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Global 5G Chipset Market (2021-2026) by Industry Vertical, Product, Integrated Circuit, and Geography, Competitive Analysis and the Impact of Covid-19 with Ansoff Analysis

  • ID: 5515454
  • Report
  • November 2021
  • Region: Global
  • 167 Pages
  • Infogence Global Research
until Jan 31st 2022


  • Advanced Micro Devices
  • Broadcom
  • Hewlett Packard
  • Intel
  • Qorvo
  • Skyworks Solutions
The Global 5G Chipset Market is estimated to be USD 4.85 Bn in 2021 and is expected to reach USD 17.11 Bn by 2026, growing at a CAGR of 28.67%.

Market Dynamics

The Global 5G Chipset Market is anticipated to witness a growth in demand owing to rapid development in automated devices, drones, home automation devices, autonomous driving, multiuser gaming, videoconferencing, live streaming, telemedicine, and augmented reality. The significant advantages of 5G network would be its low latency and greater bandwidth. Higher bandwidth allows more data to flow through the network, while lower latency enables the time taken to travel from one point to another in the minimum amount of time. Moreover, other favorable characteristics of 5G include very high coverage, low power consumption for mobile phones and IoT devices, and maximum network availability. An increase in mobile broadband usage is expected to drive the growth of the Global 5G Chipset Market. The demand for higher internet speed by the consumers met by the 5G network and increased demand for mobile data services is expected to boost the Global 5G Chipset Market remarkably.

Moreover, the establishment of the 5G standard requires very high infrastructure cost in the deployment of multiple low-power base stations to meet the growth in demand for higher network capacity. This is expected to restrict the market growth in the early stages. On the other hand, the integration of 5G services with satellite communication and strategic partnerships with system integrators in developing economies provide lucrative growth opportunities for the market.

Market Segmentation

The Global 5G Chipset Market is further based on Industry Vertical, Product, Integrated Circuit, and Geography.

By Industry Vertical, the market is segmented into Automotive & Transportation, Energy & Utilities, Building Automation, Healthcare, Retail, Consumer Electronics, Public Safety & Surveillance, and Industrial Automation.

By Integrated Circuit, the market a classified into Radio Frequency Integrated Circuit (RFIC), Application-Specific Integrated Circuit (ASIC), Cellular Integrated Circuit (Cellular IC), Millimetre Wave Integrated Circuit (mmWave IC)

By Frequency, the market is classified into Sub-6 GHz, 24-39 GHz, and Above 39 GHz.

By Product, the market is classified into Devices, Customer Premises Equipment, Network Infrastructure Equipment.

By Geography, America is projected to lead the market.

Recent Developments

1. MediaTek introduced its Dimensity 9000 5G, the world first TSMC chip built on the 4nm process, and uses a Cortex-X2 core clocked at up to 3.05Ghz. - 19th November 2021
2. Qualcomm Technologies launched the new Snapdragon 888+ 5G mobile platform, a successor to the flagship Snapdragon 888 chipset. It offers an increased Qualcomm Kryo 680 CPU Prime core clock speed at up to 3.0 GHz and the 6th generation Qualcomm AI Engine with up to 32 TOPS AI performance.. - 28th June 2021
3. Nokia expands the 5G ReefShark chipset portfolio with Broadcom collaboration.. - 15th June 2020

Company Profiles

Some of the companies covered in this report are Qualcomm, Ericsson, Samsung, MediaTek, etc.

Countries Studied

  • America (Argentina, Brazil, Canada, Chile, Colombia, Mexico, Peru, United States, Rest of Americas)
  • Europe (Austria, Belgium, Denmark, Finland, France, Germany, Italy, Netherlands, Norway, Poland, Russia, Spain, Sweden, Switzerland, United Kingdom, Rest of Europe)
  • Middle-East and Africa (Egypt, Israel, Qatar, Saudi Arabia, South Africa, United Arab Emirates, Rest of MEA)
  • Asia-Pacific (Australia, Bangladesh, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Sri Lanka, Thailand, Taiwan, Rest of Asia-Pacific)

Competitive Quadrant

The report includes a Competitive Quadrant, a proprietary tool to analyze and evaluate the position of companies based on their Industry Position score and Market Performance score. The tool uses various factors for categorizing the players into four categories. Some of these factors considered for analysis are financial performance over the last 3 years, growth strategies, innovation score, new product launches, investments, growth in market share, etc.

Why buy this report?

  • The report offers a comprehensive evaluation of the Global 5G Chipset Market. The report includes in-depth qualitative analysis, verifiable data from authentic sources, and projections about market size. The projections are calculated using proven research methodologies.
  • The report has been compiled through extensive primary and secondary research. The primary research is done through interviews, surveys, and observation of renowned personnel in the industry.
  • The report includes an in-depth market analysis using Porter’s 5 forces model and the Ansoff Matrix. In addition, the impact of Covid-19 on the market is also featured in the report.
  • The report also includes the regulatory scenario in the industry, which will help you make a well-informed decision. The report discusses major regulatory bodies and major rules and regulations imposed on this sector across various geographies.
  • The report also contains the competitive analysis using Positioning Quadrants, the analyst's Proprietary competitive positioning tool.

