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Asia Pacific ASIC Chip Market Size, Share & Trends Analysis Report By Type (Semi- custom ASIC, Full custom ASIC, and Programmable ASIC), By End User, By Country and Growth Forecast, 2023 - 2030

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    Report

  • 122 Pages
  • March 2024
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 4900395
The Asia Pacific ASIC Chip Market would witness market growth of 8.6% CAGR during the forecast period (2023-2030).

The China market dominated the Asia Pacific ASIC Chip Market by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $3,623.4 million by 2030. The Japan market is experiencing a CAGR of 7.8% during (2023 - 2030). Additionally, The India market would exhibit a CAGR of 9.2% during (2023 - 2030).



In the ever-changing field of semiconductor technology, application-specific integrated circuits (ASICs) have become a crucial component for driving various electronic devices and systems. As the need for tailored and efficient solutions rises across different industries, the market has experienced notable expansion and development. The versatility of ASICs extends across a broad spectrum of application domains, each harnessing the specialized capabilities of these chips to address unique challenges. One of the prominent areas of application is the telecommunications industry, where ASICs power critical components such as base stations, routers, and network switches. The demand for high-speed data processing and efficient packet switching in the era of 5G networks propels the integration of ASICs into the heart of telecommunications infrastructure.

Moreover, ASICs play a pivotal role in the automotive sector, contributing to developing advanced driver assistance systems (ADAS), autonomous vehicles, and in-vehicle entertainment systems. Their ability to handle complex algorithms with low latency aligns perfectly with real-time processing requirements in automotive applications. ASICs are instrumental in powering the sophisticated features of ADAS. These systems encompass a range of safety and convenience functions, including adaptive cruise control, lane departure warning, collision avoidance, and automated emergency braking. ASICs, with their tailored design, enable efficient processing of the algorithms involved in real-time sensor data analysis, allowing vehicles to respond quickly to changing road conditions.

In addition, India has witnessed significant growth in its telecom network, especially with the proliferation of mobile devices and the increasing demand for high-speed data services. This expansion has led to a growing need for specialized ASICs in various network elements, such as base stations, routers, and switches. As per the data released in 2023 from Invest India, the telecom industry is one of the most important sectors in the Indian economy, with a 6.5% contribution to the country’s GDP. In the last quarter of FY 2022-2023, the industry’s gross revenue was INR 85,356 Cr ($11.38 Bn). Hence, the expanding telecom and medical device sectors in the Asia Pacific will assist in the growth of the regional market.

Based on Type, the market is segmented into Semi- custom ASIC, Full custom ASIC, and Programmable ASIC. Based on End User, the market is segmented into Data Processing Systems, Telecommunication Systems, Aerospace Subsystem & Sensors, Consumer Electronics, Medical Instrumentation, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Taiwan, Malaysia, and Rest of Asia Pacific.

List of Key Companies Profiled

  • Advanced Micro Devices, Inc.
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • ON Semiconductor Corporation
  • Taiwan Semiconductor Manufacturing Company Limited
  • NVIDIA Corporation
  • Intel Corporation
  • Infineon Technologies AG
  • Texas Instruments, Inc.
  • Seiko Epson Corporation
  • BITMAIN Technologies Holding Company

