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The Global Market for Thermal Interface Materials 2023-2033

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    Report

  • 208 Pages
  • July 2023
  • Region: Global
  • Future Markets, Inc
  • ID: 5748349

The effective transfer/removal of heat from a semiconductor device is crucial to ensure reliable operation and to enhance the lifetime of these components. The development of high-power and high-frequency electronic devices has greatly increased issues with excessive heat accumulation. There is therefore a significant requirement for effective thermal management materials to remove excess heat from electronic devices to ambient environment.

Thermal interface materials (TIMs) offer efficient heat dissipation to maintain proper functions and lifetime for these devices. TIMs are materials that are applied between the interfaces of two components (typically a heat generating device such as microprocessors, photonic integrated circuits, etc. and a heat dissipating device e.g. heat sink) to enhance the thermal coupling between these devices. A range of Carbon-based, metal/solder and filler-based TIMs are available both commercially and in the research and development (R&D) phase.

Report contents include:

  • Analysis of recent commercial and R&D developments in thermal interface materials (TIMs).
  • Market trends and drivers.
  • Market map. 
  • Analysis of thermal interface materials (TIMs) including:
    • Thermal Pads/Insulators.
    • Thermally Conductive Adhesives.
    • Thermal Compounds or Greases.
    • Thermally Conductive Epoxy/Adhesives.
    • Phase Change Materials.
    • Metal-based TIMs.
    • Carbon-based TIMs.
  • Market analysis. Markets covered include:
    • Consumer electronics.
    • Electric Vehicles (EV) batteries.
    • Data Center infrastructure.
    • ADAS sensors.
    • EMI shielding.
    • 5G.
  • Global market revenues for thermal interface materials (TIMs), segmented by type and market, historical and forecast to 2033. 
  • Profiles of 87 producers. Companies profiled include Arieca, Carbice Corporation, CondAlign, Fujipoly, Henkel, Indium Corporation, KULR Technology Group, Inc., Parker-Hannifin Corporation, Shin-Etsu Chemical Co., Ltd, and SHT Smart High-Tech AB. 


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Table of Contents

1. Introduction
1.1 Thermal management-active and passive
1.2 What are thermal interface materials (TIMs)?
1.2.1 Types
1.2.2 Thermal conductivity
1.3 Comparative properties of TIMs
1.4 Advantages and disadvantages of TIMs, by type
1.5 Prices

