The Europe Semiconductor Etch Equipment Market would witness market growth of 7.8% CAGR during the forecast period (2023-2030).
Plasma treatment removes contaminants from a fiber surface, for instance, desizing cotton. Cleaning and plasma etching technology are broadly used in semiconductor and integrated circuit manufacturing. Plasma is the fourth state of matter (the other three are gas, liquid and solid), which is electrically charged and contains free electrons, positively charged ions, and free radicals (compounds or atoms with unsatisfied chemical bonds).
While there is no net charge within the plasma as a whole, the charged particles within the plasma can and are affected by external electromagnetic fields. Electronic engineers and physicists have devised ways to manipulate these electromagnetic fields to make beams of charged particles that to the integrated circuit engineer are similar to nano-milling machines. The plasmas from which these beams are created are chemically active and highly energetic, thus highly erosive/corrosive.
Plasma etching is also known as reactive ion etching, RIE (Reactive-ion etching), which shows how corrosive the plasma can be. Earlier, the plasma chamber was lined with monolithic ceramic components. However, today, as silicon wafer sizes have significantly increased, chamber sizes have also increased and are now coated with dense, high-quality ceramic coatings like yttria or alumina. Generally, the wafer-fixturing materials are also ceramics.
Germany plans to spend around EUR 50 billion to secure its position as a significant semiconductor production location. The country has announced major investment plans for the domestic production of semiconductors. Germany is investing prominently in its microelectronics sector to make the nation an international semiconductor production force. The ambitious deployment & development of semiconductor-based applications in the energy, manufacturing, and automotive sectors is crucial to the nation to meet its climate goals. Germany’s climate neutrality targets make attractive business opportunities and favorable market conditions for many international companies. These elements are assisting the market's expansion in the region.
The Germany market dominated the Europe Semiconductor Etch Equipment Market, By Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $1,823.6 million by 2030. The UK market is showcasing a CAGR of 6.8% during (2023 - 2030). Additionally, The France market would register a CAGR of 8.6% during (2023 - 2030).
Based on Type, the market is segmented into Dry and Wet. Based on Process, the market is segmented into Conductor and Dielectric. Based on End User, the market is segmented into Integrated Device Manufacturers, Foundry and Memory Manufacturers. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Panasonic Industry Co., Ltd. (Panasonic Holdings Corporation), ULVAC, Inc., Hitachi High-Tech Corporation (Hitachi, Ltd.), Tokyo Electron Ltd., Applied Materials, Inc., SPTS Technologies Ltd. (KLA Corporation), ASML Holding N.V., Samco, Inc., EV Group, Suzhou Delphi Laser Co., Ltd and Lam Research Corporation.
Plasma treatment removes contaminants from a fiber surface, for instance, desizing cotton. Cleaning and plasma etching technology are broadly used in semiconductor and integrated circuit manufacturing. Plasma is the fourth state of matter (the other three are gas, liquid and solid), which is electrically charged and contains free electrons, positively charged ions, and free radicals (compounds or atoms with unsatisfied chemical bonds).
While there is no net charge within the plasma as a whole, the charged particles within the plasma can and are affected by external electromagnetic fields. Electronic engineers and physicists have devised ways to manipulate these electromagnetic fields to make beams of charged particles that to the integrated circuit engineer are similar to nano-milling machines. The plasmas from which these beams are created are chemically active and highly energetic, thus highly erosive/corrosive.
Plasma etching is also known as reactive ion etching, RIE (Reactive-ion etching), which shows how corrosive the plasma can be. Earlier, the plasma chamber was lined with monolithic ceramic components. However, today, as silicon wafer sizes have significantly increased, chamber sizes have also increased and are now coated with dense, high-quality ceramic coatings like yttria or alumina. Generally, the wafer-fixturing materials are also ceramics.
Germany plans to spend around EUR 50 billion to secure its position as a significant semiconductor production location. The country has announced major investment plans for the domestic production of semiconductors. Germany is investing prominently in its microelectronics sector to make the nation an international semiconductor production force. The ambitious deployment & development of semiconductor-based applications in the energy, manufacturing, and automotive sectors is crucial to the nation to meet its climate goals. Germany’s climate neutrality targets make attractive business opportunities and favorable market conditions for many international companies. These elements are assisting the market's expansion in the region.
The Germany market dominated the Europe Semiconductor Etch Equipment Market, By Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $1,823.6 million by 2030. The UK market is showcasing a CAGR of 6.8% during (2023 - 2030). Additionally, The France market would register a CAGR of 8.6% during (2023 - 2030).
Based on Type, the market is segmented into Dry and Wet. Based on Process, the market is segmented into Conductor and Dielectric. Based on End User, the market is segmented into Integrated Device Manufacturers, Foundry and Memory Manufacturers. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Panasonic Industry Co., Ltd. (Panasonic Holdings Corporation), ULVAC, Inc., Hitachi High-Tech Corporation (Hitachi, Ltd.), Tokyo Electron Ltd., Applied Materials, Inc., SPTS Technologies Ltd. (KLA Corporation), ASML Holding N.V., Samco, Inc., EV Group, Suzhou Delphi Laser Co., Ltd and Lam Research Corporation.
Scope of the Study
Market Segments Covered in the Report:
By Type- Dry
- Wet
- Conductor
- Dielectric
- Integrated Device Manufacturers
- Foundry
- Memory Manufacturers
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
Key Market Players
List of Companies Profiled in the Report:
- Panasonic Industry Co., Ltd. (Panasonic Holdings Corporation)
- ULVAC, Inc.
- Hitachi High-Tech Corporation (Hitachi, Ltd.)
- Tokyo Electron Ltd.
- Applied Materials, Inc.
- SPTS Technologies Ltd. (KLA Corporation)
- ASML Holding N.V.
- Samco, Inc.
- EV Group
- Suzhou Delphi Laser Co., Ltd.
- Lam Research Corporation
Unique Offerings
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 5. Europe Semiconductor Etch Equipment Market, By Type
Chapter 6. Europe Semiconductor Etch Equipment Market, By Process
Chapter 7. Europe Semiconductor Etch Equipment Market, By End User
Chapter 8. Europe Semiconductor Etch Equipment Market, By Country
Chapter 9. Company Profiles
Companies Mentioned
- Oracle Corporation
- Trilliant Holdings, Inc.
- Itron, Inc.
- Arad Group
- Siemens AG
- ABB Group
- Honeywell International, Inc.
- Eaton Corporation PLC
- Hubbell Incorporated
- Hansen Technologies, Ltd.
Methodology
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