The global market for Through-hole Passive Components was estimated at US$44.5 Billion in 2024 and is projected to reach US$64.0 Billion by 2030, growing at a CAGR of 6.2% from 2024 to 2030. This comprehensive report provides an in-depth analysis of market trends, drivers, and forecasts, helping you make informed business decisions. The report includes the most recent global tariff developments and how they impact the Through-hole Passive Components market.
Segments: Component (Resistors, Capacitors, Inductors, Diodes, Transducers, Sensors, Others); Leads Model (Axial Leads, Radial Leads); Application (Consumer Electronics, IT & Telecommunications, Automotive, Industrial, Aerospace & Defense, Healthcare, Others)
Geographic Regions/Countries: World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.
The analysts continuously track trade developments worldwide, drawing insights from leading global economists and over 200 industry and policy institutions, including think tanks, trade organizations, and national economic advisory bodies. This intelligence is integrated into forecasting models to provide timely, data-driven analysis of emerging risks and opportunities.
Through-hole Passive Components Market Trends & Drivers Summarized
How Are Through-hole Passive Components Remaining Relevant in the Age of Surface-mount Technology?
Through-hole passive components, including resistors, capacitors, inductors, and diodes, remain crucial in applications requiring high durability, mechanical stability, and superior heat dissipation. Despite the dominance of surface-mount technology (SMT) in modern electronics, through-hole components continue to be widely used in industries such as aerospace, automotive, power electronics, and military applications. These components provide stronger connections, making them suitable for high-reliability circuits exposed to extreme environmental conditions. The demand for through-hole technology (THT) is particularly evident in power supply systems, industrial automation, and energy applications, where component robustness is essential. However, challenges such as manual assembly requirements, larger footprint compared to SMT, and limited design flexibility have slowed market expansion. As the electronics industry continues to evolve, how will through-hole passive components maintain their relevance and integrate with modern manufacturing trends?What Technological Innovations Are Advancing Through-hole Passive Components?
Recent innovations in through-hole passive components focus on improving miniaturization, thermal management, and material efficiency. The development of high-power resistors with improved heat dissipation capabilities is enhancing performance in power electronics and industrial automation. Hybrid integration techniques, where through-hole components are combined with SMT for optimized performance, are gaining traction in high-reliability circuit designs. AI-driven component placement optimization in automated through-hole assembly processes is improving efficiency and reducing production costs. Additionally, advances in ceramic and polymer dielectric materials are enhancing the performance of through-hole capacitors, making them more resistant to voltage fluctuations and temperature variations.Why Is the Demand for Through-hole Passive Components Increasing?
The demand for through-hole passive components remains strong due to their reliability in high-stress environments, particularly in aerospace, defense, and industrial applications. The increasing deployment of power electronics in renewable energy systems, electric vehicles (EVs), and grid infrastructure is also driving demand for robust and long-lasting passive components. Additionally, the expansion of IoT and smart infrastructure projects is requiring hybrid designs that integrate both SMT and through-hole components for optimized functionality.What Factors Are Driving the Growth of the Through-hole Passive Components Market?
The market is growing due to advancements in power electronics, increased adoption in mission-critical applications, rising demand for hybrid integration in circuit designs, and technological improvements in component materials. As industries prioritize durability and long-term performance, through-hole passive components are expected to remain essential in high-reliability electronic systems.Report Scope
The report analyzes the Through-hole Passive Components market, presented in terms of market value (US$ Thousand). The analysis covers the key segments and geographic regions outlined below.Segments: Component (Resistors, Capacitors, Inductors, Diodes, Transducers, Sensors, Others); Leads Model (Axial Leads, Radial Leads); Application (Consumer Electronics, IT & Telecommunications, Automotive, Industrial, Aerospace & Defense, Healthcare, Others)
Geographic Regions/Countries: World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.
Key Insights:
- Market Growth: Understand the significant growth trajectory of the Resistors segment, which is expected to reach US$15.6 Billion by 2030 with a CAGR of a 5.0%. The Capacitors segment is also set to grow at 5.0% CAGR over the analysis period.
- Regional Analysis: Gain insights into the U.S. market, estimated at $11.7 Billion in 2024, and China, forecasted to grow at an impressive 6.2% CAGR to reach $10.3 Billion by 2030. Discover growth trends in other key regions, including Japan, Canada, Germany, and the Asia-Pacific.
