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Global Semiconductor Packaging Materials Market Size, Trends and Growth Opportunity, By Packaging Material, By Wafer Material, By Technology, By End-User, By Region and Forecast to 2027.

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    Report

  • 166 Pages
  • September 2022
  • Region: Global
  • Qualiket Research
  • ID: 5655909
UP TO OFF until Jan 13th 2023
Global Semiconductor Packaging Materials Market Size, Trends and Growth Opportunity, By Packaging Material (Organic Substrate, Bonding Wire, Lead frame, Ceramic Package, Die Attach Material, Others), By Wafer Material (Simple Semiconductor, Compound Semiconductor), By Technology (Grid Array, Small Outline Package, Flat No-Leads Packages, Dual In-Line Package, Others), By End-User (Consumer Electronics, Automotive, Healthcare, IT and Telecommunication, Aerospace and Defence, Others), By Region and forecast till 2027.

Global Semiconductor Packaging Materials Market

Global Semiconductor Packaging Materials Market valued at USD 5,263.20 million in 2021 and would rocket up to USD 5,977 million by 2027 at a CAGR of 1.76% from 2022-2027.

An enclosure made of metal, plastic, glass, or ceramic typically houses one or more discrete semiconductor devices or integrated circuits is known as a semiconductor package. Before being divided into die, tested, and packaged, individual components are first generated on semiconductor wafers (often silicon). Materials for semiconductor packaging are used to shield integrated circuits from corrosion and damage (ICs). Bonding wires, solder balls, substrates, lead frames, encapsulants, and underfill components are some examples of frequently used materials. Semiconductor materials are lightweight, resistant to shock, and use less electricity. They are consequently widely utilised by the semiconductor companies.

Market Drivers

The demand for organic substrate is rising for semiconductor packaging. For exceptional electrical performance and excellent dependability, these materials are employed on the base layer of printed circuit boards (PCBs). The PCBs' overall weight is reduced and their dimensional control and functionality are improved by the organic substrate packaging materials. The market for semiconductor packaging materials is predicted to rise at a faster rate thanks to the rising demand for organic substrate material for semiconductor packaging. The market need for Internet of Things (IOT) is escalating as a result of expanding digitization, pushing up the demand for efficient packaging around the world and semiconductor packaging materials. The growing adoption of smart computing devices like laptops, mobile phones, e-readers, tablets, and smartphones in several developed and developing economies is expected to drive the growth for semiconductor packaging, which is expected to drive the growth of the semiconductor packaging materials market. To lower the use of plastic waste and shift toward the use of sustainable packaging for the packaging of semiconductor products, many e-commerce firms are working to implement sustainable packaging solutions. The semiconductor packaging materials market, which is prone to external effects and could benefit from better design to make packaging more robust, is also anticipated to be affected by this trend.

Making a powerful business case for semiconductor packaging materials with the potential to boost revenues and cut costs, technology development is integrated into packages. Due to the rapid evolution of semiconductor packaging design, technological developments in the market for semiconductor packaging materials are compelled to accelerate market expansion. As technology advances, the requirements for semiconductor packaging materials also advance and alter in accordance, providing favourable circumstances for the market's revenue expansion. The major driver of the market expansion for semiconductor packaging materials is innovation in the mobile industries. Additionally, the development of medical technologies such portable X-ray units, ultrasound machines, and patient monitors as well as the enhancement of the thermal performance of aircraft parts are significant potential that drive market expansion.

Market Restraints

The growth of the market for semiconductor packaging materials is hampered by fluctuations in the price of raw materials brought on by the covid-19 epidemic. The movement of raw materials was

significantly impacted by the pandemic's spread, which halted the market's expansion for semiconductor packaging materials.

Impact of COVID-19

Numerous organisations and industries have been impacted by the COVID-19 epidemic. This pandemic's effects have even had an impact on the size of the market for semiconductor packaging materials, which is a result of the automobile and electronic sectors' abrupt adjustments. A large number of electronic manufacturing hubs have temporarily stopped operations. The delivery of the goods has been hampered by the pandemic's lack of transportation and the manpower shortage. Additionally, the lack of raw materials had an impact on the expansion of the semiconductor packaging material market.

