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Global System in Package Market (2022-2027) by Packaging Technology, Package Type, Packaging Method, Device, Application, Geography, Competitive Analysis and the Impact of Covid-19 with Ansoff Analysis

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  • 170 Pages
  • April 2022
  • Region: Global
  • Infogence Global Research
  • ID: 5585767
The Global System in Package Market is estimated to be USD 12.14 Bn in 2022 and is projected to reach USD 18.57 Bn by 2027, growing at a CAGR of 8.87%.

Market dynamics are forces that impact the prices and behaviors of the Global System in Package Market stakeholders. These forces create pricing signals which result from the changes in the supply and demand curves for a given product or service. Forces of Market Dynamics may be related to macro-economic and micro-economic factors. There are dynamic market forces other than price, demand, and supply. Human emotions can also drive decisions, influence the market, and create price signals.

As the market dynamics impact the supply and demand curves, decision-makers aim to determine the best way to use various financial tools to stem various strategies for speeding the growth and reducing the risks.

Market Segmentations

The Global System in Package Market is segmented based on Packaging Technology, Package Type, Packaging Method, Device, Application, and Geography.
  • By Packaging Technology, the market is classified into 2D IC Packaging Technology, 5D IC Packaging Technology, and 3D IC Packaging Technology.
  • By Package Type, the market is classified into Ball Grid Array (BGA), Surface Mount Package, Pin Grid Array (PGA), Flat Package (FP), and Small Outline Package.
  • By Packaging Method, the market is classified into Wire Bond and Die Attach, Flip Chip, and Fan-Out Wafer Level Packaging (FOWLP).
  • By Device, the market is classified into Power Management Integrated Circuit (PMIC), Microelectromechanical Systems (MEMS), RF Front-End, RF Power Amplifier, Baseband Processor, Application Processor, and Others.
  • By Application, the market is classified into Consumer Electronics, Industrial, Automotive & Transportation, Aerospace & Defense, Healthcare, and Others.
  • By Geography, the market is classified into Americas, Europe, Middle-East & Africa and Asia-Pacific.

Company Profiles

The report provides a detailed analysis of the competitors in the market. It covers the financial performance analysis for the publicly listed companies in the market. The report also offers detailed information on the companies' recent development and competitive scenario. Some of the companies covered in this report are Amkor Technology, ASE Group, Chipbond Technology, Chipmos Tech etc.

Countries Studied

America (Argentina, Brazil, Canada, Chile, Colombia, Mexico, Peru, United States, Rest of Americas)
Europe (Austria, Belgium, Denmark, Finland, France, Germany, Italy, Netherlands, Norway, Poland, Russia, Spain, Sweden, Switzerland, United Kingdom, Rest of Europe)
Middle-East and Africa (Egypt, Israel, Qatar, Saudi Arabia, South Africa, United Arab Emirates, Rest of MEA)
Asia-Pacific (Australia, Bangladesh, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Sri Lanka, Thailand, Taiwan, Rest of Asia-Pacific)

Competitive Quadrant

The report includes Competitive Quadrant, a proprietary tool to analyze and evaluate the position of companies based on their Industry Position score and Market Performance score. The tool uses various factors for categorizing the players into four categories. Some of these factors considered for analysis are financial performance over the last 3 years, growth strategies, innovation score, new product launches, investments, growth in market share, etc.

Ansoff Analysis

The report presents a detailed Ansoff matrix analysis for the Global System in Package Market. Ansoff Matrix, also known as Product/Market Expansion Grid, is a strategic tool used to design strategies for the growth of the company. The matrix can be used to evaluate approaches in four strategies viz. Market Development, Market Penetration, Product Development and Diversification. The matrix is also used for risk analysis to understand the risk involved with each approach.

The analyst analyses the Global System in Package Market using the Ansoff Matrix to provide the best approaches a company can take to improve its market position.

Based on the SWOT analysis conducted on the industry and industry players, The analyst has devised suitable strategies for market growth.

Why buy this report?

  • The report offers a comprehensive evaluation of the Global System in Package Market. The report includes in-depth qualitative analysis, verifiable data from authentic sources, and projections about market size. The projections are calculated using proven research methodologies.
  • The report has been compiled through extensive primary and secondary research. The primary research is done through interviews, surveys, and observation of renowned personnel in the industry.
  • The report includes an in-depth market analysis using Porter's 5 forces model and the Ansoff Matrix. In addition, the impact of Covid-19 on the market is also featured in the report.
  • The report also includes the regulatory scenario in the industry, which will help you make a well-informed decision. The report discusses major regulatory bodies and major rules and regulations imposed on this sector across various geographies.
  • The report also contains the competitive analysis using Positioning Quadrants, the analyst's Proprietary competitive positioning tool.

Report Highlights:

  • A complete analysis of the market, including parent industry
  • Important market dynamics and trends
  • Market segmentation
  • Historical, current, and projected size of the market based on value and volume
  • Market shares and strategies of key players
  • Recommendations to companies for strengthening their foothold in the market
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Frequently Asked Questions about the Global System in Package Market

What is the estimated value of the Global System in Package Market?

The Global System in Package Market was estimated to be valued at $12.14 Billion in 2022.

What is the growth rate of the Global System in Package Market?

The growth rate of the Global System in Package Market is 8.8%, with an estimated value of $18.57 Billion by 2027.

What is the forecasted size of the Global System in Package Market?

The Global System in Package Market is estimated to be worth $18.57 Billion by 2027.

Who are the key companies in the Global System in Package Market?

