio
10.2.6. R&D expenditure
10.2.7. Business performance
10.2.8. Key strategic moves and developments
10.3. Micron Technology, Inc.
10.3.1. Company overview
10.3.2. Key executives
10.3.3. Company snapshot
10.3.4. Operating business segments
10.3.5. Product portfolio
10.3.6. R&D expenditure
10.3.7. Business performance
10.3.8. Key strategic moves and developments
10.4. INTEL CORPORATION
10.4.1. Company overview
10.4.2. Key executives
10.4.3. Company snapshot
10.4.4. Operating business segments
10.4.5. Product portfolio
10.4.6. R&D expenditure
10.4.7. Business performance
10.4.8. Key strategic moves and developments
10.5. Samsung Electronics Co. Ltd.
10.5.1. Company overview
10.5.2. Key executives
10.5.3. Company snapshot.
10.5.4. Operating business segments
10.5.5. Product portfolio
10.5.6. R&D expenditure
10.5.7. Business performance
10.5.8. Key strategic moves and developments
10.6. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
10.6.1. Company overview
10.6.2. Key executives
10.6.3. Company snapshot.
10.6.4. Product portfolio
10.6.5. R&D expenditure
10.6.6. Business performance
10.6.7. Key strategic moves and developments
10.7. Toshiba Corporation
10.7.1. Company overview
10.7.2. Key executives
10.7.3. Company snapshot
10.7.4. Operating business segments
10.7.5. Product portfolio
10.7.6. R&D expenditure
10.7.7. Business performance
10.7.8. Key strategic moves and developments
10.8. STMicroelectronics N. V.
10.8.1. Company overview
10.8.2. Key executives
10.8.3. Company snapshot
10.8.4. Operating business segments
10.8.5. Product portfolio
10.8.6. R&D expenditure
10.8.7. Business performance
10.8.8. Key strategic moves and developments
10.9. Xilinx Inc.
10.9.1. Company overview
10.9.2. Key executives
10.9.3. Company snapshot
10.9.4. Operating business segments
10.9.5. Product portfolio
10.9.6. R&D expenditure
10.9.7. Business performance
10.9.8. Key strategic moves and developments
10.10. United Microelectronics Corporation.
10.10.1. Company overview
10.10.2. Key executives
10.10.3. Company snapshot
10.10.4. Operating business segments
10.10.5. Product portfolio
10.10.6. R&D expenditure
10.10.7. Business performanceLIST OF TABLES
TABLE 01. GLOBAL 3D IC MARKET, BY TECHNOLOGY, 2020-2030 ($MILLION)
TABLE 02.3D IC MARKET FOR STACKED 3D (3D SIC), BY REGION, 2020-2030 ($MILLION)
TABLE 03.3D IC MARKET FOR 3D TSV, BY REGION, 2020-2030 ($MILLION)
TABLE 04.3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 05.3D IC MARKET FOR THROUGH SILICON VIA (TSV), BY REGION, 2020-2030 ($MILLION)
TABLE 06.3D IC MARKET FOR THROUGH GLASS VIA (TGV), BY REGION, 2020-2030($MILLION)
TABLE 07.3D IC MARKET FOR SILICON INTERPOSER, BY REGION, 2020-2030($MILLION)
TABLE 08. GLOBAL 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 09.3D IC MARKET FOR LOGIC, BY REGION, 2020-2030 ($MILLION)
TABLE 10.3D IC MARKET FOR IMAGING & OPTOELECTRONICS, BY REGION, 2020-2030 ($MILLION)
TABLE 11.3D IC MARKET FOR MEMORY, BY REGION, 2020-2030 ($MILLION)
TABLE 12.3D IC MARKET FOR MEMS/SENSORS, BY REGION, 2020-20230($MILLION)
TABLE 13.3D IC MARKET FOR LED, BY REGION, 2020-20230($MILLION)
TABLE 14.3D IC MARKET FOR OTHERS, BY REGION, 2020-2030($MILLION)
TABLE 15.3D IC MARKET, BY END-USER, 2020-2030 ($MILLION)
TABLE 16.3D IC MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2020-2030 ($MILLION)
TABLE 17.3D IC MARKET FOR TELECOMMUNICATION, BY REGION, 2020-2030 ($MILLION)
TABLE 18.3D IC MARKET FOR AUTOMOTIVE, BY REGION, 2020-2030 ($MILLION)
TABLE 19.3D IC MARKET FOR MILITARY & AEROSPACE, BY REGION, 2020-2030 ($MILLION)
TABLE 20.3D IC MARKET FOR MEDICAL DEVICE, BY REGION, 2020-2030 ($MILLION)
TABLE 21.3D IC MARKET FOR INDUSTRIAL, BY REGION, 2020-2030 ($MILLION)
TABLE 22.3D IC MARKET FOR OTHERS, BY REGION, 2020-2030 ($MILLION)
TABLE 23.3D IC MARKET REVENUE, BY REGION, 2020-2030 ($MILLION)
TABLE 24. NORTH AMERICA 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 25. NORTH AMERICA 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 26. NORTH AMERICA 3D IC MARKET, BY APPLICATION 2020-2030 ($MILLION)