2 MATERIALS
2.1 Thermal greases and pastes
2.2 Thermal gap pads
2.3 Thermal gap fillers
2.4 Thermal adhesives and potting compounds
2.5 Phase Change Materials
2.5.1 Properties of Phase Change Materials (PCMs)
2.5.2 Types
2.5.2.1 Organic/biobased phase change materials
2.5.2.1.1 Advantages and disadvantages
2.5.2.1.2 Paraffin wax
2.5.2.1.3 Non-Paraffins/Bio-based
2.5.2.2 Inorganic phase change materials
2.5.2.2.1 Salt hydrates
2.5.2.2.1.1 Advantages and disadvantages
2.5.2.2.2 Metal and metal alloy PCMs (High-temperature)
2.5.2.3 Eutectic mixtures
2.5.2.4 Encapsulation of PCMs
2.5.2.4.1 Macroencapsulation
2.5.2.4.2 Micro/nanoencapsulation
2.5.2.5 Nanomaterial phase change materials
2.5.3 Thermal energy storage (TES)
2.5.3.1 Sensible heat storage
2.5.3.2 Latent heat storage
2.5.4 Application in TIMs
2.5.4.1 Thermal pads
2.5.4.2 Low Melting Alloys (LMAs)
2.6 Metal-based TIMs
2.6.1 Solders and low melting temperature alloy TIMs
2.6.2 Liquid metals
2.6.3 Solid liquid hybrid (SLH) metals
2.6.3.1 Hybrid liquid metal pastes
2.6.3.2 SLH created during chip assembly (m2TIMs)
2.7 Carbon-based TIMs
2.7.1 Multi-walled nanotubes (MWCNT)
2.7.1.1 Properties
2.7.1.2 Application as thermal interface materials
2.7.2 Single-walled carbon nanotubes (SWCNTs)
2.7.2.1 Properties
2.7.2.2 Application as thermal interface materials
2.7.3 Vertically aligned CNTs (VACNTs)
2.7.3.1 Properties
2.7.3.2 Applications
2.7.3.3 Application as thermal interface materials
2.7.4 BN nanotubes (BNNT) and nanosheets (BNNS)
2.7.4.1 Properties
2.7.4.2 Application as thermal interface materials
2.7.5 Graphene
2.7.5.1 Properties
2.7.5.2 Application as thermal interface materials
2.7.5.2.1 Graphene fillers
2.7.5.2.2 Graphene foam
2.7.5.2.3 Graphene aerogel
2.7.6 Nanodiamonds
2.7.6.1 Properties
2.7.6.2 Application as thermal interface materials
2.7.7 Graphite
2.7.7.1 Properties
2.7.7.2 Natural graphite
2.7.7.2.1 Classification
2.7.7.2.2 Processing
2.7.7.2.3 Flake
2.7.7.2.3.1 Grades
2.7.7.2.3.2 Applications
2.7.7.3 Synthetic graphite
2.7.7.3.1 Classification
2.7.7.3.1.1 Primary synthetic graphite
2.7.7.3.1.2 Secondary synthetic graphite
2.7.7.3.1.3 Processing
2.7.7.4 Applications as thermal interface materials
2.7.8 Hexagonal Boron Nitride
2.7.8.1 Properties
2.7.8.2 Application as thermal interface materials
2.8 Metamaterials
2.8.1 Types and properties
2.8.1.1 Electromagnetic metamaterials
2.8.1.1.1 Double negative (DNG) metamaterials
2.8.1.1.2 Single negative metamaterials
2.8.1.1.3 Electromagnetic bandgap metamaterials (EBG)
2.8.1.1.4 Bi-isotropic and bianisotropic metamaterials
2.8.1.1.5 Chiral metamaterials
2.8.1.1.6 Electromagnetic “Invisibility” cloak
2.8.1.2 Terahertz metamaterials
2.8.1.3 Photonic metamaterials
2.8.1.4 Tunable metamaterials
2.8.1.5 Frequency selective surface (FSS) based metamaterials
2.8.1.6 Nonlinear metamaterials
2.8.1.7 Acoustic metamaterials
2.8.2 Application as thermal interface materials
2.9 Self-healing thermal interface materials
2.9.1 Extrinsic self-healing
2.9.2 Capsule-based
2.9.3 Vascular self-healing
2.9.4 Intrinsic self-healing
2.9.5 Healing volume
2.9.6 Types of self-healing materials, polymers and coatings
2.9.7 Applications in thermal interface materials

3 MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs)
3.1 Consumer electronics
3.1.1 Market overview
3.1.1.1 Market drivers
3.1.1.2 Applications
3.1.1.2.1 Smartphones and tablets
3.1.1.2.2 Wearable electronics
3.1.2 Global market revenues 2022, by TIM type, millions USD
3.2 Electric Vehicles (EV)
3.2.1 Market overview
3.2.1.1 Market drivers
3.2.1.2 Applications
3.2.1.2.1 Lithium-ion batteries
3.2.1.2.1.1 Cell-to-pack designs
3.2.1.2.1.2 Cell-to-chassis/body
3.2.1.2.2 Power electronics
3.2.1.2.3 Charging stations
3.2.2 Global market revenues 2022, by TIM type, millions USD
3.3 Data Centers
3.3.1 Market overview
3.3.1.1 Market drivers
3.3.1.2 Applications
3.3.1.2.1 Router, switches and line cards
3.3.1.2.2 Servers
3.3.1.2.3 Power supply converters
3.3.2 Global market revenues 2022, by TIM type, millions USD
3.4 ADAS Sensors
3.4.1 Market overview
3.4.1.1 Market drivers
3.4.1.2 Applications
3.4.1.2.1 ADAS Cameras
3.4.1.2.2 ADAS Radar
3.4.1.2.3 ADAS LiDAR
3.4.2 Global market revenues 2022, by TIM type, millions USD
3.5 EMI shielding
3.5.1 Market overview
3.5.1.1 Market drivers
3.5.1.2 Applications
3.6 5G
3.6.1 Market overview
3.6.1.1 Market drivers
3.6.1.2 Applications
3.6.1.2.1 Antenna
3.6.1.2.2 Base Band Unit (BBU)
3.6.2 Global market revenues 2022, by TIM type, millions USD

