+353-1-416-8900REST OF WORLD
+44-20-3973-8888REST OF WORLD
1-917-300-0470EAST COAST U.S
1-800-526-8630U.S. (TOLL FREE)

Asia Pacific Data Center Chip Market Size, Share & Industry Trends Analysis Report By Chip Type (GPU, ASIC, FPGA, CPU, and Others), By Vertical, By Data Center Size (Large, and Small & Medium Size), By Country and Growth Forecast, 2023 - 2030

  • PDF Icon

    Report

  • 191 Pages
  • August 2023
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5887029
The Asia Pacific Data Center Chip Market should witness market growth of 13.8% CAGR during the forecast period (2023-2030). In the year 2021, the Asia Pacific market's volume surged to 275.5 thousand units, showcasing a growth of 5.3% (2019-2022).

Data centers, and consequently data center chips, demand has surged because more businesses are moving their workloads to the cloud. Deployment of CPUs intended for cloud workloads, such as Intel's Xeon Scalable and AMD's EPYC processors, has increased. Demand for data center CPUs with cutting-edge designs and technology will increase since high performance computing (HPC) applications demand high processing power and efficiency. Long-term growth potential for these chips producers is predicted to be enhanced by their capacity to produce high-performance CPUs that meet the demands of HPC applications.

The performance of data center chips is remarkable for demanding applications like artificial intelligence, machine learning, and data analytics. As data centers consume massive quantities of power, energy efficiency is crucial; therefore, these chips are designed with advanced technology and power management features to minimize operational costs and environmental impact.

In addition, continuous technological advances, including introducing the five-nanometer process for semiconductor manufacturing, have contributed to the industry's optimistic outlook. Leading manufacturers are optimizing costs by tailoring systems to their unique business needs, accelerating the adoption of these processors. In addition, market leaders' extensive research and development (R&D) efforts are additional factors contributing to the market's growth.

The market is expected to expand rapidly in the Asia Pacific region due to rising data traffic and the need for data centre deployment in economically developing nations, including China and India. The market is experiencing an increase in the number of businesses and a shift toward digitalizing all processes. The government initiatives Digital India, Make in India, and smart cities, as well as the expansion of the internet and the strong resurgence of growth-related projects across various verticals are all contributing to the increase in data centres in India. The growth of the hyperscale clouds in the Tokyo and Osaka markets has fuelled Japan's transformation into a more global market. The market growth is projected due to the region's increasing number of data centres.

The China market dominated the Asia Pacific Data Center Chip Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $2,328 million by 2030. The Japan market is poised to grow at a CAGR of 13.1% during (2023-2030). Additionally, India's market should witness a CAGR of 14.5% during (2023-2030).

Based on Chip Type, the market is segmented into GPU, ASIC, FPGA, CPU, and Others. Based on Vertical, the market is segmented into BFSI, Manufacturing, Telecom & IT, Government, Retail, Transportation, Energy & Utilities, and Others. Based on Data Center Size, the market is segmented into Large, and Small & Medium Size. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Advanced Micro Devices, Inc., Arm Limited, Broadcom, Inc., GLOBALFOUNDRIES Inc., Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.), Intel Corporation, NVIDIA Corporation, Samsung Electronics Co., Ltd. (Samsung Group), Taiwan Semiconductor Manufacturing Company Limited, and Qualcomm, Inc.

Scope of the Study

By Chip Type (Volume, Thousand Units, USD Million, 2019-2030)

  • GPU
  • ASIC
  • FPGA
  • CPU
  • Others

By Vertical (Volume, Thousand Units, USD Million, 2019-2030)

  • BFSI
  • Manufacturing
  • Telecom & IT
  • Government
  • Retail
  • Transportation
  • Energy & Utilities
  • Others

By Data Center Size (Volume, Thousand Units, USD Million, 2019-2030)

  • Large
  • Small & Medium Size

By Country (Volume, Thousand Units, USD Million, 2019-2030)

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Key Market Players

List of Companies Profiled in the Report:

  • Advanced Micro Devices, Inc.
  • Arm Limited
  • Broadcom, Inc.
  • GLOBALFOUNDRIES Inc.
  • Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
  • Intel Corporation
  • NVIDIA Corporation
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • Taiwan Semiconductor Manufacturing Company Limited
  • Qualcomm, Inc.