TABLE 27. NORTH AMERICA 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 28. U.S. 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 29. U.S. 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 30. U.S. 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 31. U.S. 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 32. CANADA 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 33. CANADA 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 34. CANADA 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 35. CANADA 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 36. MEXICO 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 37. MEXICO 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 38. MEXICO 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 39. MEXICO 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 40. EUROPE 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 41. EUROPE 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 42. EUROPE 3D IC MARKET, BY APPLICATION 2020-2030 ($MILLION)
TABLE 43. EUROPE 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 44. GERMANY 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 45. GERMANY 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 46. GERMANY 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 47. GERMANY 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 48. UK 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 49. UK 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 50. UK 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 51. UK 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 52. FRANCE 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 53. FRANCE 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 54. FRANCE 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 55. FRANCE 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 56. ITALY 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 57. ITALY 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 58. ITALY 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 59. ITALY 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 60. REST OF EUROPE 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 61. REST OF EUROPE 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 62. REST OF EUROPE 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 63. REST OF EUROPE 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 64. ASIA-PACIFIC 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 65. ASIA-PACIFIC 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 66. ASIA-PACIFIC 3D IC MARKET, BY APPLICATION 2020-2030 ($MILLION)
TABLE 67. ASIA-PACIFIC 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 68. CHINA 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 69. CHINA 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 70. CHINA 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 71. CHINA 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 72. JAPAN 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 73. JAPAN 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 74. JAPAN 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 75. JAPAN 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 76. SOUTH KOREA 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 77. SOUTH KOREA 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 78. SOUTH KOREA 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 79. SOUTH KOREA 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 80. TAIWAN 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 81. TAIWAN 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 82. TAIWAN 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 83. TAIWAN 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 84. INDIA 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 85. INDIA 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 86. INDIA 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 87. INDIA 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 88. CANADA 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 89. CANADA 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 90. CANADA 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 91. CANADA 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 92. LAMEA 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 93. LAMEA 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 94. LAMEA 3D IC MARKET, BY APPLICATION 2020-2030 ($MILLION)
