Environmental Stress Screening - Its Quantification, Optimization and Management

  • ID: 689864
  • Book
  • Region: Global
  • 548 Pages
  • DEStech Publications, Inc
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With the growth of the electronics industry, environmental stress screening (ESS) has become an essential tool for the production of failure-free electronic assemblies, modules and systems. This handbook provides a thorough introduction and guide to ESS methods and applications. Numerous case histories illustrate practical uses of ESS.

The authors cover the theoretical aspects of environmental stress screening thoroughly, including: history and evolution of the field; definitions and related concepts; and various types of environmental stress screening.


- Up-to-date military standards and directives

- Handy guides and tables

- Dynamic procedures and tailoring techniques

- Case histories from government and industry

- FORTRAN programs for environmental stress screening
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Problems and reference sections are included in each chapter.


Chapter 1 - Introduction
- Why ESS?
- How ESS Works?
- What This Book Offers?

Chapter 2 - Historical Perspective of ESS

Chapter 3 - ESS Definitions, Basic Concepts and Common Misconceptions
- What Is ESS?
- Definitions and Acronyms of Frequently Used Terms in ESS
- Common Misconceptions about ESS

Chapter 4 - ESS Types and Their Effectiveness
- Flaw-Stimulus Relationships
- ESS Types
- Screen Parameters
- Popularity and Effectiveness of ESS Types
- Advantages of Temperature Cycling

Chapter 5 - ESS Standards and Documents for Electronic Assemblies
- Background
- An Updated Overview

Chapter 6 - The Statistical Quantification and Optimization Of ESS
- Introduction
- Assumptions
- Part Level Screening
- System Level Screening
- Two-Level Screening: The Life-Cycle Cost Model
- Bayesian Approach to ESS
- Comments
- Appendix 6a
- Appendix 6b

Chapter 7 - Physical Quantification of ESS by Thermal Cycling
- The Arrhenius Model and Its Pitfalls
- Modification and Parameter Estimation of the Acceleration Factor Equation
- Temperature Profile and the Model for the Acceleration Factor
- Equivalent Acceleration Factor Evaluation Using Eq. (7.26)
- Equivalent Acceleration Factor Evaluation Using Eq. (7.27)
- Application of the Aging Acceleration Models
- Optimum Number of Thermal Cycles for a Specified Field MTBF Goal
- A Summary of Some Useful Thermal Fatigue Life Prediction Models for Electronic Equipment
- Conclusions
- Appendix 7a
- Appendix 7b

Chapter 8 - Physical Quantification and Optimization of ESS by Random Vibration
- Introduction
- Fundamental Theory of a Random Process
- Failure Due To Random Vibration and Structural Reliability Evaluation
- Obtain the Stress Response PSD Function from Finite Element Analysis

Chapter 9 - ESS by Combined Environmentsâ€""Thermal Cycling and Random Vibration
- Introduction
- The Thermal Fatigue Life Model
- The Random Vibration Fatigue Life Model
- Combined Reliability Analysis
- Optimum Screening Strategy

Chapter 10 - ESS by Applying Multiple Stresses
- Aging Acceleration under Multiple-Stresses Effect Dependency Test
- Of Combined Stresses
- An Economic Model for Optimum Stress Regimen Determination for a Multiple-Stress Assembly-Level Stress Screen
- Comments

Chapter 11 - Screening Strength and the Related Empirical Equations in ESS
- Definition of Screening Strength
- Screening Strength under Different Screening Stresses
- Average Defect Failure Rate Estimation under Different Screening Stresses
- Model Applicability

Chapter 12 - ESS Planning
- Introduction
- Establishment of the Remaining Defect Density Objectives
- Incoming Defect Density Estimation
- Screening Parameter Selection
- Screening Strength
- Test Detection Efficiency
- Test Strength
- Procedure for Quantification Selection
- Economic Optimization of ESS Planning

Chapter 13 - Tailoring Technique in ESS
- The Mechanics of Tailoring
- Stress Response Survey
- Tailoring Of Environmental Stresses

Chapter 14 - Monitoring, Control and Evaluation of ESS
- Introduction
- Data Collection and Failure Classification
- Monitoring and Control in the Screening Process
- Evaluation for the Screening Process

Chapter 15 - An Application Of DOD-Hdbk-344 In Developing A Closed-Loop Dynamic ESS Program
- Introduction
- Product Description
- Closed-Loop ESS Process
- Incoming Defect Prediction
- Screening Selection and Placement
- Data Collection
- Data Analysis and Process Monitoring
- Failure Cause Investigation and Corrective Actions
- Conclusions

Chapter 16 - ESS Case Histories
- ESS in the Apollo Space Program
- ESS on New Printers in IBM
- ESS on Switching Logic Units at Lockheed
- American Airlines ESS Demonstration
- Power Supply Random Vibration Stress Screening at Zytec
- Thermal Cycling Screening of a Spacecraft at Hughes
- ESS on Shipboard Militarized Digital Computer
- Random Vibration of an Airborne Digital Computer
- Random Vibration Screen of an Advanced Signal Processor
- Thermal Cycling Screening on Airborne Radar Module
- Strife Test Program in Hewlett-Packard
- Strife Testing At Zytec Helps the Company Win Baldrige
- Cost Effectiveness of ESS Demonstrated At Robins Air Force Base
- Random Vibration Screening Of Militarized Avionic Computers at IBM
- ESS of A High-Density Surface Mount Circuit Card At At&T Little Rock
- Automated ESS Optimization for U.S. Army Electronic Hardware
- ESS As Applied To a New Computer

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