The Asia Pacific Board-to-Board Connectors Market should witness market growth of 6.3% CAGR during the forecast period (2023-2030). In the year 2021, the Asia Pacific market's volume surged to 706.2 million units, showcasing a growth of 2.8% (2019-2022).
The market for BTB connectors has a bright future owing to the technological breakthroughs that have been made. The market for BTB connectors is expected to increase due to the major industry players' significant investments and marketing tactics. Moreover, the need for ecologically friendly Board-to-board Connector options has risen as energy efficiency and sustainability become increasingly crucial. Market participants now have significant incentives to build cutting-edge, long-lasting board-to-board connectors.
Board-to-board connectors are made to connect two PCBs together without cables. Pitch, or the distance between connector pins, is available in various sizes for BTB connectors. Sizes of pitches range from 0.8 mm to 5.8 mm. Smaller pitches indicate a smaller connector size. Additionally, the board-to-board connectors with smaller dimensions have a low current carrying capacity. Additionally, board-to-board connectors are available in several orientations, including horizontal, U-shape, perpendicular, and parallel.
The Pacific region has witnessed significant demand for the electric vehicle due to rising EV sales, particularly in China. China is both the world's largest customer and manufacturer of electric vehicles. Regional interests are supported by goals of public policy, constructive regulations, and concerns about neighbourhood air quality. The first and largest fleets of electric taxis and buses in the world are found in Shenzhen. Increasing sales of electric vehicles are anticipated to increase demand for board-to-board connectors in the APAC region throughout the projected period.
The China market dominated the Asia Pacific Board-to-Board Connectors Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $1,935.3 million by 2030. The Japan market is showcasing a CAGR of 5.6% during (2023-2030). Additionally, India's market would register a CAGR of 7% during (2023-2030).
Based on Type, the market is segmented into Pin Headers (Stacked Header, and Shrouded Header), and Socket. Based on Pitch, the market is segmented into 1 mm to 2 mm, Greater Than 2 mm, and Less Than 1 mm. Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial Automation, Healthcare, Telecommunication, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Amphenol Corporation, TE Connectivity Ltd., Molex, LLC (Koch Industries, Inc.), Kyocera Corporation, HARTING Technology Group, Omron Corporation, Japan Aviation Electronics Industry, Limited, Hirose Electric Co., Ltd, Samtec, FIT Hon Teng Limited (Foxconn (Far East) Limited).
The market for BTB connectors has a bright future owing to the technological breakthroughs that have been made. The market for BTB connectors is expected to increase due to the major industry players' significant investments and marketing tactics. Moreover, the need for ecologically friendly Board-to-board Connector options has risen as energy efficiency and sustainability become increasingly crucial. Market participants now have significant incentives to build cutting-edge, long-lasting board-to-board connectors.
Board-to-board connectors are made to connect two PCBs together without cables. Pitch, or the distance between connector pins, is available in various sizes for BTB connectors. Sizes of pitches range from 0.8 mm to 5.8 mm. Smaller pitches indicate a smaller connector size. Additionally, the board-to-board connectors with smaller dimensions have a low current carrying capacity. Additionally, board-to-board connectors are available in several orientations, including horizontal, U-shape, perpendicular, and parallel.
The Pacific region has witnessed significant demand for the electric vehicle due to rising EV sales, particularly in China. China is both the world's largest customer and manufacturer of electric vehicles. Regional interests are supported by goals of public policy, constructive regulations, and concerns about neighbourhood air quality. The first and largest fleets of electric taxis and buses in the world are found in Shenzhen. Increasing sales of electric vehicles are anticipated to increase demand for board-to-board connectors in the APAC region throughout the projected period.
The China market dominated the Asia Pacific Board-to-Board Connectors Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $1,935.3 million by 2030. The Japan market is showcasing a CAGR of 5.6% during (2023-2030). Additionally, India's market would register a CAGR of 7% during (2023-2030).
Based on Type, the market is segmented into Pin Headers (Stacked Header, and Shrouded Header), and Socket. Based on Pitch, the market is segmented into 1 mm to 2 mm, Greater Than 2 mm, and Less Than 1 mm. Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial Automation, Healthcare, Telecommunication, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Amphenol Corporation, TE Connectivity Ltd., Molex, LLC (Koch Industries, Inc.), Kyocera Corporation, HARTING Technology Group, Omron Corporation, Japan Aviation Electronics Industry, Limited, Hirose Electric Co., Ltd, Samtec, FIT Hon Teng Limited (Foxconn (Far East) Limited).
Scope of the Study
By Type (Volume, Million Units, USD Million, 2019-2030)
- Pin Headers
- Stacked Header
- Shrouded Header
- Socket
By Pitch (Volume, Million Units, USD Million, 2019-2030)
- 1 mm to 2 mm
- Greater Than 2 mm
- Less Than 1 mm
By Application (Volume, Million Units, USD Million, 2019-2030)
- Consumer Electronics
- Automotive
- Industrial Automation
- Healthcare
- Telecommunication
- Others
By Country (Volume, Million Units, USD Million, 2019-2030)
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- Amphenol Corporation
- TE Connectivity Ltd.
- Molex, LLC (Koch Industries, Inc.)
- Kyocera Corporation
- HARTING Technology Group
- Omron Corporation
- Japan Aviation Electronics Industry, Limited
- Hirose Electric Co., Ltd
- Samtec
- FIT Hon Teng Limited (Foxconn (Far East) Limited)
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- Exhaustive coverage
- The highest number of Market tables and figures
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- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 4. Competition Analysis - Global
Chapter 5. Asia Pacific Board-to-Board Connectors Market by Type
Chapter 6. Asia Pacific Board-to-Board Connectors Market by Pitch
Chapter 7. Asia Pacific Board-to-Board Connectors Market by Application
Chapter 8. Asia Pacific Board-to-Board Connectors Market by Country
Chapter 9. Company Profiles
Companies Mentioned
- Amphenol Corporation
- TE Connectivity Ltd.
- Molex, LLC (Koch Industries, Inc.)
- Kyocera Corporation
- HARTING Technology Group
- Omron Corporation
- Japan Aviation Electronics Industry, Limited
- Hirose Electric Co., Ltd
- Samtec
- FIT Hon Teng Limited (Foxconn (Far East) Limited)
Methodology
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