4 GLOBAL REVENUES FOR TIMS
4.1 Global revenues for TIMs, 2022, by type
4.2 Global revenues for TIMs 2023-2033, by materials type
4.2.1 Telecommunications market by TIMS type
4.2.2 Electronics and data centers market by TIMS type
4.2.3 ADAS market by TIMS type
4.2.4 Electric vehicles (EVs) market by TIMS type
4.3 Global revenues for TIMs 2018-2033, by market

5 FUTURE MARKET PROSPECTS6 COMPANY PROFILES (87 company profiles)7 RESEARCH METHODOLOGY8 REFERENCES
List of Tables
Table 1. Thermal conductivities (?) of common metallic, carbon, and ceramic fillers employed in TIMs
Table 2. Commercial TIMs and their properties
Table 3. Advantages and disadvantages of TIMs, by type
Table 4. Thermal interface materials prices
Table 5. Characteristics of some typical TIMs
Table 6. Properties of PCMs
Table 7. PCM Types and properties
Table 8. Advantages and disadvantages of organic PCMs
Table 9. Advantages and disadvantages of organic PCM Fatty Acids
Table 10. Advantages and disadvantages of salt hydrates
Table 11. Advantages and disadvantages of low melting point metals
Table 12. Advantages and disadvantages of eutectics
Table 13. Benefits and drawbacks of PCMs in TIMs
Table 14. Properties of CNTs and comparable materials
Table 15. Typical properties of SWCNT and MWCNT
Table 16. Comparison of carbon-based additives in terms of the main parameters influencing their value proposition as a conductive additive
Table 17. Thermal conductivity of CNT-based polymer composites
Table 18. Comparative properties of BNNTs and CNTs
Table 19. Properties of graphene, properties of competing materials, applications thereof
Table 20. Properties of nanodiamonds
Table 21. Comparison between Natural and Synthetic Graphite
Table 22. Classification of natural graphite with its characteristics
Table 23. Characteristics of synthetic graphite
Table 24. Properties of hexagonal boron nitride (h-BN)
Table 25. Types of self-healing coatings and materials
Table 26. Comparative properties of self-healing materials
Table 27. Global revenues for TIMs, 2022, by type
Table 28. Global revenues for TIMs 2018-2033, by market (millions USD)
Table 29. Carbodeon Ltd. Oy nanodiamond product list
Table 30. Ray-Techniques Ltd. nanodiamonds product list
Table 31. Comparison of ND produced by detonation and laser synthesis