Unique Offerings

  • Exhaustive coverage
  • The highest number of Market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Data Center Chip Market, by Chip Type
1.4.2 Asia Pacific Data Center Chip Market, by Vertical
1.4.3 Asia Pacific Data Center Chip Market, by Data Center Size
1.4.4 Asia Pacific Data Center Chip Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
Chapter 4. Competition Analysis - Global
4.1 KBV Cardinal Matrix
4.2 Recent Industry Wide Strategic Developments
4.2.1 Partnerships, Collaborations and Agreements
4.2.2 Product Launches and Product Expansions
4.2.3 Acquisition and Mergers
4.2.4 Geographical Expansions
4.3 Market Share Analysis, 2022
4.4 Top Winning Strategies
4.4.1 Key Leading Strategies: Percentage Distribution (2019-2023)
4.4.2 Key Strategic Move: (Product Launches and Product Expansions: 2021, Dec - 2023, Jun) Leading Players
4.5 Porter’s Five Forces Analysis
Chapter 5. Asia Pacific Data Center Chip Market by Chip Type
5.1 Asia Pacific GPU Market by Country
5.2 Asia Pacific ASIC Market by Country
5.3 Asia Pacific FPGA Market by Country
5.4 Asia Pacific CPU Market by Country
5.5 Asia Pacific Others Market by Country
Chapter 6. Asia Pacific Data Center Chip Market by Vertical
6.1 Asia Pacific BFSI Market by Country
6.2 Asia Pacific Manufacturing Market by Country
6.3 Asia Pacific Telecom & IT Market by Country
6.4 Asia Pacific Government Market by Country
6.5 Asia Pacific Retail Market by Country
6.6 Asia Pacific Transportation Market by Country
6.7 Asia Pacific Energy & Utilities Market by Country
6.8 Asia Pacific Others Market by Country
Chapter 7. Asia Pacific Data Center Chip Market by Data Center Size
7.1 Asia Pacific Large Market by Country
7.2 Asia Pacific Small & Medium Size Market by Country
Chapter 8. Asia Pacific Data Center Chip Market by Country
8.1 China Data Center Chip Market
8.1.1 China Data Center Chip Market by Chip Type
8.1.2 China Data Center Chip Market by Vertical
8.1.3 China Data Center Chip Market by Data Center Size
8.2 Japan Data Center Chip Market
8.2.1 Japan Data Center Chip Market by Chip Type
8.2.2 Japan Data Center Chip Market by Vertical
8.2.3 Japan Data Center Chip Market by Data Center Size
8.3 India Data Center Chip Market
8.3.1 India Data Center Chip Market by Chip Type
8.3.2 India Data Center Chip Market by Vertical
8.3.3 India Data Center Chip Market by Data Center Size
8.4 South Korea Data Center Chip Market
8.4.1 South Korea Data Center Chip Market by Chip Type
8.4.2 South Korea Data Center Chip Market by Vertical
8.4.3 South Korea Data Center Chip Market by Data Center Size
8.5 Singapore Data Center Chip Market
8.5.1 Singapore Data Center Chip Market by Chip Type
8.5.2 Singapore Data Center Chip Market by Vertical
8.5.3 Singapore Data Center Chip Market by Data Center Size
8.6 Malaysia Data Center Chip Market
8.6.1 Malaysia Data Center Chip Market by Chip Type
8.6.2 Malaysia Data Center Chip Market by Vertical
8.6.3 Malaysia Data Center Chip Market by Data Center Size
8.7 Rest of Asia Pacific Data Center Chip Market
8.7.1 Rest of Asia Pacific Data Center Chip Market by Chip Type
8.7.2 Rest of Asia Pacific Data Center Chip Market by Vertical
8.7.3 Rest of Asia Pacific Data Center Chip Market by Data Center Size
Chapter 9. Company Profiles