TABLE 95. LAMEA 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 96. LATIN AMERICA 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 97. LATIN AMERICA 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 98. LATIN AMERICA 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 99. LATIN AMERICA 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 100. MIDDLE EAST 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 101. MIDDLE EAST 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 102. MIDDLE EAST 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 103. MIDDLE EAST 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 104. AFRICA 3D IC MARKET, BY TYPE, 2020-2030 ($MILLION)
TABLE 105. AFRICA 3D IC MARKET, BY COMPONENT, 2020-2030 ($MILLION)
TABLE 106. AFRICA 3D IC MARKET, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 107. AFRICA 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 108. AMKOR TECHNOLOGY.: COMPANY SNAPSHOT
TABLE 109. AMKOR TECHNOLOGY: VIDEO ANALYTICS PRODUCT PORTFOLIO
TABLE 110. KEY EXECUTIVES
TABLE 111. ASE GROUP: COMPANY SNAPSHOT
TABLE 112. ASE GROUP: OPERATING SEGMENTS
TABLE 113. ASE GROUP: PRODUCT PORTFOLIO
TABLE 114. ASE GROUP.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 115. MICRON TECHNOLOGY, INC.:KEY EXECUTIVES
TABLE 116. MICRON TECHNOLOGY, INC.: COMPANY SNAPSHOT
TABLE 117. MICRON TECHNOLOGY, INC.: OPERATING SEGMENTS
TABLE 118. MICRON TECHNOLOGY, INC.: PRODUCT PORTFOLIO
TABLE 119. MICRON TECHNOLOGY, INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 120. INTEL CORPORATION: KEY EXECUTIVES
TABLE 121. INTEL CORPORATION: COMPANY SNAPSHOT
TABLE 122. INTEL CORPORATION: OPERATING SEGMENTS
TABLE 123. INTEL CORPORATION: PRODUCT PORTFOLIO
TABLE 124. INTEL CORPORATION: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 125. SAMSUNG:KEY EXECUTIVES
TABLE 126. SAMSUNG: COMPANY SNAPSHOT
TABLE 127. SAMSUNG: OPERATING SEGMENTS
TABLE 128. SAMSUNG: PRODUCT PORTFOLIO
TABLE 129. SAMSUNG: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 130. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: KEY EXECUTIVES
TABLE 131. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY SNAPSHOT
TABLE 132. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCT PORTFOLIO
TABLE 133. TOSHIBA CORPORATION:KEY EXECUTIVES
TABLE 134. TOSHIBA CORPORATION: COMPANY SNAPSHOT
TABLE 135. TOSHIBA CORPORATION: OPERATING SEGMENTS
TABLE 136. TOSHIBA CORPORATION: PRODUCT PORTFOLIO
TABLE 137. TOSHIBA CORPORATION: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 138. STMICROELECTRONICS N. V.:KEY EXECUTIVES
TABLE 139. STMICROELECTRONICS N. V.: COMPANY SNAPSHOT
TABLE 140. STMICROELECTRONICS N. V.: OPERATING SEGMENTS
TABLE 141. STMICROELECTRONICS N. V.: PRODUCT PORTFOLIO
TABLE 142. STMICROELECTRONICS N. V.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 143. XILINX INC:KEY EXECUTIVES
TABLE 144. XILINX INC: COMPANY SNAPSHOT
TABLE 145. XILINX INC: OPERATING SEGMENTS
TABLE 146. XILINX INC: PRODUCT PORTFOLIO
TABLE 147. XILINX INC: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 148. UNITED MICROELECTRONICS CORP:KEY EXECUTIVES
TABLE 149. UNITED MICROELECTRONICS CORP: COMPANY SNAPSHOT
TABLE 150. UNITED MICROELECTRONICS CORP: OPERATING SEGMENTS
TABLE 151. UNITED MICROELECTRONICS CORP: PRODUCT PORTFOLIOLIST OF FIGURES
FIGURE 01. SEGMENT INFORMATION
FIGURE 02. EXECUTIVE SUMMARY
FIGURE 03. EXECUTIVE SUMMARY
FIGURE 04. TOP IMPACTING FACTORS
FIGURE 05. TOP INVESTMENT POCKETS
FIGURE 06. MODERATE BARGAINING POWER OF SUPPLIERS
FIGURE 07. MODERATE TO HIGH THREAT OF NEW ENTRANTS
FIGURE 08. MODERATE THREAT OF SUBSTITUTES
