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Global Sensor Fusion Market By Technology, By Type, By End User, By Regional Outlook, Industry Analysis Report and Forecast, 2021-2027

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    Report

  • 239 Pages
  • January 2022
  • Region: Global
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5553116
The Global Sensor Fusion Market size is expected to reach $10 billion by 2027, rising at a market growth of 17.8% CAGR during the forecast period.

Sensor fusion is the integration of many sensors to obtain more accurate and reliable data rather than using individual sensors. In addition, sensor fusion occurs when two or more sensors are combined to produce a better result. It overcomes the limitations of individual sensors by gathering and fusing data from a variety of sensors to provide quality information. This reliable data is then used to make decisions or take specific actions.

Increased sales of self-driving automobiles and a rise in the number of portable and wearable electronic gadgets are two notable factors driving the growth of the sensor fusion market. Furthermore, as the number of electric vehicles on the road grows, the demand for sensor fusion is expected to also grow. The market is growing due to the shrinking of electronic components to conserve space and the design of tiny electronic gadgets. In addition, digitalization and the application of sensor fusion in robots is becoming more prevalent across the world.

When processing is moved to a domain controller, sensors take approximately 30 percent less space and weigh 30 percent less. A camera's footprint is lowered from the size of a deck of cards to the size of a pack of chewing gum for comparison. OEMs have more alternatives in car packaging by keeping sensors as small as feasible.

With Satellite Architecture, where all data from sensors is shared centrally, active safety applications in the domain controller have additional opportunities to use it. Companies can even use artificial intelligence (AI) tools to extract useful data from data that is expected to otherwise be thrown away. The correct AI can learn from it, which aids companies in solving difficult corner cases that their customers confront.



COVID-19 Impact Analysis


The COVID-19 pandemic has impacted various domains of the business as well as society. This pandemic has negatively impacted the supply chain, the stock market, corporate confidence, and instilling fear in customers. The imposition of various restrictions like complete lockdown has resulted in the temporary ban on the manufacturing units owing to the unavailability of workforce and raw materials, which have negatively impacted the production as well as demand for the sensor fusion in the market.

Since the burden on healthcare system has increased due to the pandemic, the demand for various medical devices has also surged in the market, which is expected to further augment the need for sensor fusion. The introduction of COVID-19 has slowed the sensor fusion market's growth in 2020. However, during the recovery phase, the sensor fusion market is estimated to witness a significant demand owing to the surging demand for various smart devices and automobiles.

Market Growth Factors:


Increasing technological advancements and applications

With the rising technological advancements, the demand for sensor fusion is expected to surge since it helps in creating more accurate sensor mechanism in order to improve advanced system performance or fix modern applications. Sensor fusion technology is a sub-discipline of data fusion that is commonly referred to as multisensory data fusion or advanced sensor-data fusion. Several scientific research setups, current camera systems, and primary image processing are using this sensor-data fusion.

Growing usage of image sensors in various smart devices

Many new challenges in the field of image sensors can be overcome. The ever-increasing demand for new-generation smartphones with advanced features and modern integrated sensors is contributing to the growth of the sensor fusion market. There is an increase in the demand for image sensors from the manufacturers of various smart devices. A standard arrangement is now used by most digital cameras: A pixel array stands atop a 2D Bayer arrangement of RGB colour filters. A photodetector is built into each pixel, which absorbs filtered light to produce one of the primary colours.

Marketing Restraining Factor:


High chances of technical glitches in the electronic braking system

Due to the existence of multiple electrical components, self-driving automobiles are vulnerable to hacking. Self-driving automobiles can be hampered by hackers imitating another person or vehicle in front of them. This prevents the software platform from acting in a timely manner. Because they are vulnerable to hacking, hackers can take control of various applications such as infotainment systems, adaptive cruise control, and emergency braking systems. For example, Fiat Chrysler recalled 1.4 million vehicles in 2015 owing to safety concerns.



Technology Outlook


On the basis of technology, the sensor fusion market is bifurcated into MEMS and non-MEMS. The non MEMS segment acquired a significant revenue share in the sensor fusion market in 2020. Non-MEMS based devices are also utilized in healthcare and life science industry. These devices are easily commercialised for small volume sample analysis and in-vivo measurement in chemical and biological processes, as well as mesoscale machines.