Market Report Segmentation

By Type
  • Semi- custom ASIC
  • Full custom ASIC
  • Programmable ASIC
By End User
  • Data Processing Systems
  • Telecommunication Systems
  • Aerospace Subsystem & Sensors
  • Consumer Electronics
  • Medical Instrumentation
  • Others
By Country
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific ASIC Chip Market, by Type
1.4.2 Asia Pacific ASIC Chip Market, by End User
1.4.3 Asia Pacific ASIC Chip Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.2.3 Market Opportunities
3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
4.1 Cardinal Matrix
4.2 Recent Industry Wide Strategic Developments
4.2.1 Partnerships, Collaborations and Agreements
4.2.2 Product Launches and Product Expansions
4.2.3 Acquisition and Mergers
4.3 Market Share Analysis, 2022
4.4 Top Winning Strategies
4.4.1 Key Leading Strategies: Percentage Distribution (2019-2023)
4.4.2 Key Strategic Move: (Partnerships, Collaborations & Agreements: 2024, Feb - 2019, Feb) Leading Players
4.5 Porter Five Forces Analysis
Chapter 5. Asia Pacific ASIC Chip Market by Type
5.1 Asia Pacific Semi- custom ASIC Market by Country
5.2 Asia Pacific Full custom ASIC Market by Country
5.3 Asia Pacific Programmable ASIC Market by Country
Chapter 6. Asia Pacific ASIC Chip Market by End User
6.1 Asia Pacific Data Processing Systems Market by Country
6.2 Asia Pacific Telecommunication Systems Market by Country
6.3 Asia Pacific Aerospace Subsystem & Sensors Market by Country
6.4 Asia Pacific Consumer Electronics Market by Country
6.5 Asia Pacific Medical Instrumentation Market by Country
6.6 Asia Pacific Others Market by Country
Chapter 7. Asia Pacific ASIC Chip Market by Country
7.1 China ASIC Chip Market
7.1.1 China ASIC Chip Market by Type
7.1.2 China ASIC Chip Market by End User
7.2 Japan ASIC Chip Market
7.2.1 Japan ASIC Chip Market by Type
7.2.2 Japan ASIC Chip Market by End User
7.3 India ASIC Chip Market
7.3.1 India ASIC Chip Market by Type
7.3.2 India ASIC Chip Market by End User
7.4 South Korea ASIC Chip Market
7.4.1 South Korea ASIC Chip Market by Type
7.4.2 South Korea ASIC Chip Market by End User
7.5 Taiwan ASIC Chip Market
7.5.1 Taiwan ASIC Chip Market by Type
7.5.2 Taiwan ASIC Chip Market by End User
7.6 Malaysia ASIC Chip Market
7.6.1 Malaysia ASIC Chip Market by Type
7.6.2 Malaysia ASIC Chip Market by End User
7.7 Rest of Asia Pacific ASIC Chip Market
7.7.1 Rest of Asia Pacific ASIC Chip Market by Type
7.7.2 Rest of Asia Pacific ASIC Chip Market by End User
Chapter 8. Company Profiles
8.1 Advanced Micro Devices, Inc.
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research & Development Expenses
8.1.5 Recent strategies and developments:
8.1.5.1 Product Launches and Product Expansions:
8.1.5.2 Acquisition and Mergers:
8.1.6 SWOT Analysis
8.2 Samsung Electronics Co., Ltd. (Samsung Group)
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 Recent strategies and developments:
8.2.4.1 Partnerships, Collaborations, and Agreements:
8.2.5 SWOT Analysis
8.3 ON Semiconductor Corporation
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Segmental and Regional Analysis
8.3.4 Research & Development Expense
8.3.5 Recent strategies and developments:
8.3.5.1 Partnerships, Collaborations, and Agreements:
8.3.5.2 Acquisition and Mergers:
8.3.6 SWOT Analysis
8.4 Taiwan Semiconductor Manufacturing Company Limited
8.4.1 Company overview
8.4.2 Financial Analysis
8.4.3 Regional Analysis
8.4.4 Research & Development Expenses
8.4.5 SWOT Analysis
8.5 NVIDIA Corporation
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Segmental and Regional Analysis
8.5.4 Research & Development Expenses
8.5.5 Recent strategies and developments:
8.5.5.1 Acquisition and Mergers:
8.6 Intel Corporation
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expenses
8.6.5 Recent strategies and developments:
8.6.5.1 Partnerships, Collaborations, and Agreements:
8.6.5.2 Product Launches and Product Expansions:
8.6.5.3 Acquisition and Mergers:
8.6.6 SWOT Analysis
8.7 Infineon Technologies AG
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.7.5 Recent strategies and developments:
8.7.5.1 Partnerships, Collaborations, and Agreements:
8.7.5.2 Product Launches and Product Expansions:
8.7.5.3 Acquisition and Mergers:
8.7.6 SWOT Analysis
8.8 Texas Instruments, Inc.
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Segmental and Regional Analysis
8.8.4 Research & Development Expense
8.8.5 SWOT Analysis
8.9 Seiko Epson Corporation
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Segmental and Regional Analysis
8.9.4 Research & Development Expenses
8.9.5 SWOT Analysis
8.10. BITMAIN Technologies Holding Company
8.10.1 Company Overview
8.10.2 Recent strategies and developments:
8.10.2.1 Partnerships, Collaborations, and Agreements:
8.10.2.2 Product Launches and Product Expansions:
8.10.3 SWOT Analysis

Companies Mentioned

  • Advanced Micro Devices, Inc.
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • ON Semiconductor Corporation
  • Taiwan Semiconductor Manufacturing Company Limited
  • NVIDIA Corporation
  • Intel Corporation
  • Infineon Technologies AG
  • Texas Instruments, Inc.
  • Seiko Epson Corporation
  • BITMAIN Technologies Holding Company

Methodology

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