- Language: English
- 269 Pages
- Published: February 2014
- Region: China, Global
Opportunities in the Supply Chain for High-Speed Electronics, 2012-2018
- ID: 2726804
- December 2013
- BPA Consulting
A Strategic Review of PCB, Material and Interconnect on Trends and Needs for Electronic Assemblies for High-Speed Telecom, Datacom Networks and High-End Computers Over the Period 2012 to 2018.
STUDY BACKGROUND AND SCOPE
The demand for greater bandwidth for cloud computing, video streaming, mobile TV and internet is driving a requirement for greater bandwidth and higher data transmission rates across all network infrastructure systems.
BPA has reviewed the technological drivers for key systems in the high speed data and telecommunication networking market to identify the features that will impact on the requirements and specifications for printed circuits boards, IC packaging, interconnection and associated assembly, materials and processing.
The 2013 High Speed Report explores the implications for IC packaging and interconnection technologies, markets and the supply chain. This report is for strategists and business managers keen to develop current and future business opportunities. Key issues reviewed in this study will improve your understanding and help your company to succeed in the high-speed interconnection and packaging and their ancillary materials requirements:
High speed technology trends over the next five years
Winning technologies and protocols
Key players in the supply chain
Current and future market opportunities
PCB, advanced IC packaging and materials market size and forecasts for 2012-2018 including:
- Forecast Demand for Low-Loss Laminates for Routers, Servers and Base Stations
- Demand for High-End Routers
- Demand for High-Speed Digital PCBs and Low Loss Laminate for Routers
- Worldwide Server Shipment Forecast
- Demand for PCBs and Low Loss for Servers
- Worldwide Demand for Base Stations
- Worldwide Demand for Base Station Transceivers
- Demand for Low-Loss Laminate for Wireless Base Stations
- Forecast Demand for HSD PCBs for Network Infrastructure Equipment
- Worldwide Demand for Opto-PCBs
- Transceiver Modules Worldwide Demand
- Worldwide Demand for Advanced Flip Chip Substrates for High-Speed Systems
- 400GE networks have been roadmapped as the next step up from 100GE. This will drive a doubling of channel data rates from 25Gbps to 50Gbps
- 16G Fibre Channel in the data storage arena will be followed by an upgrade to 32Gbps in 2014. This is being challenged by 40G FC over Ethernet
- The copper and fibre interface continues to change. Silicon photonics is an emerging key enabler for high speed interfaces.
- 4G/LTE wireless communication is driving the development of more compact, intelligent and flexible base stations.
- Convergence of satellite and terrestrial mobile communications
- Low loss, low CTE build-up solutions and silicon substrates for packaging high speed semiconductors.
- This study provides a totally integrated assessment of the high speed electronics value chain
- Identification and quantification of the opportunities for small, medium and large technology vendors
- Comprehensive roadmaps detailing the technologies, materials and processes that will be needed to participate in these markets
- Identifies key technology and market drivers of this major market sector SHOW LESS READ MORE >
HIGH-SPEED SYSTEM ARCHITECTURE AND MARKET DRIVERS
Standard System Architectures
Proprietary System Architectures
High-End Routers and Switches
Optical Transport Equipment
Data Storage and Network Switch
Wireless Base Station
Military and Aerospace
Trace Geometry and Copper Skin Effect
Connectors, Vias and PTH
Laminate Key Attributes
High Dk Materials and Distributed Capacitance
Assembly and Test
Test Standards and Systems
Conclusions and Implications
ADVANCED SEMICONDUCTOR PACKAGING
Network Processor Unit (NPU)
PHY (Physical Interface Layer)
Substrate Constructions for IC Packages
Multilayer Build-Up Substrates
Coreless Substrate Constructions
Substrate Technology Trade-Offs
Semiconductor and Package Test
Optical Backplane Technologies
Embedded Waveguide Formation
Embedded Polymer Waveguide Materials
Chip to Board Optical Coupling
Chip-to-Chip Optical Interconnect
Optical Transceiver Modules
Transponders and Transceivers
Parallel Optical Transceivers
Opto-PCB Technology Roadmap
Computer and Datacom
Market for Low-Loss PCBs and Laminates in the Data and Telecom Sector
Automotive Distance Sensors
Other Markets for Low-Loss Laminate
Advanced Flip Chip Substrates
CONCLUSION & OPPORTUNITIES
The 2013 edition of this report as before explores the implications for the next generation of high speed electronic architectures and the supply chain as data rates shift up.
In network infrastructure, systems supporting 100G Ethernet are emerging and serial transmission rates are more than doubling from 10Gbps to >20Gbps. The next generation of standards will tackle 400G and the solutions for this will require 40-50Gbps serial data. These and high performance computing requirements, will be the factors which will drive more widespread adoption of optical backplanes and silicon photonics when signal integrity, interconnect density and thermal management budgets cannot be realised with printed circuit boards.
In the wireless communication sector, the introduction and advancement of 4G technology will have implications for base station and transceiver design. New generations of eNodeB base stations are more compact in size, more intelligent and more flexible in performance as base station controllers are no longer required and an access network comprises several base stations connected to each other and directly accessing a gateway to the backbone network.
These and other applications are considered in the new High Speed Report which includes technology roadmaps for high performance system architectures, a detailed looked at the high performance laminates which are available for the next generation of systems, and forecast of PCB and laminate demand out to 2018.