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Global ESD Foam Packaging Market (2022-2027) by Material & Additive, End-User, Geography, Competitive Analysis and the Impact of Covid-19 with Ansoff Analysis

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  • 191 Pages
  • June 2022
  • Region: Global
  • Infogence Global Research
  • ID: 5635665
UP TO OFF until Dec 31st 2023

The market has a high demand for Electrical and Electronics, Manufacturing, Automobiles, Defense and Military, and Other Industry

The Global ESD Foam Packaging Market is estimated to be USD 258.94 Mn in 2022 and is expected to reach USD 375.21 Mn by 2027, growing at a CAGR of 7.7%.

Market Dynamics

Market dynamics are forces that impact the prices and behaviors of the Global ESD Foam Packaging Market stakeholders. These forces create pricing signals which result from the changes in the supply and demand curves for a given product or service. Forces of Market Dynamics may be related to macro-economic and micro-economic factors. There are dynamic market forces other than price, demand, and supply. Human emotions can also drive decisions, influence the market, and create price signals. As the market dynamics impact the supply and demand curves, decision-makers aim to determine the best way to use various financial tools to stem various strategies for speeding the growth and reducing the risks.

Market Segmentations

The Global ESD Foam Packaging Market is segmented based on Material & Additive, End-User, and Geography.
  • By Material & Additive, the market is classified into Conductive Polymer and Dissipative Polymer.
  • By End-User, the market is classified into Aerospace & Defense, Automobile, Electrical and Electronics, and Manufacturing.
  • By Geography, the market is classified into Americas, Europe, Middle-East & Africa and Asia-Pacific.

Company Profiles

The report provides a detailed analysis of the competitors in the market. It covers the financial performance analysis for the publicly listed companies in the market. The report also offers detailed information on the companies' recent development and competitive scenario. Some of the companies covered in this report are 3M Company, Botron Company, Inc., Conductive Containers, Inc., Desco Industries, Inc., Elcom Ltd., Electrotek Static Controls Pvt. Ltd., ESD Goods, GWP Group Ltd., Helios Packaging, Index Packaging, Inc., Nefab AB, Quality Foam Packaging, Inc., Sasi Polypack, Sealed Air Corp, Statclean Technology (s) Pte Ltd., Tekin Ltd., etc.

Countries Studied

  • America (Argentina, Brazil, Canada, Chile, Colombia, Mexico, Peru, United States, Rest of Americas)
  • Europe (Austria, Belgium, Denmark, Finland, France, Germany, Italy, Netherlands, Norway, Poland, Russia, Spain, Sweden, Switzerland, United Kingdom, Rest of Europe)
  • Middle-East and Africa (Egypt, Israel, Qatar, Saudi Arabia, South Africa, United Arab Emirates, Rest of MEA)
  • Asia-Pacific (Australia, Bangladesh, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Sri Lanka, Thailand, Taiwan, Rest of Asia-Pacific)

Competitive Quadrant

The report includes Competitive Quadrant, a proprietary tool to analyze and evaluate the position of companies based on their Industry Position score and Market Performance score. The tool uses various factors for categorizing the players into four categories. Some of these factors considered for analysis are financial performance over the last 3 years, growth strategies, innovation score, new product launches, investments, growth in market share, etc.

Ansoff Analysis

The report presents a detailed Ansoff matrix analysis for the Global ESD Foam Packaging Market. Ansoff Matrix, also known as Product/Market Expansion Grid, is a strategic tool used to design strategies for the growth of the company. The matrix can be used to evaluate approaches in four strategies viz. Market Development, Market Penetration, Product Development and Diversification. The matrix is also used for risk analysis to understand the risk involved with each approach. The analyst analyses the Global ESD Foam Packaging Market using the Ansoff Matrix to provide the best approaches a company can take to improve its market position. Based on the SWOT analysis conducted on the industry and industry players, the analyst has devised suitable strategies for market growth.

Why buy this report?

  • The report offers a comprehensive evaluation of the Global ESD Foam Packaging Market. The report includes in-depth qualitative analysis, verifiable data from authentic sources, and projections about market size. The projections are calculated using proven research methodologies.
  • The report has been compiled through extensive primary and secondary research. The primary research is done through interviews, surveys, and observation of renowned personnel in the industry.
  • The report includes an in-depth market analysis using Porter's 5 forces model and the Ansoff Matrix. In addition, the impact of Covid-19 on the market is also featured in the report.
  • The report also includes the regulatory scenario in the industry, which will help you make a well-informed decision. The report discusses major regulatory bodies and major rules and regulations imposed on this sector across various geographies.
  • The report also contains the competitive analysis using Positioning Quadrants, the analyst's Proprietary competitive positioning tool.

Report Highlights:

  • A complete analysis of the market, including the parent industry
  • Important market dynamics and trends
  • Market segmentation
  • Historical, current, and projected size of the market based on value and volume
  • Market shares and strategies of key players
  • Recommendations to companies for strengthening their foothold in the market
Frequently Asked Questions about the Global ESD Foam Packaging Market

What is the estimated value of the Global ESD Foam Packaging Market?

The Global ESD Foam Packaging Market was estimated to be valued at $258.94 Million in 2022.

What is the growth rate of the Global ESD Foam Packaging Market?

