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Changes in the Logic Chip Industry amid the U.S. - China Trade War

  • Report

  • 17 Pages
  • December 2021
  • Region: China, United States
  • Market Intelligence & Consulting Institute (MIC)
  • ID: 5514146

After the Biden administration came to power, the White House issued a 100-day review of America's semiconductor supply chains, providing a policy basis for the United States to revive domestic chipmaking and boost its capabilities in advanced semiconductor logic processes. Washington also plans to work closely with South Korea, Japan, and Taiwan to ensure its leadership in high-end chip technology and the establishment of a resilient and stable semiconductor supply system. Meanwhile, the Chinese government has developed a national strategy for semiconductor self-sufficiency that attempts to use massive government funding as well as China's capital markets to strengthen the country's semiconductor industry.

This report provides an overview of some ongoing challenges for the logic chip industry, in particular expeditiously resolving structural capacity and chip shortages in mature processes amid fast growth in fab construction and corresponding capital expenditures; explores how the logic chip sector will develop against this backdrop.

List of Topics


  • Background of the U.S-China trade war, touching on the fragility of supply chains and shortcomings of the United States and China
  • Development of the U.S. and Chinese semiconductor industry and related policies
  • Changes in the structure of the global logic chip industry, touching on advanced and mature logic chip industry structures and main players

 


Table of Contents

1. The U.S. Sees China as a Threat in the Semiconductor Sector
1.1 Fragile Semiconductor Supply Chains
1.2 The United States Lacks Advanced and Mature Logic Chip Manufacturing
1.3 Threats to the Development of China's Semiconductor Industry

2. The U.S. and China Developing Semiconductor Sectors Using Different Policies
2.1 U.S. Policy Focuses on Boosting Local Advanced Logic Chip Manufacturing Capacity
2.2 China's Push for Semiconductor Self-Sufficiency

3. Taiwan Plays A Key Role In Global Semiconductor Manufacturing
3.1 Taiwan Accounts for Nearly 40% of Global Logic Chip Production Capacity

4. Changes in the Structure of the Global Logic Chip Industry
4.1 The Upstream and Downstream Advanced Logic Chip Markets Have Oligopolistic Characteristics
4.2 The Upstream Oligopoly Structure and Downstream Exclusive Competitive Characteristics of Mature Logic Chips

5. Analyst's Perspective
Appendix
List of Companies

List of Tables
Table 1: The First Phase of the National Large Fund, Portfolio and the Fundraising Situation on the Shanghai STAR Board
Table 2: Advanced Logic Chip Industry Structure and Main Players
Table 3: Mature Logic Chip Industry Structure and Main Players

List of Figures
Figure 1: Semiconductor Supply Chain Risks Listed by the US Department of Commerce
Figure 2: Production Capacity Distribution of Global Semiconductor Wafer Technology Nodes
Figure 3: Proportion of Global Foundry Revenue


Samples

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Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • Advanced Micro Semiconductor
  • AMD
  • Apple
  • ASR Microelectronics
  • AUO
  • Cambricon Technologies
  • China Resources Micro
  • DB HiTek
  • FeiTeng
  • Fudan Microelectronics
  • GigaDevice
  • GlobalFoundries
  • Goodix Technology
  • Himax
  • HiSilicon
  • Huahong Semiconductor
  • Huatian Technology
  • Infineon
  • Intel
  • IntelliFusion
  • Jiangsu Changjiang Electronics Technology
  • Loongson Technology
  • MediaTek
  • Montage Technology
  • Nexchip
  • Novatek
  • Nvidia 
  • NXP
  • Power semiconductor Manufacturing
  • Powerchip
  • Qualcomm
  • Renesas
  • Samsung
  • Shanghai Awinic Tech
  • Shanghai Fudan Microelect
  • Shanghai Silicon Industry Group
  • Shanghai Yitu Network Technology
  • SMIC
  • Sony
  • STATS ChipPAC
  • Tongfu Microelectronics
  • Tsinghua Unigroup
  • UMC
  • UNISOC
  • Vanguard International Semiconductor
  • World Advanced
  • Xilinx
  • Yangtze Memory Technologies

Methodology

Primary research with a holistic, cross-domain approach

The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.

Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:

Method

  • Component supplier interviews
  • System supplier interviews
  • User interviews
  • Channel interviews
  • IPO interviews
  • Focus groups
  • Consumer surveys
  • Production databases
  • Financial data
  • Custom databases

Methodology

  • Technology forecasting and assessment
  • Product assessment and selection
  • Product life cycles
  • Added value analysis
  • Market trends
  • Scenario analysis
  • Competitor analysis

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