Market Segmentation

Global Semiconductor Packaging Materials Market is segmented into Packaging Material, Wafer Materials, Technology, End-User. By Packaging Material such as Organic Substrate, Bonding Wire, Lead frame, Ceramic Package, Die Attach Material, Others. By Wafer Materials such as Simple Semiconductor, Compound Semiconductor. By Technology such as Grid Array, Small Outline Package, Flat No-Leads Packages, Dual In-Line Package, Others. By End-User such as Consumer Electronics, Automotive, Healthcare, IT and Telecommunication, Aerospace and Defence, Others.

Regional Analysis

Global Semiconductor Packaging Materials Market is segmented into five regions North America, Latin America, Europe, Asia Pacific, and Middle East & Africa. Due to heavy investments in the semiconductor industry and rising regional demand for semiconductor packaging, North America currently controls the market for semiconductor packaging materials. Due to its fast industrialisation, the Asia-Pacific region will continue to forecast the greatest compound annual growth rate during the projected period.

Key Players

This report includes a list of numerous Key Players, namely Teledyne Technologies, SCHOTT, Amkor Technology, KYOCERA Corporation, Materion Corporation, Egide, SGA Technologies, Complete Hermetics, Special Hermetic Products Inc., Coat-X SA

Market Taxonomy

By Packaging Material

  • Organic Substrate
  • Bonding Wire
  • Lead frame
  • Ceramic Package
  • Die Attach Material
  • Others.

By Wafer Materials

  • Simple Semiconductor
  • Compound Semiconductor.

By Technology

  • Grid Array
  • Small Outline Package
  • Flat No-Leads Packages
  • Dual In-Line Package
  • Others.

By End-User

  • Consumer Electronics
  • Automotive
  • Healthcare
  • IT and Telecommunication
  • Aerospace and Defence
  • Others.

By Region

  • North America
  • Latin America
  • Europe
  • Asia Pacific
  • Middle East & Africa.
Frequently Asked Questions about the Global Semiconductor Packaging Materials Market

What is the estimated value of the Global Semiconductor Packaging Materials Market?

The Global Semiconductor Packaging Materials Market was estimated to be valued at $5263.2 Million in 2021.

What is the growth rate of the Global Semiconductor Packaging Materials Market?

The growth rate of the Global Semiconductor Packaging Materials Market is 1.7%, with an estimated value of $5977 Million by 2027.

What is the forecasted size of the Global Semiconductor Packaging Materials Market?

The Global Semiconductor Packaging Materials Market is estimated to be worth $5977 Million by 2027.

Who are the key companies in the Global Semiconductor Packaging Materials Market?

Key companies in the Global Semiconductor Packaging Materials Market include Teledyne Technologies, SCHOTT, Amkor Technology, KYOCERA Corporation, Materion Corporation, Egide, SGA Technologies, Complete Hermetics and Coat.