Type Outlook


Based on type, the sensor fusion market is segmented into Radar Sensors, Image Sensors, IMU, Temperature Sensor and others. Radar sensors segment garnered a significant revenue share in the sensor fusion market in 2020. These kinds of sensors are microwave echo signal converters that convert microwave echo signals to electrical signals. They detect motion using wireless sensing technology by determining the object's position, shape, motion characteristics, and trajectory.

End User Outlook


By end user, the sensor fusion market is segmented into Automotive, Healthcare, Consumer Electronics, Military & Defense and Industrial. The consumer electronics segment acquired the maximum revenue share in the sensor fusion market in 2020. This is due to the rise in the amount of apps for smartphones, tablets, and wearables. In addition, the increase in the disposable income of the consumers is expected to surge the demand for various consumer electronics.

Regional Outlook


Region-wise, the sensor fusion market is analyzed across North America, Europe, Asia Pacific and LAMEA. The Asia Pacific region emerged as the leading region in the sensor fusion market with the largest revenue share in 2020. Due to the expanding acceptance of autonomous vehicles, severe government regulation, and increasing dominance in the semiconductor industry, this region became one of the most important locations for sensor fusion in autonomous applications.

Cardinal Matrix - Sensor Fusion Market Competition Analysis




The major strategies followed by the market participants are Partnerships. Based on the Analysis presented in the Cardinal matrix; STMicroelectronics N.V., Robert Bosch GmbH, Asahi Kasei Corporation and Analog Devices, Inc.  are the forerunners in the Sensor Fusion Market. Companies such as CEVA, Inc., TDK Corporation (InvenSense, Inc.), Renesas Electronics Corporation are some of the key innovators in the Market.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Analog Devices, Inc., Renesas Electronics Corporation, TDK Corporation (InvenSense, Inc.), STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Asahi Kasei Corporation, Robert Bosch GmbH, CEVA, Inc., and MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.).

Recent Strategies Deployed in Sensor Fusion Market


» Partnerships, Collaborations and Agreements:

  • Dec-2021: Bosch Sensortec partnered with NextNav, a leader in next-generation GPS. Bosch Sensortec is expected to use the relationship to evaluate measurement accuracy and give rigorous performance assurance to Original Equipment Manufacturers (OEMs) who use its sensors in mass-market goods such as smartphones, tablets, and wearables.
  • Jun-2021: STMicroelectronics teamed up with Eyeris, a leader in vision-based AI software and in-cabin sensor fusion technologies. Following the collaboration, Eyeris' powerful portfolio of Deep Neural Networks is used to extend ST's Global-Shutter sensor to in-cabin sensing applications, resulting in a comprehensive visuospatial awareness of the whole car interior.
  • Jan-2021: TDK Corporation's division Tursted Positioning Inc. partnered with Uhnder. The partnership was focused on developing a localization reference design with world-class performance and accuracy with TPI’s AUTO positioning software and Uhnder's software-defined digital radar sensor. The combined solution offers lane-level positioning accuracy in urban areas.
  • Jan-2021: CEVA announced a licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) for accelerating the technology innovation for DARPA programs. DSPs and software for 5G baseband processing, short-range connection, sensor fusion, computer vision, sound processing, and Artificial Intelligence are among the key technologies offered by CEVA. CEVA's r collaboration with DARPA broadens the use of its sophisticated DSPs, AI Processors, and wireless IPs to DARPA's research programs and ecosystem.
  • Dec-2020: STMicroelectronics collaborated with LeddarTech, a developer of Level 1-5 ADAS and AD sensing technology. The collaboration focused on the development and promotion of lidar solutions based on ST's MEMS mirror-based laser beam scanning solutions and LeddarTech's sensing components and software products.
  • Dec-2020: Renesas strengthened its collaboration with LeddarTech, a player in Level 1-5 advanced driver assistance systems (ADAS) and automated driving (AD) sensing technology. In this fast-growing ADAS & AD sector, the integration of LeddarTech's sensor fusion and LiDAR technologies in an open platform paradigm with Renesas' R-Car V3U technology is expected to enable the customers to develop value-added and differentiated solutions.

