The global dicing tapes market was valued at $1,311.6 million in 2021, and is projected to reach $2,366.0 million by 2031, registering a CAGR of 6.0% from 2022 to 2031. Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or module microfabrication.
The demand for semiconductor is due to multiple utilization for various electronic unit is on a rapid increase. In addition, the lower cost of raw materials for manufacturing dicing tapes is leading to lower price of such components which boosts its adoption in the market.
However, because of the warfare between the U.S and China, electronic industry has affected the North American market. On the other side, the evolution of light weighted electronic components for designing lean electronic gadgets is expected to provide a new beginning in the market.
The dicing tapes market is segmented on the basis of thickness, product, material, and region. By thickness, the dicing tapes market is fragmented into below 85 micron, 86 and 125 micron, between 126 and 150 micron and above 150 micron. By product, the market is categorized into UV curable and non-UV curable. By material, the market is divided into polyvinyl chloride, polyethylene terephthalate and polyolefin. By region, the dicing tapes market is analyzed across North America (the U.S., Canada, and Mexico), Europe (Germany, the UK, France, Italy, and rest of Europe), Asia-Pacific (China, India, Japan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).
The major players profiled in the dicing tapes market report include 3M Company, AI Technology, Inc., Daest Coating India Pvt. Ltd., Denka Company Limited, Furukawa Electric Co. Ltd., Hitachi Chemical Company, Ltd., LINTEC Corporation, Loadpoint, Mitsui Chemicals, Inc., Nippon Pulse Motor Taiwan, Nitto Denko Corp, Pantech Tape Co. Ltd., QES GROUP BERHAD, Shenzhen Xinst Technology Co., Ltd, Solar Plus Company, Sumitomo Bakelite Co. Ltd. and Ultron Systems, Inc.
The demand for semiconductor is due to multiple utilization for various electronic unit is on a rapid increase. In addition, the lower cost of raw materials for manufacturing dicing tapes is leading to lower price of such components which boosts its adoption in the market.
However, because of the warfare between the U.S and China, electronic industry has affected the North American market. On the other side, the evolution of light weighted electronic components for designing lean electronic gadgets is expected to provide a new beginning in the market.
The dicing tapes market is segmented on the basis of thickness, product, material, and region. By thickness, the dicing tapes market is fragmented into below 85 micron, 86 and 125 micron, between 126 and 150 micron and above 150 micron. By product, the market is categorized into UV curable and non-UV curable. By material, the market is divided into polyvinyl chloride, polyethylene terephthalate and polyolefin. By region, the dicing tapes market is analyzed across North America (the U.S., Canada, and Mexico), Europe (Germany, the UK, France, Italy, and rest of Europe), Asia-Pacific (China, India, Japan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).
The major players profiled in the dicing tapes market report include 3M Company, AI Technology, Inc., Daest Coating India Pvt. Ltd., Denka Company Limited, Furukawa Electric Co. Ltd., Hitachi Chemical Company, Ltd., LINTEC Corporation, Loadpoint, Mitsui Chemicals, Inc., Nippon Pulse Motor Taiwan, Nitto Denko Corp, Pantech Tape Co. Ltd., QES GROUP BERHAD, Shenzhen Xinst Technology Co., Ltd, Solar Plus Company, Sumitomo Bakelite Co. Ltd. and Ultron Systems, Inc.
KEY BENEFITS FOR STAKEHOLDERS
- This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the dicing tapes market analysis from 2021 to 2031 to identify the prevailing dicing tapes market opportunities.
- The market research is offered along with information related to key drivers, restraints, and opportunities.
- Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
- In-depth analysis of the dicing tapes market segmentation assists to determine the prevailing market opportunities.
- Major countries in each region are mapped according to their revenue contribution to the global market.
- Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
- The report includes the analysis of the regional as well as global dicing tapes market trends, key players, market segments, application areas, and market growth strategies.
Key Market Segments
By Thickness
- Below 85 Micron
- 86-125 Micron
- 126-150 Micron
- Above 150 Micron
By Product
- UV Curable
- Non UV Curable
By Material
- Polyethylene Terephthalate
- Polyolefin
- Polyvinyl Chloride
By Region
- North America
- U.S.
- Canada
- Mexico
- Europe
- Germany
- UK
- France
- Italy
- Rest of Europe
- Asia-Pacific
- China
- Japan
- South Korea
- India
- Rest of Asia-Pacific
- LAMEA
- Latin America
- Middle East
- Africa
Key Market Players
- 3M Company
- ai technology, inc.
- Daest Coating India Pvt. Ltd.
- Denka Company Limited
- Furukawa Electric Co. Ltd.
- Hitachi Chemical Company, Ltd.
- LINTEC Corporation
- Loadpoint
- Mitsui Chemicals, Inc.
- Nippon Pulse Motor Taiwan
- Nitto Denko Corp.
- Pantech Tape Co. Ltd.