Why You Should Buy This Report:
- Detailed Market Analysis: Access a thorough analysis of the Global Through-hole Passive Components Market, covering all major geographic regions and market segments.
- Competitive Insights: Get an overview of the competitive landscape, including the market presence of major players across different geographies.
- Future Trends and Drivers: Understand the key trends and drivers shaping the future of the Global Through-hole Passive Components Market.
- Actionable Insights: Benefit from actionable insights that can help you identify new revenue opportunities and make strategic business decisions.
Key Questions Answered:
- How is the Global Through-hole Passive Components Market expected to evolve by 2030?
- What are the main drivers and restraints affecting the market?
- Which market segments will grow the most over the forecast period?
- How will market shares for different regions and segments change by 2030?
- Who are the leading players in the market, and what are their prospects?
Report Features:
- Comprehensive Market Data: Independent analysis of annual sales and market forecasts in US$ Million from 2024 to 2030.
- In-Depth Regional Analysis: Detailed insights into key markets, including the U.S., China, Japan, Canada, Europe, Asia-Pacific, Latin America, Middle East, and Africa.
- Company Profiles: Coverage of players such as American Technical Ceramics Corp., AVX Corporation (Kyocera AVX), Bourns, Inc., Cornell Dubilier Electronics, Inc., Eaton Corporation and more.
- Complimentary Updates: Receive free report updates for one year to keep you informed of the latest market developments.
Select Competitors (Total 48 Featured):
- American Technical Ceramics Corp.
- AVX Corporation (Kyocera AVX)
- Bourns, Inc.
- Cornell Dubilier Electronics, Inc.
- Eaton Corporation
- Fenghua Advanced Technology
- KEMET Corporation (Yageo Corporation)
- KOA Corporation
- Murata Manufacturing Co., Ltd.
- Nexperia
- Panasonic Corporation
- Rohm Semiconductor
- Schurter Holding AG
- Sumida Corporation
- TDK Corporation
- TE Connectivity Ltd.
- Vishay Intertechnology, Inc.
- Walsin Technology Corporation
- Würth Elektronik GmbH & Co. KG
- Yageo Corporation
- Yageo KEMET Corporation
- Yageo Pulse Electronics
Tariff Impact Analysis: Key Insights for 2025
Global tariff negotiations across 180+ countries are reshaping supply chains, costs, and competitiveness. This report reflects the latest developments as of April 2025 and incorporates forward-looking insights into the market outlook.The analysts continuously track trade developments worldwide, drawing insights from leading global economists and over 200 industry and policy institutions, including think tanks, trade organizations, and national economic advisory bodies. This intelligence is integrated into forecasting models to provide timely, data-driven analysis of emerging risks and opportunities.
What’s Included in This Edition:
- Tariff-adjusted market forecasts by region and segment
- Analysis of cost and supply chain implications by sourcing and trade exposure
- Strategic insights into geographic shifts
Buyers receive a free July 2025 update with:
- Finalized tariff impacts and new trade agreement effects
- Updated projections reflecting global sourcing and cost shifts
- Expanded country-specific coverage across the industry
Table of Contents
I. METHODOLOGYII. EXECUTIVE SUMMARY2. FOCUS ON SELECT PLAYERSIV. COMPETITION
1. MARKET OVERVIEW
3. MARKET TRENDS & DRIVERS
4. GLOBAL MARKET PERSPECTIVE
III. MARKET ANALYSIS
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- American Technical Ceramics Corp.
- AVX Corporation (Kyocera AVX)
- Bourns, Inc.
- Cornell Dubilier Electronics, Inc.
- Eaton Corporation
- Fenghua Advanced Technology
- KEMET Corporation (Yageo Corporation)
- KOA Corporation
- Murata Manufacturing Co., Ltd.
- Nexperia
- Panasonic Corporation
- Rohm Semiconductor
- Schurter Holding AG
- Sumida Corporation
- TDK Corporation
- TE Connectivity Ltd.
- Vishay Intertechnology, Inc.
- Walsin Technology Corporation
- Würth Elektronik GmbH & Co. KG
- Yageo Corporation
- Yageo KEMET Corporation
- Yageo Pulse Electronics
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 78 |
| Published | June 2025 |
| Forecast Period | 2024 - 2030 |
| Estimated Market Value ( USD | $ 44.5 Billion |
| Forecasted Market Value ( USD | $ 64 Billion |
| Compound Annual Growth Rate | 6.2% |
| Regions Covered | Global |