» Product Launches and Product Expansions:

  • Oct-2021: Infineon Technologies announced the launch of the new XENSIV TLE4972, its first automotive current sensor. For precise and reliable current measurements, the coreless current sensor employs Infineon's well-proven Hall technology. The TLE4972 is suited for xEV applications such as traction inverters used in hybrid and battery-driven vehicles, as well as battery main switches, owing to its compact design and diagnostic modes.
  • Jan-2021: NXP Semiconductors unveiled BlueBox 3.0, an expanded version of NXP's flagship safe Automotive High-Performance Compute (AHPC) development platform. The Kalray CoolidgeTM MPPA (Massively Parallel Processor Array) processors can be targeted for perception, prediction, pathfinding capabilities, and emerging connected services and can accommodate radar, vision, and LiDAR signal paths for advanced sensor fusion applications. They also provide expansion options for AI and ML acceleration
  • Jan-2021: TDK launched the InvenSense ICM-40627 and ICM-42688-V high-performance MEMS motion tracking solutions. The ICM-40627 solution allows intuitive and smart motion control for any motion pointing application whereas the ICM-42688 solution offers premium fusion performance for any accurate orientation-based application.
  • Jul-2020: TDK Corporation introduced the InvenSense SmartBug, a wireless and compact multi-sensor solution. The solution has been designed for a range of consumer and commercial IoT applications. This solution allows easy and quick access to smart and reliable sensor data without the requirement for soldering, programming, and extra modifications.
  • Apr-2020: STMicroelectronics introduced the IIS3DWB vibration sensor and supported the STEVAL-STWINKT1 multi-sensor evaluation kit. These launches enhanced the development of condition-monitoring systems that increased productivity through inferring equipment maintenance requirements.

Scope of the Study


Market Segments Covered in the Report:


By Technology

  • MEMS
  • Non MEMS

By Type

  • IMU
  • Radar Sensors
  • Image Sensors
  • Temperature Sensors
  • Others

By End User

  • Consumer Electronics
  • Healthcare
  • Military & Defense
  • Automotive
  • Others

By Geography


  • North America
  • US
  • Canada
  • Mexico
  • Rest of North America
  • Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific
  • LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Key Market Players


List of Companies Profiled in the Report:

  • Analog Devices, Inc.
  • Renesas Electronics Corporation
  • TDK Corporation (InvenSense, Inc.)
  • STMicroelectronics N.V.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Asahi Kasei Corporation
  • Robert Bosch GmbH
  • CEVA, Inc.
  • MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.)