Report Highlights:

  • A complete analysis of the market, including parent industry
  • Important market dynamics and trends
  • Market segmentation
  • Historical, current, and projected size of the market based on value and volume
  • Market shares and strategies of key players
  • Recommendations to companies for strengthening their foothold in the market
Note: Product cover images may vary from those shown


  • Advanced Micro Devices
  • Broadcom
  • Hewlett Packard
  • Intel
  • Qorvo
  • Skyworks Solutions
1 Report Description
1.1 Study Objectives
1.2 Market Definition
1.3 Currency
1.4 Years Considered
1.5 Language
1.6 Key Stakeholders

2 Research Methodology
2.1 Research Process
2.2 Data Collection and Validation
2.2.1 Secondary Research
2.2.2 Primary Research
2.2.3 Models
2.3 Market Size Estimation
2.3.1 Bottom-Up Approach
2.3.2 Top-Down Approach
2.4 Assumptions of the Study
2.5 Limitations of the Study

3 Executive Summary
3.1 Introduction
3.2 Market Size and Segmentation
3.3 Market Outlook

4 Market Influencers
4.1 Drivers
4.1.1 Increasing demand for High-Speed Internet And Large Network Coverage
4.1.2 Rising Cellular M2m/IoT Connections
4.1.3 Growing Mobile Data Traffic
4.2 Restraints
4.2.1 High investment and Technological & Infrastructure Issues in the Implementation Of 5G Network
4.2.2 Fragmented Spectrum Harmonization Model
4.3 Opportunities
4.3.1 Rising Government Initiatives
4.3.2 Growing Demand From Different Business Verticals
4.4 Challenges
4.4.1 Data Security and Information Privacy Concerns
4.4.2 Require Skilled Personnel due to Complex Technology

5 Market Analysis
5.1 Regulatory Scenario
5.2 Porter’s Five Forces Analysis
5.3 Impact of COVID-19
5.4 Ansoff Matrix Analysis

6 Global 5G Chipset Market, By Industry Vertical
6.1 Introduction
6.2 Automotive & Transportation
6.3 Energy & Utilities
6.4 Building Automation
6.5 Healthcare
6.6 Retail
6.7 Consumer Electronics
6.8 Public Safety & Surveillance
6.9 Industrial Automation

7 Global 5G Chipset Market, By Integrated Circuit
7.1 Introduction
7.2 Radio Frequency Integrated Circuit (RFIC)
7.3 Application -Specific Integrated Circuit (ASIC)
7.4 Cellular Integrated Circuit (Cellular IC)
7.5 Millimeter-Wave Integrated Circuit (mmWave IC)

8 Global 5G Chipset Market, By Frequency
8.1 Introduction
8.2 Sub-6 GHz
8.3 24–39 GHz
8.4 Above 39 GHz

9 Global 5G Chipset Market, By Product
9.1 Introduction
9.2 Customer-Premises Equipment (CPE)
9.3 Devices
9.4 Network Infrastructure Equipment

10 Global 5G Chipset Market, By Geography
10.1 Introduction
10.2 America
10.2.1 Argentina
10.2.2 Brazil
10.2.3 Canada
10.2.4 Chile
10.2.5 Colombia
10.2.6 Mexico
10.2.7 Peru
10.2.8 United States
10.2.9 Rest of Americas
10.3 Europe
10.3.1 Austria
10.3.2 Belgium
10.3.3 Denmark
10.3.4 Finland
10.3.5 France
10.3.6 Germany
10.3.7 Italy
10.3.8 Netherlands
10.3.9 Norway
10.3.10 Poland
10.3.11 Russia
10.3.12 Spain
10.3.13 Sweden
10.3.14 Switzerland
10.3.15 United Kingdom
10.3.16 Rest of Europe
10.4 Middle East and Africa
10.4.1 Egypt
10.4.2 Israel
10.4.3 Qatar
10.4.4 Saudi Arabia
10.4.5 South Africa
10.4.6 United Arab Emirates
10.4.7 Rest of MEA
10.5 Asia-Pacific
10.5.1 Australia
10.5.2 Bangladesh
10.5.3 China
10.5.4 India
10.5.5 Indonesia
10.5.6 Japan
10.5.7 Malaysia
10.5.8 Philippines
10.5.9 Singapore
10.5.10 South Korea
10.5.11 Sri Lanka
10.5.12 Thailand
10.5.13 Taiwan
10.5.14 Rest of Asia-Pacific

11 Competitive Landscape
11.1 Competitive Quadrant
11.2 Market Share Analysis
11.3 Strategic Initiatives
11.3.1 M&A and Investments
11.3.2 Partnerships and Collaborations
11.3.3 Product Developments and Improvements

12 Company Profiles
12.1 Qualcomm
12.2 Advanced Micro Devices
12.3 Amazon Web Services (AWS)
12.4 Analog Devices
12.5 Anokiwave
12.6 Broadcom
12.7 Cellnex Telecom
12.8 Ericsson
12.9 Fujitsu
12.10 Hewlett Packard
12.11 Huawei Technologies
12.12 IBM
12.13 Infineon Technologies
12.14 Intel
12.15 KT
12.16 Marvell
12.17 Microsoft Azure
12.18 Qorvo
12.19 Renesas Electronics
12.20 Samsung
12.21 Skyworks Solutions
12.22 UNISOC
12.23 Xilinx
12.24 ZTE
13 Appendix
13.1 Questionnaire

Note: Product cover images may vary from those shown
  • Qualcomm
  • Advanced Micro Devices
  • Amazon Web Services (AWS)
  • Analog Devices
  • Anokiwave
  • Broadcom
  • Cellnex Telecom
  • Ericsson
  • Fujitsu
  • Hewlett Packard
  • Huawei Technologies
  • IBM
  • Infineon Technologies
  • Intel
  • KT
  • Marvell
  • Microsoft Azure
  • Qorvo
  • Renesas Electronics
  • Samsung
  • Skyworks Solutions
  • Xilinx
  • ZTE
Note: Product cover images may vary from those shown