The growth rate of the Global ESD Foam Packaging Market is 7.7%, with an estimated value of $375.21 Million by 2027.

What is the forecasted size of the Global ESD Foam Packaging Market?

The Global ESD Foam Packaging Market is estimated to be worth $375.21 Million by 2027.

Who are the key companies in the Global ESD Foam Packaging Market?

Key companies in the Global ESD Foam Packaging Market include 3M Company, Botron Company, Inc., Conductive Containers, Inc., Desco Industries, Inc., Elcom Ltd., Electrotek Static Controls Pvt. Ltd., ESD Goods, GWP Group Ltd., Helios Packaging and Index Packaging, Inc..

Table of Contents

1 Report Description
1.1 Study Objectives
1.2 Market Definition
1.3 Currency
1.4 Years Considered
1.5 Language
1.6 Key Stakeholders
2 Research Methodology
2.1 Research Process
2.2 Data Collection and Validation
2.2.1 Secondary Research
2.2.2 Primary Research
2.2.3 Models
2.3 Market Size Estimation
2.3.1 Bottom-Up Approach
2.3.2 Top-Down Approach
2.4 Assumptions of the Study
2.5 Limitations of the Study
3 Executive Summary
3.1 Introduction
3.2 Market Size, Segmentations, and Outlook
4 Market Dynamics
4.1 Drivers
4.1.1 Rising Demand for ESD Foam Packaging in Electronic Devices
4.1.2 Growing Demand for Proper Packaging During Transportation
4.2 Restraints
4.2.1 High Cost of Product
4.3 Opportunities
4.3.1 Expanding Application of Integrated Circuits in Several Smart Consumer Devices
4.3.2 Growth in Investments in Biodegradable Electrostatic Discharge Package
4.4 Challenges
4.4.1 Growing Environmental Concerns Regarding Plastic Pollution
5 Market Analysis
5.1 Regulatory Scenario
5.2 Porter's Five Forces Analysis
5.3 Impact of COVID-19
5.4 Ansoff Matrix Analysis
6 Global ESD Foam Packaging Market, By Material & Additive
6.1 Introduction
6.2 Conductive Polymer
6.3 Dissipative Polymer
7 Global ESD Foam Packaging Market, By End-User
7.1 Introduction
7.2 Aerospace & Defense
7.3 Automobile
7.4 Electrical and Electronics
7.5 Manufacturing
8 Americas’ ESD Foam Packaging Market
8.1 Introduction
8.2 Argentina
8.3 Brazil
8.4 Canada
8.5 Chile
8.6 Colombia
8.7 Mexico
8.8 Peru
8.9 United States
8.10 Rest of Americas
9 Europe’s ESD Foam Packaging Market
9.1 Introduction
9.2 Austria
9.3 Belgium
9.4 Denmark
9.5 Finland
9.6 France
9.7 Germany
9.8 Italy
9.9 Netherlands
9.10 Norway
9.11 Poland
9.12 Russia
9.13 Spain
9.14 Sweden
9.15 Switzerland
9.16 United Kingdom
9.17 Rest of Europe
10 Middle East and Africa’s ESD Foam Packaging Market
10.1 Introduction
10.2 Egypt
10.3 Israel
10.4 Qatar
10.5 Saudi Arabia
10.6 South Africa
10.7 United Arab Emirates
10.8 Rest of MEA
11 APAC’s ESD Foam Packaging Market
11.1 Introduction
11.2 Australia
11.3 Bangladesh
11.4 China
11.5 India
11.6 Indonesia
11.7 Japan
11.8 Malaysia
11.9 Philippines
11.10 Singapore
11.11 South Korea
11.12 Sri Lanka
11.13 Thailand
11.14 Taiwan
11.15 Rest of Asia-Pacific
12 Competitive Landscape
12.1 Competitive Quadrant
12.2 Market Share Analysis
12.3 Strategic Initiatives
12.3.1 M&A and Investments
12.3.2 Partnerships and Collaborations
12.3.3 Product Developments and Improvements
13 Company Profiles
13.1 3M Company
13.2 Botron Company, Inc.
13.3 Conductive Containers, Inc.
13.4 Desco Industries, Inc.
13.5 Elcom Ltd.
13.6 Electrotek Static Controls Pvt. Ltd.
13.7 ESD Goods
13.8 GWP Group Ltd.
13.9 Helios Packaging
13.10 Index Packaging, Inc.
13.11 Nefab AB
13.12 Quality Foam Packaging, Inc.
13.13 Sasi Polypack
13.14 Sealed Air Corp
13.15 Statclean Technology (s) Pte Ltd.
13.16 Tekin Ltd.
14 Appendix
14.1 Questionnaire

Companies Mentioned

  • 3M Company
  • Botron Company, Inc.
  • Conductive Containers, Inc.
  • Desco Industries, Inc.
  • Elcom Ltd.
  • Electrotek Static Controls Pvt. Ltd.
  • ESD Goods
  • GWP Group Ltd.
  • Helios Packaging
  • Index Packaging, Inc.
  • Nefab AB
  • Quality Foam Packaging, Inc.
  • Sasi Polypack
  • Sealed Air Corp
  • Statclean Technology (s) Pte Ltd.
  • Tekin Ltd.