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Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global Sensor Fusion Market, by Technology
1.4.2 Global Sensor Fusion Market, by Type
1.4.3 Global Sensor Fusion Market, by End User
1.4.4 Global Sensor Fusion Market, by Geography
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Acquisition and Mergers
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2017-2021)
3.3.2 Key Strategic Move: (Partnerships, Collaborations, and Agreements 2017, Dec - 2021, Dec) Leading Players
Chapter 4. Global Sensor Fusion Market by Technology
4.1 Global Sensor Fusion MEMS Market by Region
4.2 Global Sensor Fusion Non MEMS Market by Region
Chapter 5. Global Sensor Fusion Market by Type
5.1 Global IMU Sensor Fusion Market by Region
5.2 Global Radar Sensors Sensor Fusion Market by Region
5.3 Global Image Sensors Sensor Fusion Market by Region
5.4 Global Temperature Sensors Sensor Fusion Market by Region
5.5 Global Other Type Sensor Fusion Market by Region
Chapter 6. Global Sensor Fusion Market by End User
6.1 Global Sensor Fusion Consumer Electronics Market by Region
6.2 Global Sensor Fusion Healthcare Market by Region
6.3 Global Sensor Fusion Military & Defense Market by Region
6.4 Global Sensor Fusion Automotive Market by Region
6.5 Global Sensor Fusion Others Market by Region
Chapter 7. Global Sensor Fusion Market by Region
7.1 North America Sensor Fusion Market
7.1.1 North America Sensor Fusion Market by Technology
7.1.1.1 North America Sensor Fusion MEMS Market by Country
7.1.1.2 North America Sensor Fusion Non MEMS Market by Country
7.1.2 North America Sensor Fusion Market by Type
7.1.2.1 North America IMU Sensor Fusion Market by Country
7.1.2.2 North America Radar Sensors Sensor Fusion Market by Country
7.1.2.3 North America Image Sensors Sensor Fusion Market by Country
7.1.2.4 North America Temperature Sensors Sensor Fusion Market by Country
7.1.2.5 North America Other Type Sensor Fusion Market by Country
7.1.3 North America Sensor Fusion Market by End User
7.1.3.1 North America Sensor Fusion Consumer Electronics Market by Country
7.1.3.2 North America Sensor Fusion Healthcare Market by Country
7.1.3.3 North America Sensor Fusion Military & Defense Market by Country
7.1.3.4 North America Sensor Fusion Automotive Market by Country
7.1.3.5 North America Sensor Fusion Others Market by Country
7.1.4 North America Sensor Fusion Market by Country
7.1.4.1 US Sensor Fusion Market
7.1.4.1.1 US Sensor Fusion Market by Technology
7.1.4.1.2 US Sensor Fusion Market by Type
7.1.4.1.3 US Sensor Fusion Market by End User
7.1.4.2 Canada Sensor Fusion Market
7.1.4.2.1 Canada Sensor Fusion Market by Technology
7.1.4.2.2 Canada Sensor Fusion Market by Type
7.1.4.2.3 Canada Sensor Fusion Market by End User
7.1.4.3 Mexico Sensor Fusion Market
7.1.4.3.1 Mexico Sensor Fusion Market by Technology
7.1.4.3.2 Mexico Sensor Fusion Market by Type
7.1.4.3.3 Mexico Sensor Fusion Market by End User
7.1.4.4 Rest of North America Sensor Fusion Market
7.1.4.4.1 Rest of North America Sensor Fusion Market by Technology
7.1.4.4.2 Rest of North America Sensor Fusion Market by Type
7.1.4.4.3 Rest of North America Sensor Fusion Market by End User
7.2 Europe Sensor Fusion Market
7.2.1 Europe Sensor Fusion Market by Technology
7.2.1.1 Europe Sensor Fusion MEMS Market by Country
7.2.1.2 Europe Sensor Fusion Non MEMS Market by Country
7.2.2 Europe Sensor Fusion Market by Type
7.2.2.1 Europe IMU Sensor Fusion Market by Country
7.2.2.2 Europe Radar Sensors Sensor Fusion Market by Country
7.2.2.3 Europe Image Sensors Sensor Fusion Market by Country
7.2.2.4 Europe Temperature Sensors Sensor Fusion Market by Country
7.2.2.5 Europe Other Type Sensor Fusion Market by Country
7.2.3 Europe Sensor Fusion Market by End User
7.2.3.1 Europe Sensor Fusion Consumer Electronics Market by Country
7.2.3.2 Europe Sensor Fusion Healthcare Market by Country
7.2.3.3 Europe Sensor Fusion Military & Defense Market by Country
7.2.3.4 Europe Sensor Fusion Automotive Market by Country
7.2.3.5 Europe Sensor Fusion Others Market by Country
7.2.4 Europe Sensor Fusion Market by Country
7.2.4.1 Germany Sensor Fusion Market
7.2.4.1.1 Germany Sensor Fusion Market by Technology
