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Computer-on-Module Market - Global Forecast 2025-2032

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    Report

  • 186 Pages
  • November 2025
  • Region: Global
  • 360iResearch™
  • ID: 6014739
UP TO OFF until Jan 01st 2026
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Computer-on-Module solutions are redefining how organizations approach embedded and edge computing by enabling rapid, scalable hardware deployment and reduced engineering complexity. As verticals demand faster innovation and improved adaptability, these modular solutions streamline design and future-proof technology investments for decision-makers.

Market Snapshot: Growth and Opportunities in the Computer-on-Module Market

The Computer-on-Module market is on an upward growth trajectory, driven by increasing demand for adaptable embedded computing platforms across industrial automation, telecom, medical devices, and IoT applications. This sector is evolving amid changing connectivity standards, rising edge intelligence requirements, and shifts in global supply chain strategies. Organizations are leveraging Computer-on-Module platforms to accelerate deployment cycles, optimize performance for diverse workloads, and respond quickly to evolving technology trends.

Scope & Segmentation of the Market

  • Type: Includes Arm-based modules for power efficiency and x86-based modules featuring both AMD and Intel architectures for high-performance needs.
  • Form Factor: Covers COM Express variants (Type 6, Type 7), ETX and XTX for different application footprints, and highly compact formats like Qseven and SMARC designed for mobile and portable devices.
  • Application: Encompasses sectors such as automotive, consumer electronics, defense and aerospace, industrial automation, IoT gateways, medical devices, and telecom solutions.
  • Connectivity: Integrates options including Bluetooth, Wi-Fi, Ethernet, and multi-generation cellular protocols (4G, 5G) for scalable data transmission.
  • Operating Temperature: Supports commercial, extended, and industrial-grade modules for deployment in standard and extreme environments.
  • Distribution Channel: Channels include direct sales, authorized distributors, and online marketplaces, ensuring broad accessibility for system integrators and OEMs.
  • Region:
    • Americas: Serves North America’s technology-driven manufacturing landscape and Latin America's expanding electronics ecosystem.
    • Europe, Middle East & Africa: Addresses Western European regulatory needs, Middle Eastern infrastructure modernization, and Africa’s emerging communication and energy markets.
    • Asia-Pacific: Covers China, India, Japan, and Southeast Asia’s rapidly digitizing manufacturing base and focuses on cost-efficient, large-scale module adoption.
  • Technology Providers: Advantech Co., Ltd., Kontron AG, Congatec AG, SECO S.p.A., Toradex AG, DFI Inc., Avalue Technology Inc., iWave Systems Technologies Pvt. Ltd., Nexcom International Co., Ltd., iBASE Technology Inc.

Key Takeaways for Decision-Makers

  • Modular computing streamlines system design, allowing faster rollouts and easy upgrades as technology evolves.
  • Support for both Arm and x86 architectures lets organizations match modules directly to their unique performance and power needs.
  • Enhanced flexibility means the same platform can be rapidly adapted for use in sectors from industrial automation to healthcare and telecom.
  • Plug-and-play integration of new features, like AI inferencing and advanced connectivity, minimizes downtime and engineering effort.
  • Standardized modules support long-term lifecycle management and help mitigate risks from component obsolescence or supply chain disruption.

Tariff Impact on Supply Chains and Cost Structures

Recent United States tariff adjustments have increased input costs for key electronic components used in Computer-on-Module manufacturing. In response, manufacturers are diversifying sourcing strategies across multiple regions, adopting more localized supply chains, and optimizing component usage. These changes have accelerated advances in packaging and thermal design, enhancing supply chain resilience and allowing competitive pricing despite economic pressures.

Methodology & Data Sources

This report draws on a blend of primary interviews with technical stakeholders and extensive secondary research, including product documentation and quantitative shipment data analyses. Scenario modeling and sensitivity testing underpin the reliability and relevance of all market insights.

Why This Report Matters

  • Helps technology leaders benchmark modular computing strategies and align investment with market trajectory.
  • Provides actionable insights for managing risks related to tariffs, sourcing challenges, and regulatory compliance.
  • Enables informed decisions regarding architecture, partner selection, and emerging technology integration within the embedded and edge computing space.

