Asia Pacific 5G chipset market will grow by 44.4% annually with a total addressable market cap of $229.3 billion over 2022-2031 owing to the rising demand for efficient communication and increasing penetration of 5G networks, increasing demand for the Internet of Things and machine-to-machine connections, an ever-increasing need for high-speed mobile data services, and rapid development in automated devices with low latency & reduced power consumption.
Highlighted with 33 tables and 59 figures, this 124-page report “Asia Pacific 5G Chipset Market 2021-2031 by Chipset Type (ASIC, RFIC, MWTC, Cellular IC), Operational Frequency (< 6 GHz, 26-39 GHz, >39 GHz), Deployment Type (Devices, CPE, NIE), Processing Node (< 10 Nm, 10–28 Nm, >28 Nm), Industry Vertical (Consumer Electronics, Industrial Automation, Automotive and Transportation, Energy and Utilities, Healthcare), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Asia Pacific 5G chipset market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19. The balanced (most likely) projection is used to quantify Asia Pacific 5G chipset market in every aspect of the classification from perspectives of Chipset Type, Operational Frequency, Deployment Type, Processing Node, Industry Vertical, and Country.
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of the regional market by country and split of key national markets by Chipset Type, Operational Frequency, and Industry Vertical over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Highlighted with 33 tables and 59 figures, this 124-page report “Asia Pacific 5G Chipset Market 2021-2031 by Chipset Type (ASIC, RFIC, MWTC, Cellular IC), Operational Frequency (< 6 GHz, 26-39 GHz, >39 GHz), Deployment Type (Devices, CPE, NIE), Processing Node (< 10 Nm, 10–28 Nm, >28 Nm), Industry Vertical (Consumer Electronics, Industrial Automation, Automotive and Transportation, Energy and Utilities, Healthcare), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Asia Pacific 5G chipset market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
- Market Structure
- Growth Drivers
- Restraints and Challenges
- Emerging Product Trends & Market Opportunities
- Porter’s Fiver Forces
The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19. The balanced (most likely) projection is used to quantify Asia Pacific 5G chipset market in every aspect of the classification from perspectives of Chipset Type, Operational Frequency, Deployment Type, Processing Node, Industry Vertical, and Country.
Based on Chipset Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
- Application-specific Integrated Circuits (ASIC)
- Radio Frequency Integrated Circuit (RFIC)
- Millimeter Wave Technology Chips (MWTC)
- Cellular Integrated Circuit (Cellular IC)
- Other Chipset Types
Based on Operational Frequency, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
- Sub 6 GHz
- Between 26 and 39 GHz
- Above 39 GHz
By Deployment Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
- Devices
- Customer Premises Equipment (CPE)
- Network Infrastructure Equipment (NIE)
- Other Deployment Types
Based on Processing Node, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
- Less Than 10 Nm
- 10–28 Nm
- Above 28 Nm
Based on Industry Vertical, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
- Consumer Electronics
- Smartphones
- Laptops & Tablets
- Mobile Hubs
- Wearables
- Other Consumer Electronics
- Industrial Automation
- Automotive and Transportation
- Energy and Utilities
- Healthcare
- Retail
- Telecom & IT
- Public Safety & Surveillance
- Other Industry Verticals
Geographically, the following national/local markets are fully investigated:
- Japan
- China
- South Korea
- Australia
- India
- Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines)
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of the regional market by country and split of key national markets by Chipset Type, Operational Frequency, and Industry Vertical over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
- Analog Devices Inc.
- Anokiwave Inc.
- Broadcom Inc.
- Cavium Inc.
- Huawei Technologies Co., Ltd.
- Infineon Technologies AG
- Intel Corporation
- Macom Technology Solutions
- MediaTek Inc.
- Nokia Corporation
- NXP Semiconductors NV
- Qorvo Inc.
- Qualcomm Technologies Inc.
- Renesas Electronics Corporation
- Samsung Electronics Co., Ltd.
- Texas Instruments Inc.
- Unisoc Communications, Inc.
- Xilinx Inc.
- ZTE Corporation
Frequently Asked Questions about the Asian Pacific 5G Chipset Market
What is the estimated value of the Asian Pacific 5G Chipset Market?
What is the growth rate of the Asian Pacific 5G Chipset Market?
What is the forecasted size of the Asian Pacific 5G Chipset Market?
Who are the key companies in the Asian Pacific 5G Chipset Market?
| Report Attribute | Details |
|---|---|
| No. of Pages | 124 |
| Published | January 2022 |
| Forecast Period | 2021 - 2031 |
| Estimated Market Value ( USD | $ 1415.3 Million |
| Forecasted Market Value ( USD | $ 55869.6 Million |
| Compound Annual Growth Rate | 44.4% |
| Regions Covered | Asia Pacific |
Table of Contents
1 Introduction
2 Market Overview and Dynamics
3 Segmentation of Asia Pacific Market by Chipset Type
4 Segmentation of Asia Pacific Market by Operational Frequency
5 Segmentation of Asia Pacific Market by Deployment Type
6 Segmentation of Asia Pacific Market by Processing Node
7 Segmentation of Asia Pacific Market by Industry Vertical
8 Asia-Pacific Market 2021-2031 by Country
9 Competitive Landscape
List of Tables
List of Figures
Companies Mentioned
A selection of companies mentioned in this report includes:
- Analog Devices Inc.
- Anokiwave Inc.
- Broadcom Inc.
- Cavium Inc.
- Huawei Technologies Co., Ltd.
- Infineon Technologies AG
- Intel Corporation
- Macom Technology Solutions
- MediaTek Inc.
- Nokia Corporation
- NXP Semiconductors NV
- Qorvo Inc.
- Qualcomm Technologies Inc.
- Renesas Electronics Corporation
- Samsung Electronics Co., Ltd.
- Texas Instruments Inc.
- Unisoc Communications, Inc.
- Xilinx Inc.
- ZTE Corporation
Methodology
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