FIGURE 09. MODERATE INTENSITY OF RIVALRY
FIGURE 10. MODERATE TO HIGH BARGAINING POWER OF BUYERS
FIGURE 11. PATENT ANALYSIS, BY COUNTRY
FIGURE 12. PATENT ANALYSIS, BY APPLICANT
FIGURE 13. GLOBAL 3D IC MARKET, BY TECHNOLOGY, 2020-2030
FIGURE 14. COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR STACKED 3D (3D SIC), BY COUNTRY, 2020 & 2030 (%)
FIGURE 15. COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR 3D TSV, BY COUNTRY, 2020 & 2030 (%)
FIGURE 16.3D IC MARKET, BY COMPONENT, 2020-2030
FIGURE 17. COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR THROUGH SILICON VIA (TSV), BY COUNTRY, 2020 & 2030 (%)
FIGURE 18. COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR THROUGH GLASS VIA (TGV), BY COUNTRY, 2020 & 2030 (%)
FIGURE 19. COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR SILICON INTERPOSER, BY COUNTRY, 2020 & 2030 (%)
FIGURE 20. GLOBAL 3D IC MARKET, BY APPLICATION, 2020-2030
FIGURE 21. COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR LOGIC, BY COUNTRY, 2020 & 2030 (%)
FIGURE 22. COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR IMAGING & OPTOELECTRONICS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 23. COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR MEMORY, BY COUNTRY, 2020 & 2030 (%)
FIGURE 24. COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR MEMS/SENSORS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 25. COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR LED, BY COUNTRY, 2020 & 2030 (%)
FIGURE 26. COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR OTHERS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 27.3D IC MARKET, BY END-USER, 2020-2030
FIGURE 28. COMPARATIVE SHARE ANALYSIS OF SHARE 3D IC MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 29. COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR TELECOMMUNICATION, BY COUNTRY, 2020 & 2030 (%)
FIGURE 30. COMPARATIVE SHARE ANALYSIS OF SHARE 3D IC MARKET FOR AUTOMOTIVE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 31. COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING MAREKT FOR MILITARY & AEROSPACE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 32. COMPARATIVE SHARE ANALYSIS OF SHARE 3D IC MARKET FOR MEDICAL DEVICE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 33. COMPARATIVE SHARE ANALYSIS OF SHARE 3D IC MARKET FOR INDUSTRIAL, BY COUNTRY, 2020 & 2030 (%)
FIGURE 34. COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR OTHERS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 35.3D IC MARKET, BY REGION, 2020-2030 (%)
FIGURE 36. COMPARATIVE SHARE ANALYSIS OF NORTH AMERICA 3D IC MARKET, BY COUNTRY, 2020-2030 (%)
FIGURE 37. U.S. 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 38. CANADA 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 39. MEXICO 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 40. COMPARATIVE SHARE ANALYSIS OF EUROPE 3D IC MARKET, BY COUNTRY, 2020-2030 (%)
FIGURE 41. GERMANY 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 42. UK 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 43. FRANCE 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 44. ITALY 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 45. REST OF EUROPE 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 46. COMPARATIVE SHARE ANALYSIS OF ASIA-PACIFIC 3D IC MARKET, BY COUNTRY, 2020-2030 (%)
FIGURE 47. CHINA 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 48. JAPAN 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 49. SOUTH KOREA 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 50. TAIWAN 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 51. INDIA 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 52. REST OF ASIA-PACIFIC 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 53. COMPARATIVE SHARE ANALYSIS OF LAMEA 3D IC MARKET, BY COUNTRY, 2020-2030 (%)
FIGURE 54. LATIN AMERICA 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 55. MIDDLE EAST 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 56. AFRICA 3D IC MARKET, 2020-2030 ($MILLION)
FIGURE 57. MARKET PLAYER POSITIONING, 2020