Conclusion

With modular architectures becoming central to embedded solutions, organizations equipped with detailed market insights can accelerate innovation, optimize system integration, and achieve lasting competitive edge in a dynamic technology landscape.

 

Additional Product Information:

  • Purchase of this report includes 1 year online access with quarterly updates.
  • This report can be updated on request. Please contact our Customer Experience team using the Ask a Question widget on our website.

Table of Contents

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders
2. Research Methodology
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Growing adoption of AI accelerator-equipped computer-on-modules for real-time edge inferencing in robotics
5.2. Rapid expansion of secure enclave and TPM integration in system-on-modules for industrial IoT security
5.3. Rising demand for ARM-based low-power computer-on-modules in battery-powered medical and wearable devices
5.4. Surge in modular edge computing solutions supporting PCIe Gen5 and CXL standards for high-bandwidth applications
5.5. Increased focus on functional safety certification and automotive AEC-Q100 compliance for ADAS computer-on-modules
5.6. Development of ruggedized computer-on-modules certified for extreme temperature and vibration in oil and gas exploration
5.7. Growing preference for heterogeneous computing modules combining CPU GPU and FPGA fabrics for AI inference at the edge
5.8. Emphasis on sustainable design and RoHS REACH compliance in computer-on-module manufacturing and lifecycle management
6. Cumulative Impact of United States Tariffs 2025
7. Cumulative Impact of Artificial Intelligence 2025
8. Computer-on-Module Market, by Type
8.1. Arm
8.2. X86
8.2.1. AMD
8.2.2. Intel
9. Computer-on-Module Market, by Form Factor
9.1. Com Express
9.1.1. Type 6
9.1.2. Type 7
9.2. Etx/Xtx
9.2.1. Etx
9.2.2. Xtx
9.3. Qseven
9.4. Smarc
10. Computer-on-Module Market, by Application
10.1. Automotive
10.2. Consumer Electronics
10.3. Defense & Aerospace
10.4. Industrial Automation
10.5. IoT Gateways
10.6. Medical
10.7. Telecom
11. Computer-on-Module Market, by Connectivity
11.1. Bluetooth
11.2. Cellular
11.2.1. 4G
11.2.2. 5G
11.3. Ethernet
11.4. Wi-Fi
12. Computer-on-Module Market, by Operating Temperature
12.1. Commercial
12.2. Extended
12.3. Industrial
13. Computer-on-Module Market, by Distribution Channel
13.1. Direct Sales
13.2. Distributors
13.3. Online
14. Computer-on-Module Market, by Region
14.1. Americas
14.1.1. North America
14.1.2. Latin America
14.2. Europe, Middle East & Africa
14.2.1. Europe
14.2.2. Middle East
14.2.3. Africa
14.3. Asia-Pacific
15. Computer-on-Module Market, by Group
15.1. ASEAN
15.2. GCC
15.3. European Union
15.4. BRICS
15.5. G7
15.6. NATO
16. Computer-on-Module Market, by Country
16.1. United States
16.2. Canada
16.3. Mexico
16.4. Brazil
16.5. United Kingdom
16.6. Germany
16.7. France
16.8. Russia
16.9. Italy
16.10. Spain
16.11. China
16.12. India
16.13. Japan
16.14. Australia
16.15. South Korea
17. Competitive Landscape
17.1. Market Share Analysis, 2024
17.2. FPNV Positioning Matrix, 2024
17.3. Competitive Analysis
17.3.1. Advantech Co., Ltd.
17.3.2. Kontron AG
17.3.3. Congatec AG
17.3.4. SECO S.p.A.
17.3.5. Toradex AG
17.3.6. DFI Inc.
17.3.7. Avalue Technology Inc.
17.3.8. iWave Systems Technologies Pvt. Ltd.
17.3.9. Nexcom International Co., Ltd.
17.3.10. iBASE Technology Inc.

Companies Mentioned

The companies profiled in this Computer-on-Module market report include:
  • Advantech Co., Ltd.
  • Kontron AG
  • Congatec AG
  • SECO S.p.A.
  • Toradex AG
  • DFI Inc.
  • Avalue Technology Inc.
  • iWave Systems Technologies Pvt. Ltd.
  • Nexcom International Co., Ltd.
  • iBASE Technology Inc.

Table Information