Vapor Chamber Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, 2021-2031

The Global Vapor Chamber Market is projected to experience significant growth, expanding from USD 1.34 Billion in 2025 to USD 4.01 Billion by 2031 at a CAGR of 20.02%. Defined as planar thermal management devices, vapor chambers employ two-phase cooling within a vacuum-sealed enclosure containing a working fluid to distribute heat efficiently. This market expansion is primarily fueled by rising thermal loads in high-performance computing and the worldwide rollout of 5G infrastructure, both of which require advanced heat dissipation capabilities that surpass the performance limits of traditional solid metal heat spreaders or standard heat pipes.

However, raw material price volatility poses a major obstacle to consistent market growth by directly impacting manufacturing scalability. Data from IPC indicates that in 2024, 45 percent of electronics manufacturers faced increasing material costs. This financial instability creates a difficult environment for suppliers and hinders the widespread integration of these advanced cooling modules into cost-sensitive consumer electronic sectors.

Market Drivers

The surge in AI-driven chipsets requiring efficient heat dissipation acts as a primary catalyst for the Global Vapor Chamber Market. As high-performance computing (HPC) workloads increase to support generative artificial intelligence, next-generation processors are hitting thermal design power (TDP) levels that conventional heat sinks cannot adequately manage. This thermal density demands the superior planar heat spreading capabilities of vapor chambers to maintain operational stability in hyperscale data centers. Vertiv reported in April 2024 that order rates jumped by 60 percent year-over-year, a rise largely attributed to the accelerating demand for AI-related thermal management infrastructure.

Concurrently, the miniaturization of smartphones and consumer electronics, alongside rapid 5G network expansion, creates a need for powerful yet compact thermal solutions. Manufacturers are increasingly utilizing ultra-thin vapor chambers to manage the intense heat from 5G modems and high-speed processors without adding bulk to devices. For instance, Samsung Electronics noted in January 2024 that the Galaxy S24 Ultra features a vapor chamber 1.9 times larger than its predecessor to enhance temperature control. This trend aligns with the growing user base for high-speed connectivity, as Ericsson reported a global increase of 160 million 5G subscriptions in the first quarter of 2024, necessitating thermally efficient hardware.

Market Challenges

The volatility of raw material prices serves as a significant barrier to the growth of the Global Vapor Chamber Market. Since vapor chambers are primarily constructed from copper, a commodity prone to market fluctuations, unpredictable material costs make it difficult for manufacturers to stabilize production expenses and complicate long-term contract negotiations with OEMs. This financial uncertainty forces suppliers to either operate with thinner profit margins or raise unit prices, often rendering vapor chambers less commercially viable for mid-range or budget-friendly devices compared to cheaper alternatives like traditional heat pipes.

According to IPC, 59 percent of electronics manufacturers reported rising material costs in March 2025. This sharp increase in input expenses directly constrains the ability of producers to scale operations cost-effectively. Consequently, the high costs associated with material procurement slow the transition from standard thermal solutions to advanced vapor chambers in mass-market applications, thereby restricting the technology's penetration mostly to premium, high-margin sectors such as flagship smartphones and enterprise-grade servers.

Market Trends

The emergence of three-dimensional (3D) vapor chambers represents a crucial evolution designed to address the thermal limitations of air-cooled high-performance computing (HPC) and AI server infrastructure. With thermal design power (TDP) levels for next-generation AI accelerators rising rapidly, traditional planar vapor chambers are becoming insufficient for dissipating extreme heat flux within standard rack dimensions, prompting a shift to 3D architectures with vertical heat transport capabilities. This innovation extends the viability of air cooling and delays the costly transition to liquid cooling; notably, Auras Technology announced in May 2025 the development of a 3D Loop Vapor Chamber capable of dissipating 1,600 watts, a capacity previously achievable only via direct-to-chip liquid cooling.

Simultaneously, the push for sustained on-device generative AI processing is driving the widespread adoption of ultra-thin vapor chambers in slim consumer electronics. Major smartphone manufacturers are moving away from graphite sheets to integrate custom-engineered vapor chambers that handle the intensive workloads of 3nm chipsets without compromising device thinness. This hardware shift is essential for preventing thermal throttling during continuous AI tasks. For example, Apple revealed in September 2025 that the iPhone 17 Pro's newly designed vapor chamber cooling system enabled the device to deliver approximately 40 percent better sustained performance under heavy computational loads compared to the previous model.

Key Players Profiled in the Vapor Chamber Market

• Delta Electronics, Inc.
• Fujikura Ltd.
• Advanced Cooling Technologies, Inc.
• Celsia Inc.
• T-Global Technology (Europe & N. America) Ltd.
• Chaun-Choung Technology Corp.
• Jentech Precision Industrial Co., LTD.
• Jones Tech USA Inc.,
• Advanced Thermal Solutions, Inc.
• Murata Manufacturing Co., Ltd.

Report Scope

In this report, the Global Vapor Chamber Market has been segmented into the following categories:

Vapor Chamber Market, by Type:

• Ultra Thin Vapor Chamber
• Standard Vapor Chamber

Vapor Chamber Market, by Application:

• Phone
• Other Mobile Devices
• Laptop
• Gaming Consoles
• Data Centers
• LED Lights
• Others

Vapor Chamber Market, by Material:

• Copper
• Aluminum
• Others

Vapor Chamber Market, by Cooling:

• Active
• Passive

Vapor Chamber Market, by Price Range:

• Economy
• Mid-Range
• Premium

Vapor Chamber Market, by Distribution Channel:

• Online
• Offline

Vapor Chamber Market, by End-User:

• Individual Consumer
• Business Enterprise

Vapor Chamber Market, by Region:

• North America
• Europe
• Asia-Pacific
• South America
• Middle East & Africa

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Vapor Chamber Market.

Available Customization

The analyst offers customization according to your specific needs. The following customization options are available for the report:

• Detailed analysis and profiling of additional market players (up to five).

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