Semiconductor Bonding Market Report Size, Trends & Growth Opportunity, By Process Type, By Application, By Technology, By Type, By Region: Forecast till 2027

The global semiconductor bonding market was projected to grow from USD 887 million in 2020 to USD 1,059 million by 2027; it is expected to grow at a CAGR of 3.6% from 2020 to 2027.



Semiconductors’ arrangements comprise of atoms bonded together to form a homogeneous structure and it is used in the making of several integrated circuits (ICs) and fabrication devices. The structure of the material is homogeneous and virtually similar throughout in the bonding model.

Market Drivers

Key driving factor of the Semiconductor Bonding Market is the stacked die technology which is gaining acceptance in a range of electronics applications.

However, the growing demand for microelectromechanical systems (MEMS) is also another driving factor of the market.

Market Restraints

High operational cost of ownership is the key factor that restrain the growth of the Semiconductor Bonding Market.

Market Segmentation

Semiconductor Bonding Market is segmented into major 4 categories. Based on Process Type, the market is segmented into Die-To-Die Bonding, Die-To-Wafer Bonding and Wafer-To-Wafer Bonding. Based on Technology, the market is segmented into Die Bonding (Epoxy Die Bonding, Eutectic Die Bonding, Flip-chip Attachment, Hybrid Bonding) and Wafer Bonding (Direct Wafer Bonding, Anodic Wafer Bonding, TCB Wafer Bonding, Hybrid Bonding). Based on Type, the market is segmented into Die Bonder, Wafer Bonder and Flip-chip Bonder. Based on Application, the market is segmented into RF Devices, Mems and Sensors, Cmos Image Sensors, LED and 3D NAND. Based on Region, the market is segmented into North America, Europe, Asia Pacific, Latin America, Middle East.

Regional Analysis

Asia-Pacific is expected to be the dominant regional market because of the faster adoption of advanced technologies in developing countries in the region like China, Japan, India and as technical awareness in the Asia-Pacific is increasing, the market for consumer electronics also rising.

North America is also fast-growing region in the global semiconductor bonding market because of the huge demand for 3D semiconductor assembly and packaging solutions, the growing number of companies is adopting advanced technologies like IoT and artificial intelligence, mainly in the automotive sector.

Market Key Players

Some of the key players operating in Global Semiconductor Bonding Market are Shibaura Mechatronics, SUSS MicroTech SE, Yamaha Motor Robotics Corporation Co., Fuji Corporation, Panasonic, Kulicke & Soffa, ASM Pacific Technology Ltd., Shinkawa Ltd. and BE Semiconductor Industries NV.

Industry development

In October 2020, BE Semiconductor Industries N.V. (Besi) collaborated with Applied Materials, Inc. to develop the industry's first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI, and 5G.

In January 2021, ASM PACIFIC TECHNOLOGY (ASMPT) and EV GROUP (EVG) collaborated to create die-to-wafer hybrid bonding solutions for 3D-IC and heterogeneous integration applications. Chiplet technology combines chips with different process nodes into advanced packaging systems that can power new applications such as 5G, high-performance computing (HPC), and artificial intelligence. Die-to-wafer hybrid bonding is a key process for enabling the redesign of system-on-chip (SoC) devices to 3D stacked chips via chiplet technology - combining chips with different process nodes into advanced packaging systems that can power new applications such as 5G, HPC, and artificial intelligence (AI).

In April 2021, ASM PACIFIC TECHNOLOGY (ASMPT) introduced three new manufacturing systems that combine X-Celeprint's Micro-Transfer Printing (MTP) and ASM AMICRA's high precision die bonding technology to introduce the semiconductor industry's first complete system to enable high volume heterogeneous integration of ultra-thin dies onto up to 300mm base wafers.