List of Figures
Figure 1. (L-R) Surface of a commercial heatsink surface at progressively higher magnifications, showing tool marks that create a rough surface and a need for a thermal interface material
Figure 2. Schematic of thermal interface materials used in a flip chip package
Figure 3. Thermal grease
Figure 4. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module
Figure 5. Application of thermal silicone grease
Figure 6. A range of thermal grease products
Figure 7. Thermal Pad
Figure 8. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module
Figure 9. Thermal tapes
Figure 10. Thermal adhesive products
Figure 11. Phase-change TIM products
Figure 12. PCM mode of operation
Figure 13. Classification of PCMs
Figure 14. Phase-change materials in their original states
Figure 15. Thermal energy storage materials
Figure 16. Phase Change Material transient behaviour
Figure 17. PCM TIMs
Figure 18. Phase Change Material - die cut pads ready for assembly
Figure 19. Typical IC package construction identifying TIM1 and TIM2
Figure 20. Liquid metal TIM product
Figure 21. Pre-mixed SLH
Figure 22. HLM paste and Liquid Metal Before and After Thermal Cycling
Figure 23. SLH with Solid Solder Preform
Figure 24. Automated process for SLH with solid solder preforms and liquid metal
Figure 25. Schematic diagram of a multi-walled carbon nanotube (MWCNT)
Figure 26. Schematic of single-walled carbon nanotube
Figure 27. Types of single-walled carbon nanotubes
Figure 28. Schematic of a vertically aligned carbon nanotube (VACNT) membrane used for water treatment
Figure 29. Schematic of Boron Nitride nanotubes (BNNTs). Alternating B and N atoms are shown in blue and red
Figure 30. Graphene layer structure schematic
Figure 31. Illustrative procedure of the Scotch-tape based micromechanical cleavage of HOPG
Figure 32. Graphene and its descendants: top right: graphene; top left: graphite = stacked graphene; bottom right: nanotube=rolled graphene; bottom left: fullerene=wrapped graphene
Figure 33. Detonation Nanodiamond
Figure 34. DND primary particles and properties
Figure 35. Flake graphite
Figure 36. Applications of flake graphite
Figure 37. Graphite-based TIM products
Figure 38. Structure of hexagonal boron nitride
Figure 39. Classification of metamaterials based on functionalities
Figure 40. Electromagnetic metamaterial
Figure 41. Schematic of Electromagnetic Band Gap (EBG) structure
Figure 42. Schematic of chiral metamaterials
Figure 43. Nonlinear metamaterials- 400-nm thick nonlinear mirror that reflects frequency-doubled output using input light intensity as small as that of a laser pointer
Figure 44. Schematic of self-healing polymers. Capsule based (a), vascular (b), and intrinsic (c) schemes for self-healing materials. Red and blue colours indicate chemical species which react (purple) to heal damage
Figure 45. Stages of self-healing mechanism
Figure 46. Self-healing mechanism in vascular self-healing systems
Figure 47. Comparison of self-healing systems
Figure 48. Schematic of TIM operation in electronic devices
Figure 49. Schematic of Thermal Management Materials in smartphone
Figure 50. Wearable technology inventions
Figure 51. Global market revenues 2022 in electronics, by TIM type, million USD
Figure 52. Application of thermal interface materials in automobiles
Figure 53. EV battery components including TIMs
Figure 54. Battery pack with a cell-to-pack design and prismatic cells
Figure 55. Cell-to-chassis battery pack
Figure 56. TIMS in EV charging station
Figure 57. Global market revenues 2022 in electric vehicles, by TIM type, million USD
Figure 58. Image of data center layout
Figure 59. Application of TIMs in line card
Figure 60. Global market revenues 2022 in data centers, by TIM type, million USD
Figure 61. ADAS radar unit incorporating TIMs
Figure 62. Global market revenues 2022 in ADAS, by TIM type, million USD
Figure 63. Coolzorb 5G
Figure 64. TIMs in Base Band Unit (BBU)
Figure 65. Global market revenues 2022 in telecommunications, by TIM type, million USD
Figure 66. Global revenues for TIMs, 2022, by type
Figure 67. Telecommunications market by TIMS type 2023-2023, millions USD
Figure 68. Electronics and data centers market by TIMS type 2023-2023, millions USD
Figure 69. ADAS market by TIMS type 2023-2023, millions USD
Figure 70. Electric vehicles (EVs) market by TIMS type 2023-2023, millions USD
Figure 71. Global revenues for TIMs 2018-2033, by market
Figure 72. Boron Nitride Nanotubes products
Figure 73. Transtherm® PCMs
Figure 74. Carbice carbon nanotubes
Figure 75. Internal structure of carbon nanotube adhesive sheet
Figure 76. Carbon nanotube adhesive sheet
Figure 77. HI-FLOW Phase Change Materials
Figure 78. Thermoelectric foil, consists of a sequence of semiconductor elements connected with conductive metal. At the top (in red) is the thermal interface
Figure 79. Parker Chomerics THERM-A-GAP GEL
Figure 80. Metamaterial structure used to control thermal emission
Figure 81. Shinko Carbon Nanotube TIM product
Figure 82. The Sixth Element graphene products
Figure 83. Thermal conductive graphene film
Figure 84. VB Series of TIMS from Zeon