Key companies in the Global System in Package Market include Amkor Technology, ASE Group, Chipbond Technology, Chipmos Tech, Fujitsu, Jiangsu Changjiang Electronics Technology, Nanium, Powertech Technologies, Qualcomm and Renesas Electronics.

Table of Contents

1 Report Description
1.1 Study Objectives
1.2 Market Definition
1.3 Currency
1.4 Years Considered
1.5 Language
1.6 Key Stakeholders
2 Research Methodology
2.1 Research Process
2.2 Data Collection and Validation
2.2.1 Secondary Research
2.2.2 Primary Research
2.2.3 Models
2.3 Market Size Estimation
2.3.1 Bottom-Up Approach
2.3.2 Top-Down Approach
2.4 Assumptions of the Study
2.5 Limitations of the Study
3 Executive Summary
3.1 Introduction
3.2 Market Size, Segmentations and Outlook
4 Market Dynamics
4.1 Drivers
4.1.1 Growing Demand for Miniaturization Electronic Devices
4.1.2 Usage in Graphic Cards and Processors Used in Real-World Gaming
4.2 Restraints
4.2.1 Higher Level of Integration Leads to Thermal Issues
4.3 Opportunities
4.3.1 Potential Use of RF Components in Developing Advanced 5G Infrastructure
4.3.2 Boom in Portable Electronic Market and Increase in Popularity of Internet of Things (Iot)
4.4 Challenges
4.4.1 Effective Supply Chain Management
5 Market Analysis
5.1 Regulatory Scenario
5.2 Porter's Five Forces Analysis
5.3 Impact of COVID-19
5.4 Ansoff Matrix Analysis
6 Global System in Package Market, By Packaging Technology
6.1 Introduction
6.2 2D IC Packaging Technology
6.3 5D IC Packaging Technology
6.4 3D IC Packaging Technology
7 Global System in Package Market, By Package Type
7.1 Introduction
7.2 Ball Grid Array (BGA)
7.2.1 Plastic Ball Grid Array (PBGA)
7.2.2 Super Ball Grid Array (SBGA)
7.2.3 Fine Pitch Ball Grid Array (FBGA)
7.2.4 Flip Chip Ball Grid Array (FCBGA)
7.2.5 Others
7.3 Surface Mount Package
7.3.1 Land Grid Array (LGA)
7.3.2 Ceramic Column Grid Array (CCGA)
7.3.3 Other
8 Global System in Package Market, By Packaging Method
8.1 Introduction
8.2 Wire Bond and Die Attach
8.3 Flip Chip
8.4 Fan-Out Wafer Level Packaging (FOWLP)
9 Global System in Package Market, By Device
9.1 Introduction
9.2 Power Management Integrated Circuit (PMIC)
9.3 Microelectromechanical Systems (MEMS)
9.4 RF Front-End
9.5 RF Power Amplifier
9.6 Baseband Processor
9.7 Application Processor
9.8 Others
10 Global System in Package Market, By Application
10.1 Introduction
10.2 Consumer Electronics
10.3 Industrial
10.4 Automotive & Transportation
10.5 Aerospace & Defense
10.6 Healthcare
10.7 Others
11 Global System in Package Market, By
11.1 Introduction
12 Global System in Package Market, By
12.1 Introduction
13 Americas' Global System in Package Market
13.1 Introduction
13.2 Argentina
13.3 Brazil
13.4 Canada
13.5 Chile
13.6 Colombia
13.7 Mexico
13.8 Peru
13.9 United States
13.10 Rest of Americas
14 Europe's Global System in Package Market
14.1 Introduction
14.2 Austria
14.3 Belgium
14.4 Denmark
14.5 Finland
14.6 France
14.7 Germany
14.8 Italy
14.9 Netherlands
14.10 Norway
14.11 Poland
14.12 Russia
14.13 Spain
14.14 Sweden
14.15 Switzerland
14.16 United Kingdom
14.17 Rest of Europe
15 Middle East and Africa's Global System in Package Market
15.1 Introduction
15.2 Egypt
15.3 Israel
15.4 Qatar
15.5 Saudi Arabia
15.6 South Africa
15.7 United Arab Emirates
15.8 Rest of MEA
16 APAC's Global System in Package Market
16.1 Introduction
16.2 Australia
16.3 Bangladesh
16.4 China
16.5 India
16.6 Indonesia
16.7 Japan
16.8 Malaysia
16.9 Philippines
16.10 Singapore
16.11 South Korea
16.12 Sri Lanka
16.13 Thailand
16.14 Taiwan
16.15 Rest of Asia-Pacific
17 Competitive Landscape
17.1 Competitive Quadrant
17.2 Market Share Analysis
17.3 Strategic Initiatives
17.3.1 M&A and Investments
17.3.2 Partnerships and Collaborations
17.3.3 Product Developments and Improvements
18 Company Profiles
18.1 Amkor Technology
18.2 ASE Group
18.3 Chipbond Technology
18.4 Chipmos Tech
18.5 Fujitsu
18.6 Jiangsu Changjiang Electronics Technology
18.7 Nanium
18.8 Powertech Technologies
18.9 Qualcomm
18.10 Renesas Electronics
18.11 Samsung Electronics
18.12 SPIL
18.13 Stats Chippac
18.14 Toshiba
18.15 UTAC
19 Appendix
19.1 Questionnaire

Companies Mentioned

  • Amkor Technology
  • ASE Group
  • Chipbond Technology
  • Chipmos Tech
  • Fujitsu
  • Jiangsu Changjiang Electronics Technology
  • Nanium
  • Powertech Technologies
  • Qualcomm
  • Renesas Electronics
  • Samsung Electronics
  • SPIL
  • Stats Chippac
  • Toshiba
  • UTAC