Table of Contents

1 Introduction
1.1 Objective of the Study
1.2 Market definition
1.3 Market Scope
2 Research Methodology
2.1 Data Mining
2.2 Validation
2.3 Primary Interviews
2.4 List of Data Sources
3 Executive Summary
4 Global Semiconductor Packaging Materials Market Outlook
4.1 Overview
4.2 Market Dynamics
4.2.1 Drivers
4.2.2 Restraints
4.2.3 Opportunities
4.3 Porters Five Force Model
4.4 Value Chain Analysis
5 Global Semiconductor Packaging Materials Market, By Packaging Material
5.1 Y-o-Y Growth Comparison, By Packaging Material
5.2 Global Semiconductor Packaging Materials Market Share Analysis, By Packaging Material
5.3 Global Semiconductor Packaging Materials Market Size and Forecast, By Packaging Material
5.3.1 Organic Substrate
5.3.2 Bonding Wire
5.3.3 Lead frame
5.3.4 Ceramic Package
5.3.5 Die Attach Material
5.3.6 Others.
6 Global Semiconductor Packaging Materials Market, By Wafer Materials
6.1 Y-o-Y Growth Comparison, By Wafer Materials
6.2 Global Semiconductor Packaging Materials Market Share Analysis, By Wafer Materials
6.3 Global Semiconductor Packaging Materials Market Size and Forecast, By Wafer Materials
6.3.1 Simple Semiconductor
6.3.2 Compound Semiconductor.
7 Global Semiconductor Packaging Materials Market, By Technology
7.1 Y-o-Y Growth Comparison, By Technology
7.2 Global Semiconductor Packaging Materials Market Share Analysis, By Technology
7.3 Global Semiconductor Packaging Materials Market Size and Forecast, By Technology
7.3.1 Grid Array
7.3.2 Small Outline Package
7.3.3 Flat No-Leads Packages
7.3.4 Dual In-Line Package
7.3.5 Others.
8 Global Semiconductor Packaging Materials Market, By End-User
8.1 Y-O-Y Growth Comparison, By End-User
8.2 Global Semiconductor Packaging Materials Market Share Analysis, By End-User
8.3 Global Semiconductor Packaging Materials Market Size and Forecast, By End-User
8.3.1 Consumer Electronics
8.3.2 Automotive
8.3.3 Healthcare
8.3.4 IT and Telecommunication
8.3.5 Aerospace and Defence
8.3.6 Others.
9 Global Semiconductor Packaging Materials Market, By Region
9.1 Global Semiconductor Packaging Materials Market Share Analysis, By Region
9.2 Global Semiconductor Packaging Materials Market Share Analysis, By Region
9.3 Global Semiconductor Packaging Materials Market Size and Forecast, By Region
10 North America Semiconductor Packaging Materials Market Analysis and Forecast (2022-2027)
10.1 Introduction
10.2 North America Semiconductor Packaging Materials Market Share Analysis, By Packaging Material
10.3 North America Semiconductor Packaging Materials Market Size and Forecast, By Wafer Materials
10.4 North America Semiconductor Packaging Materials Market Size and Forecast, By Technology
10.5 North America Semiconductor Packaging Materials Market Size and Forecast, By End-User
10.6 North America Semiconductor Packaging Materials Market Size and Forecast, By Country
10.6.1 U.S.
10.6.2 Canada
10.6.3 Mexico
11 Europe Semiconductor Packaging Materials Market Analysis and Forecast (2022-2027)
11.1 Introduction
11.2 Europe Semiconductor Packaging Materials Market Share Analysis, By Packaging Material
11.3 Europe Semiconductor Packaging Materials Market Size and Forecast, By Wafer Materials
11.4 Europe Semiconductor Packaging Materials Market Size and Forecast, By Technology
11.5 Europe Semiconductor Packaging Materials Market Size and Forecast, By End-User
11.6 Europe Semiconductor Packaging Materials Market Size and Forecast, By Country
11.6.1 Germany
11.6.2 France
11.6.3 UK
11.6.4. Rest of Europe
12 Asia Pacific Semiconductor Packaging Materials Market Analysis and Forecast (2022-2027)
12.1 Introduction
12.2 Asia Pacific Semiconductor Packaging Materials Market Share Analysis, By Packaging Material
12.3 Asia Pacific Semiconductor Packaging Materials Market Size and Forecast, By Wafer Materials