Companies Mentioned

A selection of companies mentioned in this report includes:

  • 3M
  • AI Technology Inc.
  • AOK Technologies
  • AOS Thermal Compounds LLC
  • Aismalibar S.A.
  • Arkema
  • Arieca, Inc.
  • ATP Adhesive Systems AG
  • Bando Chemical Industries, Ltd
  • BNNano
  • BNNT LLC
  • Boyd Corporation
  • BYK
  • Carbice Corp.
  • Carbon Waters
  • Carbodeon Ltd. Oy
  • CondAlign AS
  • Detakta Isolier- und Messtechnik GmbH & Co. KG
  • Dexerials Corporation
  • Deyang Carbonene Technology
  • Dow Corning
  • Dupont (Laird Performance Materials)
  • Dymax Corporation
  • ELANTAS Europe GmbH
  • Elkem Silcones
  • Enerdyne Thermal Solutions, Inc
  • Epoxies Etc.
  • First Graphene Ltd
  • Fujipoly
  • Fujitsu Laboratories
  • GLPOLY
  • Global Graphene Group
  • Goodfellow Corporation
  • Graphmatech AB
  • GuangDong KingBali New Material Co., Ltd.
  • HALA Contec GmbH & Co. KG
  • Hamamatsu Carbonics Corporation
  • H.B. Fuller Company
  • Henkel AG & Co. KGAA
  • Honeywell
  • Hongfucheng New Materials
  • HyMet Thermal Interfaces SIA
  • Indium Corporation
  • Inkron
  • Kerafol Keramische Folien GmbH & Co. KG
  • Kitagawa
  • KULR Technology Group, Inc.
  • Leader Tech Inc.
  • LiSAT
  • Liquid Wire, Inc.
  • MG Chemicals Ltd
  • Minoru Co., Ltd.
  • Mithras Technology AG
  • Molecular Rebar Design, LLC
  • Momentive Performance Materials
  • Nanoramic Laboratories
  • Nano Tim
  • NeoGraf Solutions, LLC
  • Nolato Silikonteknik
  • Ntherma Corporation
  • OCSiAl Group
  • Panasonic
  • Parker Hannifin Corporation
  • Plasmonics, Inc.
  • Polymer Science, Inc.
  • Polytec PT GmbH
  • Protavic
  • Ray-Techniques Ltd.
  • Rovilus, Inc.
  • Saint-Gobain
  • Samyang Corporation
  • Schlegel Electronic Materials
  • Sekisui Chemical
  • Sekisui Polymatech Europe BV
  • Shenhe Liyang Technology
  • Shinko Electric Industries Co., Ltd.
  • Shin-Etsu Chemical Co. Ltd.
  • SHT Smart High Tech AB
  • Sika AG
  • Sixth Element
  • STOCKMEIER Urethanes GmbH & Co. KG
  • Suzhou Kanronics Electronic Technology Co., Ltd
  • Tenutec AB
  • Versarien
  • Wacker Chemie AG
  • Zalman Tech Co., Ltd.
  • Zeon Specialty Materials

Methodology

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