- QES GROUP BERHAD
- Shenzhen Xinst Technology Co., Ltd.
- Solar Plus Company
- Sumitomo Bakelite Co. Ltd.
- Ultron Systems, Inc.
Table of Contents
CHAPTER 1: INTRODUCTION
CHAPTER 2: EXECUTIVE SUMMARY
CHAPTER 3: MARKET OVERVIEW
CHAPTER 4: DICING TAPES MARKET, BY THICKNESS
CHAPTER 5: DICING TAPES MARKET, BY PRODUCT
CHAPTER 6: DICING TAPES MARKET, BY MATERIAL
CHAPTER 7: DICING TAPES MARKET, BY REGION
CHAPTER 8: COMPANY LANDSCAPE
CHAPTER 9: COMPANY PROFILES
List of Tables
List of Figures
Executive Summary
According to the report, titled, “Dicing Tapes Market," the dicing tapes market size was valued at $1.3 billion in 2021, and is estimated to reach $2.4 billion by 2031, growing at a CAGR of 6% from 2022 to 2031.Dicing tapes are used for dicing which is a process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing with a dicing saw or by laser cutting. All methods are typically automated to ensure precision and accuracy.The dicing tapes offer unique high temperature capability, better expandability, stability, and better peel strength which is growing its adoption for electronic devices manufacturing applications. However, the electronic market in North America is affected due to trade war between China and the U.S. that has resulted in decrease in sales of dicing tapes and China is the major exporter of dicing tapes in the U.S. that has affected the dicing tapes market growth.
On the contrary, the evolution of smaller electronic components for designing the light weighted electronic products is expected to offer new dicing tapes market opportunities.
COVID-19 is a disease caused by a newly discovered virus named Coronavirus. Many people are suffering from Coronavirus disease throughout the globe. Various major players in the global dicing tapes market had to stop their business production due to lockdown implemented in countries such as the U.S., China, Brazil, and others. This stop in business activities has directly impacted the sales of dicing tapes industry manufacturers. For instance, Alstom SA registered a decline of 17.7% in revenue in September 2020. Also, lack of man power and raw material has halted the supply chain of dicing tapes and electronic components. However, the introduction of vaccines for coronavirus disease and the re-initiation of production facilities is anticipated to provide lucrative opportunities for the dicing tapes players.
Region wise, the global dicing tapes market analysis is conducted across North America (the U.S., Canada, and Mexico), Europe (the UK, France, Germany, Italy, and Rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and Rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa). Europe region is expected to dominate the market throughout the study period.
The major players profiled in the dicing tapes market report include 3M Company, AI Technology, Inc., Daest Coating India Pvt. Ltd., Denka Company Limited, Furukawa Electric Co. Ltd., Hitachi Chemical Company, Ltd., LINTEC Corporation, Loadpoint, Mitsui Chemicals, Inc., Nippon Pulse Motor Taiwan, Nitto Denko Corp, Pantech Tape Co. Ltd., QES GROUP BERHAD, Shenzhen Xinst Technology Co., Ltd, Solar Plus Company, Sumitomo Bakelite Co. Ltd. and Ultron Systems, Inc.
Key Findings of the Study
- The report provides an extensive analysis of the current and emerging global dicing tapes market trends and dynamics.
- By thickness, the between 86 and 125 micron segment was the largest revenue generator in 2021.
- By product, the UV curable segment generated the highest revenue in 2021.
- By material, the polyvinyl chloride segment generated the highest revenue in 2021.
- Region wise, Asia-Pacific is anticipated to dominate the global dicing tapes market share throughout the study period.
- The report provides an extensive analysis of the global dicing tapes market trends and emerging opportunities of the market.
- The global dicing tapes market forecast analysis from 2022 to 2031 is included in the report.
Companies Mentioned
- 3M Company
- Ai Technology, Inc.
- Daest Coating India Pvt. Ltd.
- Denka Company Limited
- Furukawa Electric Co. Ltd.
- Hitachi Chemical Company, Ltd.
- Lintec Corporation
- Loadpoint
- Mitsui Chemicals, Inc.
- Nippon Pulse Motor Taiwan
- Nitto Denko Corp.
- Pantech Tape Co. Ltd.
- Qes Group Berhad
- Shenzhen Xinst Technology Co. Ltd.
- Solar Plus Company
- Sumitomo Bakelite Co. Ltd.
- Ultron Systems, Inc.
Methodology
The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.
They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.
They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:
- Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
- Scientific and technical writings for product information and related preemptions
- Regional government and statistical databases for macro analysis
- Authentic news articles and other related releases for market evaluation
- Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast
Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.
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Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 240 |
| Published | August 2022 |
| Forecast Period | 2021 - 2031 |
| Estimated Market Value ( USD | $ 1311.6 million |
| Forecasted Market Value ( USD | $ 2366 million |
| Compound Annual Growth Rate | 6.1% |
| Regions Covered | Global |
| No. of Companies Mentioned | 17 |
