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Opportunities in the Supply Chain for High-Speed Electronics, 2012-2018 Product Image

Opportunities in the Supply Chain for High-Speed Electronics, 2012-2018

  • Published: December 2013
  • BPA Consulting

A Strategic Review of PCB, Material and Interconnect on Trends and Needs for Electronic Assemblies for High-Speed Telecom, Datacom Networks and High-End Computers Over the Period 2012 to 2018.

STUDY BACKGROUND AND SCOPE

The demand for greater bandwidth for cloud computing, video streaming, mobile TV and internet is driving a requirement for greater bandwidth and higher data transmission rates across all network infrastructure systems.

BPA has reviewed the technological drivers for key systems in the high speed data and telecommunication networking market to identify the features that will impact on the requirements and specifications for printed circuits boards, IC packaging, interconnection and associated assembly, materials and processing.

The 2013 High Speed Report explores the implications for IC packaging and interconnection technologies, markets and the supply chain. This report is for strategists and business managers keen to develop current and future business opportunities. Key issues reviewed in this study will improve your understanding and help your company to succeed in the high-speed interconnection and packaging and their ancillary materials READ MORE >

INTRODUCTION
Introduction
Background
Research Methodology

HIGH-SPEED SYSTEM ARCHITECTURE AND MARKET DRIVERS
Introduction
Standard System Architectures
Proprietary System Architectures
High-End Routers and Switches
Optical Transport Equipment
High-End Servers
Data Storage and Network Switch
Wireless Base Station
Military and Aerospace
Automotive

HIGH-SPEED SUBSTRATES
Introduction
Trace Geometry and Copper Skin Effect
Impedance Control
Compensation Techniques
Connectors, Vias and PTH
Laminate Key Attributes
Low-Loss Laminates
Price Factor
High Dk Materials and Distributed Capacitance
PCB Design
Environmental Issues
Assembly and Test
Lead-Free Assembly
Test Standards and Systems
Conclusions and Implications

ADVANCED SEMICONDUCTOR PACKAGING
Introduction
Network Processor Unit (NPU)
FPGA
PHY (Physical Interface Layer)
Switching ASICs
Substrate Constructions for IC Packages
Multilayer Build-Up Substrates
Coreless Substrate Constructions
Silicon Interposers
Substrate Technology Trade-Offs
Enabling Technologies
Semiconductor and Package Test
Conclusions

OPTICAL INTERCONNECT
Introduction
Optical Backplane Technologies
Embedded Waveguide Formation
Embedded Polymer Waveguide Materials
Chip to Board Optical Coupling
Board-to-Board Opto-Coupling
Chip-to-Chip Optical Interconnect
Silicon Photonics
Carbon Nanophotonics
Optical Transceiver Modules
Transponders and Transceivers
Parallel Optical Transceivers
Opto-PCB Technology Roadmap
Summary

MARKET FORECASTS
Introduction
Computer and Datacom
Telecom
Market for Low-Loss PCBs and Laminates in the Data and Telecom Sector
Automotive Distance Sensors
Other Markets for Low-Loss Laminate
Opto-PCBs
Transceiver Modules
Advanced Flip Chip Substrates

CONCLUSION & OPPORTUNITIES

The 2013 edition of this report as before explores the implications for the next generation of high speed electronic architectures and the supply chain as data rates shift up.

In network infrastructure, systems supporting 100G Ethernet are emerging and serial transmission rates are more than doubling from 10Gbps to >20Gbps. The next generation of standards will tackle 400G and the solutions for this will require 40-50Gbps serial data. These and high performance computing requirements, will be the factors which will drive more widespread adoption of optical backplanes and silicon photonics when signal integrity, interconnect density and thermal management budgets cannot be realised with printed circuit boards.

In the wireless communication sector, the introduction and advancement of 4G technology will have implications for base station and transceiver design. New generations of eNodeB base stations are more compact in size, more intelligent and more flexible in performance as base station controllers are no longer required and an access network comprises several base stations connected to each other and directly accessing a gateway to the backbone network.

These and other applications are considered in the new High Speed Report which includes technology roadmaps for high performance system architectures, a detailed looked at the high performance laminates which are available for the next generation of systems, and forecast of PCB and laminate demand out to 2018.

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