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Fan-Out Packaging Materials and Equipment Market -Forecast (2023 - 2028)

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    Report

  • 132 Pages
  • December 2021
  • Region: Global
  • IndustryARC
  • ID: 5575767
The global Fan-out Packaging Materials and Equipment Market is estimated to grow at a CAGR of 16.09% during the forecast period 2022-2027 and reach $3,418.7 million by 2027, from around $1,318.2 million in 2021.

Cloud infrastructure, 5G, autonomous driving, and the artificial intelligence revolution will shape the packaging trend during the forecast period thereby contributing to the Fan-out Packaging Materials and Equipment Market. Omron stated that Level3 autonomous vehicle by 2020,

Level4 will be achieved goal by 2025. In 2021, GM announced an increase in its budget for electric and automated vehicles from $20 billion to $27 billion and plans to launch 30 new EVs globally in the next five years. GM announced that it will launch 5G-enabled cars in China followed by the US region in 2022. Furthermore, collaborations with telecom operators are helping automakers deploy cars with embedded connectivity faster than before this is set to boost the market growth rate during forecast period 2022-2027.



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Table of Contents

1. Fan Out Packaging Materials and Equipment Market
1.1 Definitions and Scope
2. Fan Out Packaging Materials and Equipment Market - Executive Summary
2.1 Market Revenue, Market Size and Key Trends by Company
2.2 Key trends By Industry
2.3 Key trends segmented by Geography
3. Fan Out Packaging Materials and Equipment Market - Market Landscape
3.1 Comparative Analysis
3.1.1 Product/Company Benchmarking-Top 5 Companies
3.1.2 Top 5 Financial Analysis
3.1.3 Market Value Split by Top 5 Companies
3.1.4 Patent Analysis
4. Fan Out Packaging Materials and Equipment Market - Market Forces
4.1 Market Drivers
4.2 Market Constraints
4.3 Porters five force model
4.3.1 Bargaining power of suppliers
4.3.2 Bargaining powers of customers
4.3.3 Threat of new entrants
4.3.4 Rivalry among existing players
4.3.5 Threat of substitutes
5. Fan Out Packaging Materials and Equipment Market - By Strategic Analysis
5.1 Value Chain Analysis
5.2 Opportunities Analysis
5.3 Product Life Cycle/Market Life Cycle Analysis
5.4 Suppliers and Distributors (5 Key Suppliers and Their Relevant Distributors)
6. Fan Out Packaging Materials and Equipment Market - By Process Type (Market Size -$Million/Billion)
6.1 Carrier bonding & debonding
6.2 Pick & Place
6.3 RDL Passivation
6.4 Others
7. Fan Out Packaging Materials and Equipment Market - By Type (Market Size -$Million/Billion)
7.1 Core Fan-out
7.2 High-density fan-out
7.3 Ultra high density fan-out
8. Fan Out Packaging Materials and Equipment Market - By Business Model (Market Size -$Million/Billion)
8.1 OSAT
8.2 Foundry
8.3 FDM
9. Fan Out Packaging Materials and Equipment Market - By Application (Market Size -$Million/Billion)
9.1 PMICs, RF Transceivers
9.2 Connectivity Modules
9.3 Audio/Codec Modules
9.4 Radar Modules & Sensors
9.5 Others
10. Fan Out Packaging Materials and Equipment Market - By Geography (Market Size -$Million/Billion)
10.1 North America
10.1.1 U.S
10.1.2 Canada
10.1.3 Mexico
10.2 South America
10.2.1 Brazil
10.2.2 Argentina
10.2.3 Chile
10.2.4 Colombia
10.2.5 Others
10.3 Europe
10.3.1 Germany
10.3.2 France
10.3.3 UK
10.3.4 Italy
10.3.5 Spain
10.3.6 Russia
10.3.7 Netherlands
10.3.8 Others
10.4 APAC
10.4.1 China
10.4.2 Japan
10.4.3 South Korea
10.4.4 India
10.4.5 Australia
10.4.6 Indonesia
10.4.7 Malaysia
10.4.8 Others
10.5 RoW
10.5.1 Middle East
10.5.2 Africa
11. Fan Out Packaging Materials and Equipment Market - Market Entropy
11.1 New product launches
11.2 M&A's, collaborations, JVs and partnerships
12. Fan Out Packaging Materials and Equipment Market - Company Analysis (Market , Product Portfolio, Revenue, Developments)
12.1 SAKOR Technologies
12.2 AVL List GmbH
12.3 Taylor Fan Out Packaging Materials and Equipment
12.4 Dynomerk Controls
12.5 Froude, Inc.
12.6 Company 6
12.7 Company 7
12.8 Company 8
12.9 Company 9
12.8 Company 10

Methodology

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