FIGURE 58. TOP WINNING STRATEGIES, BY YEAR, 2018-2021
FIGURE 59. TOP WINNING STRATEGIES, BY YEAR, 2018-2021
FIGURE 60. TOP WINNING STRATEGIES, BY COMPANY, 2018-2021
FIGURE 61. PRODUCT MAPPING OF TOP 10 PLAYERS
FIGURE 62. COMPETITIVE DASHBOARD
FIGURE 63. COMPETITIVE HEATMAP OF KEY PLAYERS
FIGURE 64. AMKOR TECHNOLOGY: KEY EXECUTIVE
FIGURE 65. AMKOR TECHNOLOGY: R&D EXPENDITURE, 2018-2020 ($MILLION)
FIGURE 66. AMKOR TECHNOLOGY: REVENUE, 2018-2020 ($BILLION)
FIGURE 67. AMKOR TECHNOLOGY: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 68. R&D EXPENDITURE, 2018-2020 ($MILLION)
FIGURE 69. ASE GROUP: REVENUE, 2018-2020 ($MILLION)
FIGURE 70. ASE GROUP: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 71. ASE GROUP: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 72. MICRON TECHNOLOGY, INC.: R&D EXPENDITURE, 2018-2020 ($MILLION)
FIGURE 73. MICRON TECHNOLOGY, INC.: REVENUE, 2018-2020 ($MILLION)
FIGURE 74. MICRON TECHNOLOGY, INC.: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 75. MICRON TECHNOLOGY, INC.: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 76. INTEL CORPORATION: R&D EXPENDITURE, 2018-2020 ($MILLION)
FIGURE 77. INTEL CORPORATION: REVENUE, 2018-2020 ($MILLION)
FIGURE 78. INTEL CORPORATION: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 79. INTEL CORPORATION: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 80. SAMSUNG: R&D EXPENDITURE, 2018-2020 ($MILLION)
FIGURE 81. SAMSUNG: NET SALES, 2018-2020 ($MILLION)
FIGURE 82. SAMSUNG: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 83. SAMSUNG: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 84. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: R&D EXPENDITURE, 2018-2020 ($MILLION)
FIGURE 85. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: REVENUE, 2018-2020 ($MILLION)
FIGURE 86. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 87. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 88. TOSHIBA CORPORATION: R&D EXPENDITURE, 2018-2020 ($MILLION)
FIGURE 89. TOSHIBA CORPORATION: NET SALES, 2018-2020 ($MILLION)
FIGURE 90. TOSHIBA CORPORATION: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 91. TOSHIBA CORPORATION: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 92. STMICROELECTRONICS N. V.: R&D EXPENDITURE, 2018-2020 ($MILLION)
FIGURE 93. STMICROELECTRONICS N. V.: REVENUE, 2018-2020 ($MILLION)
FIGURE 94. STMICROELECTRONICS N. V.: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 95. STMICROELECTRONICS N. V.: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 96. XILINX INC: R&D EXPENDITURE, 2018-2020 ($MILLION)
FIGURE 97. XILINX INC: REVENUE, 2018-2020 ($MILLION)
FIGURE 98. XILINX INC: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 99. XILINX INC: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 100. UNITED MICROELECTRONICS CORP: R&D EXPENDITURE, 2018-2020 ($MILLION)
FIGURE 101. UNITED MICROELECTRONICS CORP: REVENUE, 2018-2020 ($MILLION)
FIGURE 102. UNITED MICROELECTRONICS CORP: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 103. UNITED MICROELECTRONICS CORP: REVENUE SHARE, BY REGION, 2020 (%)

Companies Mentioned

• Amkor Technology (U.S.)
• ASE Group (Taiwan)
• United Microelectronics Corp ((Taiwan))
• Micron Technology Inc. (U.S.)
• Intel Corporation (U.S.)
• STMicroelectronics (Switzerland)
• Toshiba Corporation (Japan)
• Samsung Electronics Co. Ltd. (South Korea)
• Xilinx Inc. (U.S.)
• Taiwan Semiconductor Manufacturing Company (Taiwan).

Methodology

The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.

They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.

They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:

• Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
• Scientific and technical writings for product information and related preemptions
• Regional government and statistical databases for macro analysis
• Authentic news articles and other related releases for market evaluation
• Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast

Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.