7.2.4.1.2 Germany Sensor Fusion Market by Type
7.2.4.1.3 Germany Sensor Fusion Market by End User
7.2.4.2 UK Sensor Fusion Market
7.2.4.2.1 UK Sensor Fusion Market by Technology
7.2.4.2.2 UK Sensor Fusion Market by Type
7.2.4.2.3 UK Sensor Fusion Market by End User
7.2.4.3 France Sensor Fusion Market
7.2.4.3.1 France Sensor Fusion Market by Technology
7.2.4.3.2 France Sensor Fusion Market by Type
7.2.4.3.3 France Sensor Fusion Market by End User
7.2.4.4 Russia Sensor Fusion Market
7.2.4.4.1 Russia Sensor Fusion Market by Technology
7.2.4.4.2 Russia Sensor Fusion Market by Type
7.2.4.4.3 Russia Sensor Fusion Market by End User
7.2.4.5 Spain Sensor Fusion Market
7.2.4.5.1 Spain Sensor Fusion Market by Technology
7.2.4.5.2 Spain Sensor Fusion Market by Type
7.2.4.5.3 Spain Sensor Fusion Market by End User
7.2.4.6 Italy Sensor Fusion Market
7.2.4.6.1 Italy Sensor Fusion Market by Technology
7.2.4.6.2 Italy Sensor Fusion Market by Type
7.2.4.6.3 Italy Sensor Fusion Market by End User
7.2.4.7 Rest of Europe Sensor Fusion Market
7.2.4.7.1 Rest of Europe Sensor Fusion Market by Technology
7.2.4.7.2 Rest of Europe Sensor Fusion Market by Type
7.2.4.7.3 Rest of Europe Sensor Fusion Market by End User
7.3 Asia Pacific Sensor Fusion Market
7.3.1 Asia Pacific Sensor Fusion Market by Technology
7.3.1.1 Asia Pacific Sensor Fusion MEMS Market by Country
7.3.1.2 Asia Pacific Sensor Fusion Non MEMS Market by Country
7.3.2 Asia Pacific Sensor Fusion Market by Type
7.3.2.1 Asia Pacific IMU Sensor Fusion Market by Country
7.3.2.2 Asia Pacific Radar Sensors Sensor Fusion Market by Country
7.3.2.3 Asia Pacific Image Sensors Sensor Fusion Market by Country
7.3.2.4 Asia Pacific Temperature Sensors Sensor Fusion Market by Country
7.3.2.5 Asia Pacific Other Type Sensor Fusion Market by Country
7.3.3 Asia Pacific Sensor Fusion Market by End User
7.3.3.1 Asia Pacific Sensor Fusion Consumer Electronics Market by Country
7.3.3.2 Asia Pacific Sensor Fusion Healthcare Market by Country
7.3.3.3 Asia Pacific Sensor Fusion Military & Defense Market by Country
7.3.3.4 Asia Pacific Sensor Fusion Automotive Market by Country
7.3.3.5 Asia Pacific Sensor Fusion Others Market by Country
7.3.4 Asia Pacific Sensor Fusion Market by Country
7.3.4.1 China Sensor Fusion Market
7.3.4.1.1 China Sensor Fusion Market by Technology
7.3.4.1.2 China Sensor Fusion Market by Type
7.3.4.1.3 China Sensor Fusion Market by End User
7.3.4.2 Japan Sensor Fusion Market
7.3.4.2.1 Japan Sensor Fusion Market by Technology
7.3.4.2.2 Japan Sensor Fusion Market by Type
7.3.4.2.3 Japan Sensor Fusion Market by End User
7.3.4.3 India Sensor Fusion Market
7.3.4.3.1 India Sensor Fusion Market by Technology
7.3.4.3.2 India Sensor Fusion Market by Type
7.3.4.3.3 India Sensor Fusion Market by End User
7.3.4.4 South Korea Sensor Fusion Market
7.3.4.4.1 South Korea Sensor Fusion Market by Technology
7.3.4.4.2 South Korea Sensor Fusion Market by Type
7.3.4.4.3 South Korea Sensor Fusion Market by End User
7.3.4.5 Singapore Sensor Fusion Market
7.3.4.5.1 Singapore Sensor Fusion Market by Technology
7.3.4.5.2 Singapore Sensor Fusion Market by Type
7.3.4.5.3 Singapore Sensor Fusion Market by End User
7.3.4.6 Malaysia Sensor Fusion Market
7.3.4.6.1 Malaysia Sensor Fusion Market by Technology
7.3.4.6.2 Malaysia Sensor Fusion Market by Type
7.3.4.6.3 Malaysia Sensor Fusion Market by End User
7.3.4.7 Rest of Asia Pacific Sensor Fusion Market
7.3.4.7.1 Rest of Asia Pacific Sensor Fusion Market by Technology
7.3.4.7.2 Rest of Asia Pacific Sensor Fusion Market by Type
7.3.4.7.3 Rest of Asia Pacific Sensor Fusion Market by End User
7.4 LAMEA Sensor Fusion Market
7.4.1 LAMEA Sensor Fusion Market by Technology
7.4.1.1 LAMEA Sensor Fusion MEMS Market by Country
7.4.1.2 LAMEA Sensor Fusion Non MEMS Market by Country
7.4.2 LAMEA Sensor Fusion Market by Type
7.4.2.1 LAMEA IMU Sensor Fusion Market by Country
7.4.2.2 LAMEA Radar Sensors Sensor Fusion Market by Country
7.4.2.3 LAMEA Image Sensors Sensor Fusion Market by Country
7.4.2.4 LAMEA Temperature Sensors Sensor Fusion Market by Country
7.4.2.5 LAMEA Other Type Sensor Fusion Market by Country
7.4.3 LAMEA Sensor Fusion Market by End User