12.4 Asia Pacific Semiconductor Packaging Materials Market Size and Forecast, By Technology
12.5 Asia Pacific Semiconductor Packaging Materials Market Size and Forecast, By End-User
12.6 Asia Pacific Semiconductor Packaging Materials Market Size and Forecast, By Country
12.6.1 China
12.6.2 Japan
12.6.3 India
12.6.4. Rest of Asia Pacific
13 Latin America Semiconductor Packaging Materials Market Analysis and Forecast (2022-2027)
13.1 Introduction
13.2 Latin America Semiconductor Packaging Materials Market Share Analysis, By Packaging Material
13.3 Latin America Semiconductor Packaging Materials Market Size and Forecast, By Wafer Materials
13.4 Latin America Semiconductor Packaging Materials Market Size and Forecast, By Technology
13.5 Latin America Semiconductor Packaging Materials Market Size and Forecast, By End-User
13.6 Latin America Semiconductor Packaging Materials Market Size and Forecast, Country
13.6.1. Brazil
13.6.2. Rest of Latin America
14 Middle East Semiconductor Packaging Materials Market Analysis and Forecast (2022-2027)
14.1 Introduction
14.2 Middle East Semiconductor Packaging Materials Market Share Analysis, By Packaging Material
14.3 Middle East Semiconductor Packaging Materials Market Size and Forecast, By Wafer Materials
14.4 Middle East Semiconductor Packaging Materials Market Size and Forecast, By Technology
14.5 Middle East Semiconductor Packaging Materials Market Size and Forecast, By End-User
14.6 Middle East Semiconductor Packaging Materials Market Size and Forecast, By Country
14.6.1. Saudi Arabia
14.6.2. UAE
14.6.3. Egypt
14.6.4. Kuwait
14.6.5. South Africa
15 Competitive Analysis
15.1 Competition Dashboard
15.2 Market share Analysis of Top Vendors
15.3 Key Development Strategies
16 Company Profiles
16.1 Teledyne Technologies
16.1.1 Overview
16.1.2 Offerings
16.1.3 Key Financials
16.1.4 Business Segment & Geographic Overview
16.1.5 Key Market Developments
16.1.6 Key Strategies
16.2 SCHOTT
16.2.1 Overview
16.2.2 Offerings
16.2.3 Key Financials
16.2.4 Business Segment & Geographic Overview
16.2.5 Key Market Developments
16.2.6 Key Strategies
16.3 Amkor Technology
16.3.1 Overview
16.3.2 Offerings
16.3.3 Key Financials
16.3.4 Business Segment & Geographic Overview
16.3.5 Key Market Developments
16.3.6 Key Strategies
16.4 KYOCERA Corporation
16.4.1 Overview
16.4.2 Offerings
16.4.3 Key Financials
16.4.4 Business Segment & Geographic Overview
16.4.5 Key Market Developments
16.4.6 Key Strategies
16.5 Materion Corporation
16.5.1 Overview
16.6.2 Offerings
16.5.3 Key Financials
16.5.4 Business Segment & Geographic Overview
16.5.5 Key Market Developments
16.5.6 Key Strategies
16.6 Egide
16.6.1 Overview
16.6.2 Offerings
16.6.3 Key Financials
16.6.4 Business Segment & Geographic Overview
16.6.5 Key Market Developments
16.6.6 Key Strategies
16.7 SGA Technologies
16.7.1 Overview
16.7.2 Offerings
16.7.3 Key Financials
16.7.4 Business Segment & Geographic Overview
16.7.5 Key Market Developments
16.7.6 Key Strategies
16.8 Complete Hermetics
16.8.1 Overview
16.8.2 Offerings
16.8.3 Key Financials
16.8.4 Business Segment & Geographic Overview
16.8.5 Key Market Developments
16.8.6 Key Strategies
16.9 Special Hermetic Products Inc
16.9.1 Overview
16.9.2 Offerings
16.9.3 Key Financials
16.9.4 Business Segment & Geographic Overview
16.9.5 Key Market Developments
16.9.6 Key Strategies
16.10 Coat-X SA
16.10.1 Overview
16.10.2 Offerings
16.10.3 Key Financials
16.10.4 Business Segment & Geographic Overview
16.10.5 Key Market Developments
16.10.6 Key Strategies

Companies Mentioned

  • Teledyne Technologies
  • SCHOTT
  • Amkor Technology
  • KYOCERA Corporation
  • Materion Corporation
  • Egide
  • SGA Technologies
  • Complete Hermetics
  • Special Hermetic Products Inc.
  • Coat-X SA