9.1 Advanced Micro Devices, Inc.
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Research & Development Expenses
9.1.5 Recent strategies and developments:
9.1.5.1 Product Launches and Product Expansions:
9.1.5.2 Acquisition and Mergers:
9.1.6 SWOT Analysis
9.2 Arm Limited (SoftBank Group Corp.)
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental Analysis
9.2.4 Recent strategies and developments:
9.2.4.1 Partnerships, Collaborations, and Agreements:
9.2.4.2 Product Launches and Product Expansions:
9.2.5 SWOT Analysis
9.3 Broadcom, Inc.
9.3.1 Company Overview
9.3.2 Financial Analysis
9.3.3 Segmental and Regional Analysis
9.3.4 Research & Development Expense
9.3.5 Recent strategies and developments:
9.3.5.1 Partnerships, Collaborations, and Agreements:
9.3.5.2 Product Launches and Product Expansions:
9.3.6 SWOT Analysis
9.4 GLOBALFOUNDRIES Inc.
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Regional Analysis
9.4.4 Research & Development Expenses
9.4.5 Recent strategies and developments:
9.4.5.1 Partnerships, Collaborations, and Agreements:
9.4.6 SWOT Analysis
9.5 Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
9.5.1 Company Overview
9.5.2 Financial Analysis
9.5.3 Segmental and Regional Analysis
9.5.4 Research & Development Expense
9.5.5 Recent strategies and developments:
9.5.5.1 Partnerships, Collaborations, and Agreements:
9.5.5.2 Product Launches and Product Expansions:
9.5.6 SWOT Analysis
9.6 Intel Corporation
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Segmental and Regional Analysis
9.6.4 Research & Development Expenses
9.6.5 Recent strategies and developments:
9.6.5.1 Partnerships, Collaborations, and Agreements:
9.6.5.2 Product Launches and Product Expansions:
9.6.6 SWOT Analysis
9.7 NVIDIA Corporation
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Segmental and Regional Analysis
9.7.4 Research & Development Expenses
9.7.5 Recent strategies and developments:
9.7.5.1 Partnerships, Collaborations, and Agreements:
9.7.5.2 Product Launches and Product Expansions:
9.7.6 SWOT Analysis
9.8 Samsung Electronics Co., Ltd. (Samsung Group)
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Recent strategies and developments:
9.8.4.1 Partnerships, Collaborations, and Agreements:
9.8.4.2 Product Launches and Product Expansions:
9.8.5 SWOT Analysis
9.9 Taiwan Semiconductor Manufacturing Company Limited
9.9.1 Company overview
9.9.2 Financial Analysis
9.9.3 Regional Analysis
9.9.4 Research & Development Expenses
9.9.5 Recent strategies and developments:
9.9.5.1 Geographical Expansions:
9.9.6 SWOT Analysis
9.10. Qualcomm, Inc.
9.10.1 Company Overview
9.10.2 Financial Analysis
9.10.3 Segmental and Regional Analysis
9.10.4 Research & Development Expense
9.10.5 Recent strategies and developments:
9.10.5.1 Partnerships, Collaborations, and Agreements:
9.10.5.2 Product Launches and Product Expansions:
9.10.5.3 Acquisition and Mergers:
9.10.6 SWOT Analysis

Companies Mentioned

  • Advanced Micro Devices, Inc.
  • Arm Limited
  • Broadcom, Inc.
  • GLOBALFOUNDRIES Inc.
  • Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
  • Intel Corporation
  • NVIDIA Corporation
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • Taiwan Semiconductor Manufacturing Company Limited
  • Qualcomm, Inc.

Methodology

Loading
LOADING...