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LAMEA Board-to-Board Connectors Market Size, Share & Industry Trends Analysis Report By Type (Pin Headers (Stacked Header, and Shrouded Header), and Socket), By Pitch, By Application, By Country and Growth Forecast, 2023 - 2030

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    Report

  • 185 Pages
  • August 2023
  • Region: Africa, Middle East
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5886971
The Latin America, Middle East and Africa Board-to-Board Connectors Market should witness market growth of 8.2% CAGR during the forecast period (2023-2030). In the year 2026, the LAMEA market's volume is expected to surge to 127.8 million units, showcasing a growth of 7.9% (2023-2030).

The use of cell phones, laptop computers, and video cameras has grown, which has raised the demand for BTB connectors. In medical devices, wearable technology, data centers, and security solution systems, usage and demand for BTB connectors have expanded due to digitization across all industrial verticals.

Modern technology that depends on BTB connectors for proper operation has emerged as a result of the growing demand for automation. With the introduction of impending electric vehicles, the expanding automotive industry has created the potential for BTB connectors. The highest BTB connector usage has been seen in the consumer electronics sector.

The Dubai Health Authority (DHA) offers an excellent healthcare infrastructure in Dubai by establishing and carrying out medical policies and procedures in public & private hospitals and clinics. Additionally, DHA creates a Dubai health strategy that addresses future demands, ensures collaborations between both private & public health service providers, and authorizes and oversees the Dubai Health Sector. Additionally, it helps the healthcare system become more open and accountable. This strategy aims to continually uphold quality, clinical competence, patient safety, and rights protection objectives. The board-to-board connectors market is therefore anticipated to expand in the LAMEA region.

The Brazil market dominated the LAMEA Board-to-Board Connectors Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $336.5 million by 2030. The Argentina market is exhibiting a CAGR of 8.8% during (2023-2030). Additionally, The UAE market would experience a CAGR of 7.9% during (2023-2030).

Based on Type, the market is segmented into Pin Headers (Stacked Header, and Shrouded Header), and Socket. Based on Pitch, the market is segmented into 1 mm to 2 mm, Greater Than 2 mm, and Less Than 1 mm. Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial Automation, Healthcare, Telecommunication, and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.

The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Amphenol Corporation, TE Connectivity Ltd., Molex, LLC (Koch Industries, Inc.), Kyocera Corporation, HARTING Technology Group, Omron Corporation, Japan Aviation Electronics Industry, Limited, Hirose Electric Co., Ltd, Samtec, FIT Hon Teng Limited (Foxconn (Far East) Limited).

Scope of the Study

By Type (Volume, Million Units, USD Million, 2019-2030)

  • Pin Headers
    • Stacked Header
    • Shrouded Header
  • Socket

By Pitch (Volume, Million Units, USD Million, 2019-2030)

  • 1 mm to 2 mm
  • Greater Than 2 mm
  • Less Than 1 mm

By Application (Volume, Million Units, USD Million, 2019-2030)

  • Consumer Electronics
  • Automotive
  • Industrial Automation
  • Healthcare
  • Telecommunication
  • Others

By Country (Volume, Million Units, USD Million, 2019-2030)

  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Key Market Players

List of Companies Profiled in the Report:

  • Amphenol Corporation
  • TE Connectivity Ltd.
  • Molex, LLC (Koch Industries, Inc.)
  • Kyocera Corporation
  • HARTING Technology Group
  • Omron Corporation
  • Japan Aviation Electronics Industry, Limited
  • Hirose Electric Co., Ltd
  • Samtec
  • FIT Hon Teng Limited (Foxconn (Far East) Limited)

