Integrated Passive Devices Market - Global Forecast 2025-2032

Integrated Passive Devices (IPDs) are rapidly advancing as crucial building blocks in next-generation electronics, offering compact integration of resistors, capacitors, and inductors to enhance performance and reliability in diverse end-user applications for global supply chains.

Market Snapshot: Integrated Passive Devices Market Size and Growth Momentum

The Integrated Passive Devices Market grew from USD 1.37 billion in 2024 to USD 1.46 billion in 2025. It is expected to continue expanding, projected to reach USD 2.40 billion by 2032 at a CAGR of 7.26%. Growth is propelled by strong demand for device miniaturization, performance optimization, and integration across wireless, automotive, and consumer electronics sectors. As IPDs become standard in high-frequency applications, their impact on system reliability and production efficiency continues to rise.

Scope & Segmentation: Strategic Insights for Senior Decision-Makers

This report delivers a comprehensive analysis of the integrated passive devices market across end-use industries, device types, materials, applications, and regions.

• Device Types: Baluns, capacitors, couplers, diplexers, inductors, resistors
• Material Types: Glass-based IPD, silicon-based IPD
• Applications: Digital and mixed signal, EMS and EMI protection, LED lighting, radio frequency protection
• End-User Industries: Aerospace and defense, automotive, consumer electronics, healthcare and life sciences, telecommunication
• Regional Coverage: Americas (United States, Canada, Mexico, Brazil, Argentina, Chile, Colombia, Peru), Europe, Middle East, and Africa (United Kingdom, Germany, France, Russia, Italy, Spain, Netherlands, Sweden, Poland, Switzerland, United Arab Emirates, Saudi Arabia, Qatar, Turkey, Israel, South Africa, Nigeria, Egypt, Kenya), and Asia-Pacific (China, India, Japan, Australia, South Korea, Indonesia, Thailand, Malaysia, Singapore, Taiwan)
• Company Profiles: Analysis includes 3DGS Inc., 3DiS Technologies, Advanced Furnace Systems Corp., Amkor Technology, Inc., Ansys Canada Ltd., Broadcom Inc., Cadence Design Systems, Inc., CTS Corporation, Global Communication Semiconductors, LLC, Infineon Technologies AG, JCET Group Co., Ltd., Johanson Technology Inc., Knowles Corporation, MACOM Technology Solutions Inc., Murata Manufacturing Co., Ltd, NXP B.V, ON Semiconductor Corporation, Qorvo, Inc., Samsung Electro-Mechanics Co., Ltd, SGS-Thomson Microelectronics N.V., Taiwan Semiconductor Manufacturing Company Limited, Taiyo Yuden Co., Ltd., Texas Instruments Incorporated, Vishay Intertechnology, Inc., Yageo Corporation

Key Takeaways: Strategic Drivers and Opportunities

• IPDs are central for miniaturization and performance enhancements in rapidly evolving telecommunications and automotive environments.
• Material improvements and advanced packaging increase operating frequencies and reduce loss, supporting integration with both digital and mixed-signal circuits.
• Supply chain resilience is under the spotlight, with shifts toward dual sourcing, risk management, and agile local manufacturing to withstand global disruptions.
• Regional innovation policies and technological incentives in Asia-Pacific and Europe facilitate rapid development and adoption of both silicon- and glass-based IPDs.
• Collaborations across semiconductor foundries and system integrators support tailored solutions in high-frequency, EMI protection, and safety-critical markets.
• Segmentation shows emerging demand patterns, with device type and application-specific requirements shaping future product innovation.

Tariff Impact: Navigating the Complex Global Trading Landscape

The introduction of US tariffs in 2025 has forced manufacturers to reconsider supplier contracts and global sourcing strategies. Many have opted for localized fabrication and joint ventures to reduce exposure to duty-related costs. These changes encourage new risk-sharing agreements and drive diversification to markets with lower tariff barriers, resulting in evolving logistics models and inventory planning challenges. Ultimately, the market is moving towards heightened operational agility and deeper investment in supply chain visibility and expertise.

Methodology & Data Sources

The research methodology combines extensive secondary analysis of regulatory filings, trade data, patent literature, and technical sources with primary interviews across R&D, procurement, and manufacturing executives. Segmentation and regional trends are iteratively refined via expert feedback, with findings validated through multi-source triangulation and peer review within an internal analytic panel.

Why This Report Matters: Strategic Value for Senior Executives

• Empowers leaders with actionable intelligence on technology trends, regulatory shifts, and supply chain innovations driving IPD adoption.
• Offers granular segmentation to inform investment strategies, product development, and market entry plans.
• Delivers a comprehensive evaluation of global and regional market dynamics, aiding risk mitigation and commercial growth decisions.

Conclusion

Integrated passive devices are shaping global electronics, with technology evolution and resilient supply strategies redefining competition. This report equips decision-makers with the insights needed to navigate emerging challenges and harness growth opportunities in the IPD landscape.

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