7.4.3.1 LAMEA Sensor Fusion Consumer Electronics Market by Country
7.4.3.2 LAMEA Sensor Fusion Healthcare Market by Country
7.4.3.3 LAMEA Sensor Fusion Military & Defense Market by Country
7.4.3.4 LAMEA Sensor Fusion Automotive Market by Country
7.4.3.5 LAMEA Sensor Fusion Others Market by Country
7.4.4 LAMEA Sensor Fusion Market by Country
7.4.4.1 Brazil Sensor Fusion Market
7.4.4.1.1 Brazil Sensor Fusion Market by Technology
7.4.4.1.2 Brazil Sensor Fusion Market by Type
7.4.4.1.3 Brazil Sensor Fusion Market by End User
7.4.4.2 Argentina Sensor Fusion Market
7.4.4.2.1 Argentina Sensor Fusion Market by Technology
7.4.4.2.2 Argentina Sensor Fusion Market by Type
7.4.4.2.3 Argentina Sensor Fusion Market by End User
7.4.4.3 UAE Sensor Fusion Market
7.4.4.3.1 UAE Sensor Fusion Market by Technology
7.4.4.3.2 UAE Sensor Fusion Market by Type
7.4.4.3.3 UAE Sensor Fusion Market by End User
7.4.4.4 Saudi Arabia Sensor Fusion Market
7.4.4.4.1 Saudi Arabia Sensor Fusion Market by Technology
7.4.4.4.2 Saudi Arabia Sensor Fusion Market by Type
7.4.4.4.3 Saudi Arabia Sensor Fusion Market by End User
7.4.4.5 South Africa Sensor Fusion Market
7.4.4.5.1 South Africa Sensor Fusion Market by Technology
7.4.4.5.2 South Africa Sensor Fusion Market by Type
7.4.4.5.3 South Africa Sensor Fusion Market by End User
7.4.4.6 Nigeria Sensor Fusion Market
7.4.4.6.1 Nigeria Sensor Fusion Market by Technology
7.4.4.6.2 Nigeria Sensor Fusion Market by Type
7.4.4.6.3 Nigeria Sensor Fusion Market by End User
7.4.4.7 Rest of LAMEA Sensor Fusion Market
7.4.4.7.1 Rest of LAMEA Sensor Fusion Market by Technology
7.4.4.7.2 Rest of LAMEA Sensor Fusion Market by Type
7.4.4.7.3 Rest of LAMEA Sensor Fusion Market by End User
Chapter 8. Company Profiles
8.1 Analog Devices, Inc.
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Regional Analysis
8.1.4 Research & Development Expenses
8.1.5 Recent strategies and developments
8.1.5.1 Partnerships, Collaborations, and Agreements
8.1.6 SWOT Analysis
8.2 Renesas Electronics Corporation
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 Research & Development Expense
8.2.5 Recent strategies and developments
8.2.5.1 Partnerships, Collaborations, and Agreements
8.2.5.2 Acquisition and Mergers:
8.3 TDK Corporation (InvenSense, Inc.)
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Regional & Segmental Analysis
8.3.4 Research & Development Expenses
8.3.5 Recent strategies and developments
8.3.5.1 Partnerships, Collaborations, and Agreements
8.3.5.2 Product Launches and Product Expansions
8.4 STMicroelectronics N.V.
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expense
8.4.5 SWOT Analysis
8.5 Infineon Technologies AG
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Segmental and Regional Analysis
8.5.4 Research & Development Expense
8.5.5 Recent strategies and developments
8.5.5.1 Product Launches and Product Expansions
8.5.6 SWOT Analysis
8.6 NXP Semiconductors N.V.
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Regional Analysis
8.6.4 Research & Development Expense
8.6.5 Recent strategies and developments
8.6.5.1 Product Launches and Product Expansions
8.6.6 SWOT Analysis
8.7 Asahi Kasei Corporation
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 Robert Bosch GmbH
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Segmental and Regional Analysis
8.8.4 Research & Development Expense
8.8.5 Recent strategies and developments
8.8.5.1 Partnerships, Collaborations, and Agreements
8.8.6 SWOT Analysis
8.9 CEVA, Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Regional Analysis
8.9.4 Research & Development Expense
8.9.5 Recent strategies and developments
8.9.5.1 Partnerships, Collaborations, and Agreements
8.9.5.2 Acquisition and Mergers:
8.10. MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.)
8.10.1 Company Overview

Companies Mentioned

  • Analog Devices, Inc.
  • Renesas Electronics Corporation
  • TDK Corporation (InvenSense, Inc.)
  • STMicroelectronics N.V.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Asahi Kasei Corporation
  • Robert Bosch GmbH
  • CEVA, Inc.
  • MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.)

Methodology

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