Unique Offerings

  • Exhaustive coverage
  • The highest number of Market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 LAMEA Board-to-Board Connectors Market, by Type
1.4.2 LAMEA Board-to-Board Connectors Market, by Pitch
1.4.3 LAMEA Board-to-Board Connectors Market, by Application
1.4.4 LAMEA Board-to-Board Connectors Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
Chapter 4. Competition Analysis - Global
4.1 KBV Cardinal Matrix
4.2 Recent Industry Wide Strategic Developments
4.2.1 Partnerships, Collaborations and Agreements
4.2.2 Product Launches and Product Expansions
4.2.3 Acquisition and Mergers
4.3 Market Share Analysis, 2022
4.4 Top Winning Strategies
4.4.1 Key Leading Strategies: Percentage Distribution (2019-2023)
4.4.2 Key Strategic Move: (Product Launches and Product Expansions: 2020, Jan - 2023, Jul) Leading Players
4.5 Porter’s Five Force Analysis
Chapter 5. LAMEA Board-to-Board Connectors Market by Type
5.1 LAMEA Pin Headers Market by Country
5.2 LAMEA Board-to-Board Connectors Market by Pin Headers Type
5.2.1 LAMEA Stacked Header Market by Country
5.2.2 LAMEA Shrouded Header Market by Country
5.3 LAMEA Socket Market by Country
Chapter 6. LAMEA Board-to-Board Connectors Market by Pitch
6.1 LAMEA 1 mm to 2 mm Market by Country
6.2 LAMEA Greater Than 2 mm Market by Country
6.3 LAMEA Less Than 1 mm Market by Country
Chapter 7. LAMEA Board-to-Board Connectors Market by Application
7.1 LAMEA Consumer Electronics Market by Country
7.2 LAMEA Automotive Market by Country
7.3 LAMEA Industrial Automation Market by Country
7.4 LAMEA Healthcare Market by Country
7.5 LAMEA Telecommunication Market by Country
7.6 LAMEA Others Market by Country
Chapter 8. LAMEA Board-to-Board Connectors Market by Country
8.1 Brazil Board-to-Board Connectors Market
8.1.1 Brazil Board-to-Board Connectors Market by Type
8.1.1.1 Brazil Board-to-Board Connectors Market by Pin Headers Type
8.1.2 Brazil Board-to-Board Connectors Market by Pitch
8.1.3 Brazil Board-to-Board Connectors Market by Application
8.2 Argentina Board-to-Board Connectors Market
8.2.1 Argentina Board-to-Board Connectors Market by Type
8.2.1.1 Argentina Board-to-Board Connectors Market by Pin Headers Type
8.2.2 Argentina Board-to-Board Connectors Market by Pitch
8.2.3 Argentina Board-to-Board Connectors Market by Application
8.3 UAE Board-to-Board Connectors Market
8.3.1 UAE Board-to-Board Connectors Market by Type
8.3.1.1 UAE Board-to-Board Connectors Market by Pin Headers Type
8.3.2 UAE Board-to-Board Connectors Market by Pitch
8.3.3 UAE Board-to-Board Connectors Market by Application
8.4 Saudi Arabia Board-to-Board Connectors Market
8.4.1 Saudi Arabia Board-to-Board Connectors Market by Type
8.4.1.1 Saudi Arabia Board-to-Board Connectors Market by Pin Headers Type
8.4.2 Saudi Arabia Board-to-Board Connectors Market by Pitch
8.4.3 Saudi Arabia Board-to-Board Connectors Market by Application
8.5 South Africa Board-to-Board Connectors Market
8.5.1 South Africa Board-to-Board Connectors Market by Type
8.5.1.1 South Africa Board-to-Board Connectors Market by Pin Headers Type
8.5.2 South Africa Board-to-Board Connectors Market by Pitch
8.5.3 South Africa Board-to-Board Connectors Market by Application
8.6 Nigeria Board-to-Board Connectors Market
8.6.1 Nigeria Board-to-Board Connectors Market by Type
8.6.1.1 Nigeria Board-to-Board Connectors Market by Pin Headers Type
8.6.2 Nigeria Board-to-Board Connectors Market by Pitch
8.6.3 Nigeria Board-to-Board Connectors Market by Application
8.7 Rest of LAMEA Board-to-Board Connectors Market
8.7.1 Rest of LAMEA Board-to-Board Connectors Market by Type
8.7.1.1 Rest of LAMEA Board-to-Board Connectors Market by Pin Headers Type
8.7.2 Rest of LAMEA Board-to-Board Connectors Market by Pitch
8.7.3 Rest of LAMEA Board-to-Board Connectors Market by Application
Chapter 9. Company Profiles
9.1 Amphenol Corporation
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Research & Development Expenses
9.1.5 SWOT Analysis
9.2 TE Connectivity Ltd.
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Research & Development Expense
9.2.5 Recent strategies and developments:
9.2.5.1 Acquisition and Mergers:
9.2.5.2 Product Launches and Product Expansions:
9.2.5.3 Partnerships, Collaborations, and Agreements:
9.2.6 SWOT Analysis
9.3 Molex, LLC (Koch Industries, Inc.)
9.3.1 Company Overview
9.3.2 Recent strategies and developments:
9.3.2.1 Product Launches and Product Expansions:
9.3.2.2 Acquisition and Mergers:
9.3.3 SWOT Analysis
9.4 Kyocera Corporation
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Segmental and Regional Analysis
9.4.4 Research & Development Expenses
9.4.5 Recent strategies and developments:
9.4.5.1 Product Launches and Product Expansions:
9.4.6 SWOT Analysis
9.5 HARTING Technology Group
9.5.1 Company Overview
9.5.2 Recent strategies and developments:
9.5.2.1 Partnerships, Collaborations, and Agreements:
9.5.3 SWOT Analysis
9.6 Omron Corporation
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Segmental and Regional Analysis
9.6.4 Research & Development Expenses
9.6.5 Recent strategies and developments:
9.6.5.1 Product Launches and Product Expansions:
9.6.6 SWOT Analysis
9.7 Japan Aviation Electronics Industry, Limited
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Segmental Analysis
9.7.4 Recent strategies and developments:
9.7.4.1 Product Launches and Product Expansions:
9.7.5 SWOT Analysis
9.8 Hirose Electric Co., Ltd
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Recent strategies and developments:
9.8.4.1 Partnerships, Collaborations, and Agreements:
9.8.4.2 Product Launches and Product Expansions:
9.8.5 SWOT Analysis
9.9 Samtec
9.9.1 Company Overview
9.9.2 SWOT Analysis
9.10. FIT Hon Teng Limited (Foxconn (Far East) Limited)
9.10.1 Company Overview
9.10.2 Financial Analysis
9.10.3 Segmental and Regional Analysis
9.10.4 Research & Development Expenses
9.10.5 SWOT Analysis

Companies Mentioned

  • Amphenol Corporation
  • TE Connectivity Ltd.
  • Molex, LLC (Koch Industries, Inc.)
  • Kyocera Corporation
  • HARTING Technology Group
  • Omron Corporation
  • Japan Aviation Electronics Industry, Limited
  • Hirose Electric Co., Ltd
  • Samtec
  • FIT Hon Teng Limited (Foxconn (Far East) Limited)

Methodology

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